Small form factor microfused silicon strain gage (MSG) pressure sensor packaging

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EP 2 620 757 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	16.03.2016 Bulletin 2016/11

(88)	Date of publication A3:
	31.07.2013 Bulletin 2013/31

(43)	Date of publication:
	31.07.2013 Bulletin 2013/31

(21)	Application number: 13152494.4

(22)	Date of filing: 24.01.2013

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International Patent Classification (IPC):

G01L 19/14^(2006.01)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

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Priority:

27.01.2012 US 201261591466 P

(71)	Applicant: Sensata Technologies, Inc.
	Attleboro, MA 02703 (US)

(72)	Inventor:
	Petrarca, Neil S. Warwick, RI Rhode Island 02886 (US)

(74)	Representative: Legg, Cyrus James Grahame et al
	Abel & Imray 20 Red Lion Street London WC1R 4PQ London WC1R 4PQ (GB)

(54)	Small form factor microfused silicon strain gage (MSG) pressure sensor packaging

(57) A pressure sensor assembly (10) includes a base including a radially offset pressure port. An electronics package (24) may be included within a housing generally alongside the offset pressure port. Accordingly, the pressure sensor assembly exhibits a substantially smaller diameter than previously achieved. Methods of fabrication are provided.