(19)
(11) EP 2 662 504 A1

(12) EUROPEAN PATENT APPLICATION

(43) Date of publication:
13.11.2013 Bulletin 2013/46

(21) Application number: 12167362.8

(22) Date of filing: 09.05.2012
(51) International Patent Classification (IPC): 
E04B 9/00(2006.01)
E04B 9/28(2006.01)
E04B 9/24(2006.01)
E04B 9/04(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(71) Applicant: Saint-Gobain Ecophon AB
260 61 Hyllinge (SE)

(72) Inventor:
  • Wilkens, Jan
    263 39 Höganäs (SE)

(74) Representative: Åkesson, Sten Jan-Åke 
Awapatent AB Box 1066
251 10 Helsingborg
251 10 Helsingborg (SE)

   


(54) Ceiling tile for a non-planar suspended ceiling


(57) In accordance with the present inventive concept, there is provided a rectangular ceiling tile (100) for a non-planar suspended ceiling, wherein a groove arrangement (120, 130) is provided in a first (102) and a second (104) opposing side edge for installation of the ceiling tile (100) in a profile assembly (200) comprising supporting flanges (122, 132) arranged in a horizontal plane. The groove arrangements (120, 130) are arranged such that the ceiling tile (100) in an installed state is inclined with respect to the horizontal plane. Furthermore, the present inventive concept also relates to a non-planar suspended ceiling comprising a plurality of ceiling tiles (100). There is also provided a method to manufacture the ceiling tile (100).




Description

Field of the invention



[0001] The present invention relates to a ceiling tile for a non-planar suspended ceiling. More specifically, the present invention relates to an improved ceiling tile which may be mounted in a supporting structure comprised in a suspended ceiling.

Background art



[0002] There are various ways to alter and improve the aesthetical and physical characteristics, such as the sound absorbing properties, of a suspended ceiling which comprises a plurality of ceiling tiles. For example, this may be achieved by varying the design, material, or density of some or all of the ceiling tiles comprised in the suspended ceiling. In addition, the mutual positions of the ceiling tiles may be adjusted.

[0003] When altering the design of the ceiling tiles, light and sound reflections upon the ceiling tiles will also be altered. Hence, a person in a room comprising the suspended ceiling will perceive a varying light environment and an acoustical environment of the room dependent on its design.

[0004] One way to change the acoustical and light environment of a room is to utilize tilted ceiling panels which are mounted in a supporting structure. In US2935152A, there is disclosed a tapering acoustical unit which in a mounted state is tilted at an angle relative to a general plane of the surface covered by the mounting system of the acoustical structure. The acoustical units comprise a large number of components and consequently require many stages of manufacturing for its production.

[0005] In addition, in order to assemble the acoustical units disclosed in US2935152A, alternate pairs of locking lugs and keeper holes on their four side edges are used, thereby requiring several complicated steps for their installation.

Summary of the Invention



[0006] It is therefore an object of the present invention to provide an improved ceiling tile for a non-planar suspended ceiling which is simpler and more cost effective to manufacture.

[0007] Additionally, it is also an object of the present invention to provide a method to manufacture the improved ceiling tile for a non-planar suspended ceiling.

[0008] According to a first aspect of the invention, there is provided a rectangular ceiling tile for a non-planar suspended ceiling, wherein a groove arrangement is provided in a first and a second opposing side edge for installation of the ceiling tile in a profile assembly comprising supporting flanges arranged in a horizontal plane. The groove arrangements are arranged such that the ceiling tile in an installed state is inclined with respect to the horizontal plane.

[0009] In accordance with the inventive concept, a chunk of ceiling tile material may be provided with grooves at opposed side edges so that a rectangular ceiling tile resulting from the ceiling tile material may be arranged in the supporting flanges in an inclined manner. In particular, there is no need to taper off the ceiling tile material into a form resembling the acoustical unit as disclosed in US2935152A. Thereby, certain stages of manufacturing become redundant as compared with the acoustical unit in US2935152A.

[0010] Furthermore, by means of the inventive concept, the ceiling tile may extend into a space above the horizontal plane which may be essentially concealed from below the non-planar suspended ceiling in a mounted state. In this way, the inventive ceiling tile may be used for creating a non-planar suspended ceiling, while keeping the manufacturing steps of the ceiling tile small. To reiterate the assertion above, by keeping some parts of the ceiling tile that are concealed in a mounted state anyway, the manufacturing of the ceiling tile becomes simpler and more cost effective.

