(19)
(11) EP 2 637 868 A1

(12)

(43) Date of publication:
18.09.2013 Bulletin 2013/38

(21) Application number: 11839038.4

(22) Date of filing: 11.11.2011
(51) International Patent Classification (IPC): 
B32B 33/00(2006.01)
(86) International application number:
PCT/US2011/060440
(87) International publication number:
WO 2012/065107 (18.05.2012 Gazette 2012/20)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 12.11.2010 US 413087 P

(71) Applicant: Nanocomp Technologies, Inc.
Concord, NH 03301 (US)

(72) Inventors:
  • WHITE, Brian
    Manchester, New Hampshire 03109 (US)
  • LOMBARD, Craig
    Manchester, New Hampshire 03102 (US)
  • LASHMORE, David, S.
    Lebanon, New Hampshire 03766 (US)

(74) Representative: Harrison Goddard Foote LLP 
Belgrave Hall Belgrave Street
Leeds LS2 8DD
Leeds LS2 8DD (GB)

   


(54) SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS