(19)
(11) EP 2 629 322 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
14.11.2018 Bulletin 2018/46

(45) Mention of the grant of the patent:
03.10.2018 Bulletin 2018/40

(21) Application number: 13155575.7

(22) Date of filing: 18.02.2013
(51) International Patent Classification (IPC): 
H01L 21/304(2006.01)
H01L 29/66(2006.01)
 H01L 21/225(2006.01)

(54)

Power device manufacture on the recessed side of a thinned wafer

Leistungsvorrichtungsherstellung auf der vertieften Seite eines ausgedünnten Wafers

Fabrication de dispositif de puissance sur la face en retrait d'une plaquette amincie

(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 20.02.2012 US 201213400569

(43) Date of publication of application:
21.08.2013 Bulletin 2013/34

(73) Proprietor: IXYS, LLC
Milpitas CA 95035 (US)

(72) Inventors:
  • Wisotzki, Elmar
    64285 Darmstadt (DE)
  • Ingram, Peter
    69502 Hemsbach (DE)

(74) Representative: Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte - Partnerschaft mbB 
Patent- und Rechtsanwaltskanzlei Alois-Steinecker-Strasse 22
85354 Freising
85354 Freising (DE)


(56) References cited: : 
WO-A1-2010/140666
US-A1- 2009 102 020
 US-A1- 2008 090 391
US-A1- 2011 260 296
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).