[0011] The inventive ceiling tile allows for an adjustable light environment of a room. First of all, the light environment is among other things dependent on the presence or absence of light sources in the room as well as on external light conditions. The perceived light environment in a room may be found to be improved if the ceiling tile is inclined in a specific direction with respect to some windows of the room, or alternatively, with respect to the lighting appliances of the room. The light environment may be further adjusted by selecting appropriate colours and finishings of one or several ceiling tiles.

[0012] Moreover, the inventive ceiling tile allows for an adjustable acoustical environment of the room. The ceiling tile may be adapted to absorb sound, in which case it is referred to as an acoustical ceiling tile. Alternatively, the ceiling tile may be adapted to reflect sound. Preferably, however, the ceiling tile is adapted to partly absorb sound and partly reflect sound.

[0013] The ceiling tiles may be arranged to diffusively scatter the sound. Thereby, low-frequency sound waves, which typically are hard to fully absorb by the ceiling tiles, may be more efficiently scattered and the sound environment of the room may be further improved. Incidentally, it is noted that high-frequency sound waves, i.e. sound waves having frequencies above 400 Hz or so, may be absorbed more efficiently by acoustical ceiling tiles than low-frequency sound waves.

[0014] In the case of reflective ceiling tiles, the sound waves in the room may be directed towards a preferred direction, e.g. by directing one or several ceiling tiles in certain patterns. For instance, improved speech clarity may be obtained in selected regions of a room. The acoustical environment may be further adjusted by selecting the materials of the ceiling tiles as well as by controlling their density.

[0015] In addition to changing the physical characteristics of a room, for example parameters related to its light and acoustical environment as described above, the inventive ceiling tile may also improve the ornamental design of a room. In particular, the ceiling tiles comprised in a suspended ceiling may be chosen in order to achieve a particular visual appearance of the room. For example, different sizes and colours of the ceiling tiles may be used in order to create a desired visual effect.

[0016] Another advantage of the present inventive concept is that an existing horizontal supporting structure, or equivalently a profile assembly, such as a grid of profiles, may be utilized in order to mount the inventive ceiling tile in a suspended ceiling. In particular, there is no need to exchange an existing horizontal supporting structure for a non-horizontal supporting structure in order to be able to mount the inventive ceiling tile.

[0017] A further advantage of the present inventive concept is that the inventive ceiling tile is easier to mount into the profile assembly. By means of the groove arrangement in the first and the second side edges, the ceiling tile may be directly mounted into the flanges of the profile assembly, without the need of an external locking device, such as spring arrangements or holddown clips. For similar reasons, the inventive ceiling tile is equally simple to demount from the profile assembly. Moreover, the groove arrangement may be such that an arbitrary ceiling tile comprised in the non-planar suspended ceiling may be demounted without demounting surrounding ceiling tiles.

[0018] Each groove arrangement comprises at least one groove. Each groove arrangement preferably extends throughout the entire first and second side edge, respectively, and is adapted to be inserted into the supporting flanges comprised in the profile assembly. The groove arrangement may comprise an engagement surface which is adapted to engage with the supporting flanges from above. Preferably, the engagement surface is parallel with a back surface of the ceiling tile. Alternatively, however, the engagement surface may be arranged at an angle with respect to the back surface of the ceiling tile.

[0019] A width of a groove arrangement is preferably substantially equal or larger than a width of a supporting flange into which the ceiling tile is to be installed.

[0020] The groove arrangement provided in the first and/or second side edges may admit a concealed mounting according to which the profile assembly is concealed. Alternatively, groove arrangement provided in the first and/or second side edges may admit an exposed mounting according to which the profile assembly is fully, or at least partly, exposed.

[0021] The profile assembly may comprise inverted T-profiles, or tees. Alternatively, the profile assembly may comprise at least one of an L-profile, an H-profile, an I-profile and a Z-profile. The profile assembly may be comprised out of a metallic material, such as steel or a sheet metal. Alternatively, the profile assembly may be comprised out of a light-weight material, for example a light metal such as aluminum.

[0022] The inventive ceiling tile is preferably comprised out of an elastically deformable and sound absorbing material. The ceiling tile may comprise compressed fibre material; the compressed fibre material may be mineral wool such as rock wool or, especially, glass wool.

