(19)
(11) EP 2 606 164 A1

(12)

(43) Date of publication:
26.06.2013 Bulletin 2013/26

(21) Application number: 11749145.6

(22) Date of filing: 12.08.2011
(51) International Patent Classification (IPC): 
C25D 3/58(2006.01)
C25D 3/60(2006.01)
(86) International application number:
PCT/EP2011/063923
(87) International publication number:
WO 2012/022689 (23.02.2012 Gazette 2012/08)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 17.08.2010 DE 102010034646

(71) Applicant: Umicore Galvanotechnik GmbH
73525 Schwäbisch Gmünd (DE)

(72) Inventors:
  • WEYHMUELLER, Bernd
    73553 Alfdorf Hintersteinenberg (DE)
  • BRONDER, Klaus
    73527 Schwaebisch Gmuend (DE)
  • MANZ, Uwe
    73563 Moegglingen (DE)
  • OBERST, Frank
    73529 Schwaebisch Gmuend (DE)
  • TOMAZZONI, Mario
    73525 Schwaebisch Gmuend (DE)
  • BERGER, Sascha
    73527 Schwaebisch Gmuend (DE)

(74) Representative: Retzow, Stefan 
Umicore AG & Co. KG Patente Rodenbacher Chaussee 4
63457 Hanau-Wolfgang
63457 Hanau-Wolfgang (DE)

   


(54) ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF COPPER-TIN ALLOY LAYERS