[0023] According to one embodiment, the rectangular ceiling tile has an essentially uniform thickness. In one example, the ceiling tile has a planar back surface and a planar front surface, wherein the front surface and back surface are parallel. In another example, the ceiling tile has a curved back surface and a parallel curved front surface.

[0024] According to one embodiment, the groove arrangement in the first side edge comprises an engagement surface arranged at a distance D1 as measured in a thickness direction from a back surface of the ceiling tile and the groove arrangement in the second side edge comprises an engagement surface arranged at a distance D2 as measured in the thickness direction from the back surface of the ceiling tile, wherein the distance D1 is different from the distance D2.

[0025] The thickness direction may be a direction perpendicular to the back surface, or alternatively, the front surface. The distance D1 may be larger than the distance D2. Alternatively, D1 may be smaller than D2.

[0026] By means of the grooves being provided at different distances from the back surface, the inventive ceiling tile may be installed in an inclined, or tilted, manner with respect to the profile assembly. More precisely, since the supporting flanges of the profile assembly are provided in a common horizontal plane, the inventive ceiling tile will in a mounted state be inclined with respect to this horizontal plane, since the engagement surfaces in the grooves are provided at different distances from the back surface.

[0027] According to one embodiment, at least a part of the first and/or second side edge is undulating. By means of this embodiment, the ceiling tile may be provided with a distinctive character which may improve the visual appearance of the ceiling tile.

[0028] According to one embodiment, a corner section defined by a front surface of the ceiling tile and the first and/or second side edge is rounded or chamfered. The rounding or chamfering preferably has an extension corresponding to an extension of the first and/or second side edge. By means of this embodiment, the ceiling tile may be provided with a aesthetically pleasing character.

[0029] According to one embodiment, the rectangular ceiling tile further comprises a third and a fourth side edge, wherein at least a part of the third and fourth side edges is arranged to engage with the supporting flanges from below in an installed state of the ceiling tile. Thus, the ceiling tile may engage with the flanges from above as well as from below along the first and second pair of opposing side edges, respectively. The engagement may provide a clamping action, or frictional fit, between the supporting flanges and the third and fourth side edges. An advantage of this embodiment is that an upwards directed vertical displacement of the ceiling tile may be counteracted. Thereby, the ceiling tile is more efficiently prevented from involuntary displacements which may be induced by a wind uplift, impacts from objects, forces applied to the ceiling panel from below, e.g. during a cleaning process, a sudden change of air pressure in the room when a door connected to the room is abruptly opened or closed, etc.

[0030] According to one embodiment, the groove arrangement provided in the first and/or second side edges is arranged to counteract a lateral displacement of the ceiling tile with respect to the horizontal plane. The displacement is preferably prevented in one lateral direction, and more preferably in two lateral directions. In one example, the lateral displacement is prevented by means of a clamping action between the supporting flanges and the third and fourth side edges, the ceiling tile thereby being restrained by friction. In another example, grooves in the first side edge and grooves in the second side edge are formed so that in a mounted state of the ceiling tile, the supporting flange is completely inserted into the grooves so that no gap is formed between the tips of the respective flanges and end portions of the grooves.

[0031] The engagement surface of the groove arrangement may be provided with a stepped profile, thereby comprising an engagement surface for installation of the ceiling tile and an engagement surface for a mounted state of the ceiling tile. This holds for the groove arrangements provided in the first and/or the second side edge. The engagement surface for installation may be arranged closer to the front surface of the ceiling tile than the engagement surface for a mounted state. An advantage of having the stepped profile is that the installation process may be simplified. More specifically, when displacing the ceiling tile during an installation process, wherein the ceiling tile engages with a first flange by means of the engagement surface for installation, towards a second flange, the ceiling tile may after a given distance click down so that it engages with the flanges by means of the engagement surface for a mounted state. As a result of the ceiling tile clicking down, whereby e.g. the ceiling tile clicks into a proper position, a worker mounting the ceiling tile may obtain a confirmation that the ceiling tile is located in or close to a proper mounting position.

[0032] According to a second aspect of the invention, there is provided a non-planar suspended ceiling comprising a plurality of ceiling tiles according to the above. The details and advantages of the second aspect of the invention are largely analogous to those of the first aspect of the invention, wherein reference is made to the above. In addition, it is noted that in preferred embodiments, the inclinations of the ceiling tiles comprised in the non-planar suspended ceiling are arranged so that a pattern is formed. Alternatively, however, the inclinations of the ceiling tiles may be arbitrary. Moreover, it is noted that a suspended ceiling having a profile in the form of a triangle wave, as seen from a side view, may be provided if the front surfaces of the ceiling tiles are planar. By a triangle wave form is meant a form having a piecewise, linear profile. The triangle wave may be periodic. Alternatively, the triangle wave may be aperiodic.

[0033] According to one embodiment, the plurality of ceiling tiles comprises ceiling tiles having at least two different sizes. By means of this embodiment, the non-planar suspended ceiling may be provided with a distinctive character which may improve its visual appearance.

[0034] According to one embodiment, pairs of adjacent ceiling tiles comprised in the plurality of ceiling tiles have a uniform inclination with respect to the horizontal plane so that at least a part of the first or second side edges is exposed. Accordingly, a sawtooth-shaped suspended ceiling may be provided wherein the front surfaces and side edges of adjacent ceiling tiles form a profile in the form of a sawtooth, as seen from a side view of the non-planar supended ceiling. The side edges may be perpendicular to the horizontal plane. Alternatively, the side edges may form an angle with a normal direction of the horizontal plane. An advantage of this embodiment is that light may be directed in a preferred direction. In addition, sound may be more efficiently scattered, which may improve the sound environment of the room.

[0035] The exposed part of at least one of the side edges may be provided with auxiliary equipment. According to one embodiment, at least one of the exposed first or second side edges of the ceiling tiles is provided with auxiliary equipment chosen from the group consisting of a metal strip, a LED light assembly, a décor, a sensor array or a speaker arrangement. Thereby, the auxiliary equipment may be integrated with the ceiling tiles in an improved manner. For example, instead of providing a LED light assembly, a sensor array or a speaker arrangement in the center of the ceiling tiles, they may be provided in the side edge so that a larger portion of the ceiling tiles may be utilized for improving the physical characteristics of a room, such as the sound environment and the light environment. With regards to the sound environment, a larger area of sound absorbing material may be provided.

[0036] The LED light assembly may comprise one or several LED-lamps. The décor may be a plastic strip, a surface finishing, etc. The sensor array may comprise a fire detector, a smoke detector, a motion detector, a sprinkler installation, etc.

[0037] According to one embodiment, pairs of adjacent ceiling tiles comprised in the plurality of ceiling tiles have an opposed inclination with respect to the horizontal plane. Accordingly, a suspended ceiling with a side-view profile taking the form of juxtaposed triangles, each triangle having two sides of equal lengths, may be provided. The side edges of the ceiling tiles may be concealed in a mounted state.

[0038] According to one embodiment, the plurality of ceiling tiles comprises a pair of adjacent ceiling tiles forming a gap between each other. In one example, the gap is formed by providing a stepped profile in the third and fourth side edge, respectively, of the adjacent ceiling tiles so that a minimal distance between the third and fourth side edges on the front surface of the ceiling tile is smaller than a minimal distance between the third and fourth side edges on the back surface of the ceiling tile. Optionally, certain parts of the third and fourth side edges of the respective adjacent ceiling tiles may engage with each other. In another example, the adjacent ceiling tiles are arranged at a lateral distance from each other so that a gap is formed between them. Thereby, parts of the underside of the profile assembly may be exposed.

[0039] According to one embodiment, the plurality of ceiling tiles comprises a first ceiling tile and a second ceiling tile which is adjacent to the first ceiling tile, the first side edge of the first ceiling tile engaging with the second side edge of the second ceiling tile. Consequently, the profile assembly engaging with the first and second ceiling tiles may be concealed.

[0040] According to a third aspect of the invention, there is provided a method to manufacture a rectangular ceiling tile for a non-planar suspended ceiling. The method comprises: providing ceiling tile material; arranging the ceiling tile material on a receiving surface; forming a groove arrangement in a first side edge of the ceiling tile material at a first distance from the receiving surface by means of a relative displacement of a groove-forming station and the ceiling tile material; forming a groove arrangement in a second side edge of the ceiling tile material, which is opposed to the first side edge, at a second distance from the receiving surface by means of a relative displacement of the groove-forming station and the ceiling tile material; and partitioning the ceiling tile material into the rectangular ceiling tile.

[0041] The details and advantages of the third aspect of the invention are largely analogous to those of the first and second aspect of the invention, wherein reference is made to the above.

[0042] It is noted that the steps of the manufacturing method does not have to be performed in the exact order disclosed above. For example, the partitioning of the ceiling tile material may be performed before, simultaneously, or after the groove arrangements in the first and second side edges are formed.

[0043] Generally, all terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to "a/an/the [element, device, component, means, step, etc]" are to be interpreted openly as referring to at least one instance of said element, device, component, means, step, etc., unless explicitly stated otherwise.

Brief Description of the Drawings



[0044] The above, as well as additional objects, features and advantages of the present invention, will be better understood through the following illustrative and non-limiting detailed description of preferred embodiments of the present invention, with reference to the appended drawings, where the same reference numerals will be used for similar elements, wherein:

Fig. 1 is a perspective view illustrating two side edges and a back surface of an embodiment of the inventive ceiling tile.

Fig. 2 is a perspective view schematically illustrating an embodiment of the inventive non-planar suspended ceiling comprising a plurality of ceiling tiles and a profile assembly.

Fig. 3a is a cross-sectional side view of one of the ceiling tiles in Fig. 2 as mounted into a profile assembly, as seen from the perspective A-A in Fig. 1.

Fig. 3b is a cross-sectional side view of one of the ceiling tiles in Fig. 2 as mounted into a profile assembly, as seen from the perspective B-B in Fig. 1.

Fig. 4 is a perspective view illustrating a close-up region of two adjacent ceiling tiles in Fig. 2 as mounted into an inverted T-profile.

Fig. 5a-b schematically illustrate two embodiments of groove arrangements which may be provided in the first and second side edge.

Fig. 5c-d schematically illustrate embodiments of groove arrangements which may be provided in the third and fourth side edge.

Fig. 6a-c schematically illustrate three embodiments of some side projections of the inventive suspended ceiling.

Fig. 7 is a side view illustrating a device for manufacturing of the inventive ceiling tile according to one embodiment.


Detailed Description of Preferred Embodiments



[0045] Next, an embodiment of the inventive ceiling tile will be described with reference to Fig. 1 which illustrates a perspective view of two side edges and a back surface of a ceiling tile 100. The rectangular ceiling tile 100 comprises a first and a second pair of opposed side edges. The first pair comprises a first 102 and a second 104 side edge while the second pair comprises a third 106 and a fourth 108 side edge. Moreover, the ceiling tile 100 comprises a planar back surface 110 and a planar front surface 112. The ceiling tile 100 has a uniform thickness so that the back 110 and front 112 surfaces are parallel.

[0046] A groove arrangement 120 in the form of a step is provided along the entire first side edge 102. The step 120 is defined by the first side edge 102 and the front surface 112 and comprises an engagement surface 122 and a wall portion 124. The engagement surface 122 is adapted to engage with a profile assembly which the ceiling tile 100 is supposed to be installed in. The engagement surface 122 extends along the entire first side edge 102.

[0047] Moreover, there is a groove arrangement 130 in the form of a groove provided in the second side edge 104. The groove 130 extends along the entire second side edge 104 and comprises an engagement surface 132 and a lower surface 134. The engagement surface 132 is adapted to engage with the profile assembly in a mounted state of the ceiling tile 100. An extension of an upper lip 136 of the groove 130 in a direction normal to the planar portion of the second side edge is smaller than an extension of a lower lip 138 of the groove 130.

[0048] As indicated in Fig. 1, the engagement surface 122 is arranged at a distance D1 from the back surface 110 of the ceiling tile 100 while the engagement surface 132 is arranged at a distance D2 from the back surface 110, wherein the distance D2 is smaller than the distance D1. For example, the distance D1 and D2 may be equal to 30 mm and 10 mm, respectively, but it is understood that other distances are equally conceivable.

[0049] The third 106 and fourth 108 side edges are provided with stepped profiles 114. Thereby, the distance between the top portions 115 of the third 106 and fourth 108 side edges, i.e. close to the back surface 110, is greater than the distance between the lower portions of the third 106 and fourth 108 side edges, i.e. close to the front surface 112.

[0050] A corner section 140 defined by the front surface 112 and the second side edge 104 of the ceiling tile 100 is provided at right angles.

[0051] In a non-limiting example the ceiling tile 100 has lateral dimensions 600 mm x 1200 mm. In other examples the ceiling tile may have lateral dimensions 600 mm x 300 mm, 200 mm x 300 cm and 600 mm x 600 mm. The ceiling tile 100 has a thickness 40 mm, but other thicknesses are equally conceivable.

[0052] Fig. 2 is a schematic perspective view illustrating an embodiment of the inventive non-planar suspended ceiling 300 comprising a plurality of ceiling tiles 100 and a profile assembly 200, as seen obliquely from below. The suspended ceiling 300 is adapted to be mounted underneath a main ceiling of a room or another accommodation, thereby forming a two-dimensional visible ceiling surface as seen from below. More specifically, the visible two-dimensional surface is a non-planar surface forming the boundary of a three-dimensional structure formed by the ceiling tiles 100.

[0053] The profile assembly 200 is a supporting structure for the ceiling tiles 100 and comprises inverted T-profiles 200 in the form of main runners which are arranged in parallel at constant distances from each other. The profile assembly 200 is adapted to support ceiling tiles 100 of a rectangular shape.

[0054] The upper sides of the supporting flanges of the T-profiles are arranged in a planar two-dimensional horizontal plane H. Each of the front surfaces 112 of the ceiling tiles 100 form an angle with the horizontal plane H so that the suspended ceiling 300 obtains a sawtooth-shaped form as seen from below. It is understood that the embodiment in Fig. 2 only shows a section of a suspended ceiling and that more T-profiles 200 and ceiling tiles 100 may be arranged in the horizontal plane H in order to obtain a suspended ceiling with a larger area.

[0055] In Fig. 2, the angle between the front surface of each of the ceiling tiles and the horizontal plane H is 2°. However, other angles are equally conceivable; for example, the angles may be between 1° and 20°. Furthermore, the angle between the front surface of the ceiling tile and the horizontal plane H comprised in the suspended ceiling may vary between the ceiling tiles.

[0056] As seen in Fig. 2, the second side edges 104 of the ceiling tiles 100 are exposed from below.

[0057] Preferably, the profile assembly 200 further comprises a cross spacer (not shown) extending across the main runners. The cross spacer extends over at least two main runners in order to fix a relative lateral position between the main runners so that the ceiling tiles 100 provided between the main runners are prevented from being displaced and possibly falling down. The cross spacer is provided with a plurality of slots into which the main runners are adapted to be inserted. The cross spacer has a generally channel-shaped form and has a substantially U-shaped or V-shaped cross section. The slots of the cross spacer are straight cut-outs extending from the bottom of the channel-shaped cross spacer to a given height. The width of the slots is chosen such that the top portion of the main runners fits closely into the respective slots.

[0058] The cross spacer may be arranged at a distance from the horizontal plane H by arranging an adapter between the main runners and the cross spacer. The adapter may be needed in order to be able to fit in the inclined ceiling tile 100 between the cross spacer and the main runners.

[0059] Optionally, the profile assembly may further comprise inverted T-profiles in the form of cross runners 210 extending perpendicularly to the main runners 200 and being connected to the same at a discrete set of locations. Thereby, a grid of profiles may be provided.

[0060] Optionally, the profile assembly may further comprise wall runners as is well-known to a person skilled in the art.

[0061] With reference to Fig. 3a-b, one of the ceiling tiles 100 in Fig. 2 will be described as mounted into an assembly of inverted T-profiles 200. More specifically, Fig. 3a and Fig. 3b are cross-sectional side views of a ceiling tile 100 in Fig. 1 along the lines A-A and B-B, respectively, as mounted into a profile assembly 200.

[0062] In Fig. 3a, a first and a second T-profile 200 is shown. Due to the cross spacer as described above, the T-profiles 200 are kept at a constant lateral distance from each other. The upper sides of the supporting flanges 202 and 212 of the first and a second T-profile, respectively, are arranged in a horizontal plane H which is indicated in Figs. 3a-b by a broken line.

[0063] As seen from the A-A perspective, the lower right corner of the ceiling tile 100 in Fig. 3a will in a mounted state be arranged at a larger distance from the horizontal plane H than the top left corner of the ceiling tile 100. More specifically, since the engagement surface 122 and the engagement surface 132, which in a mounted state engage with the upper sides of the flanges 202 and 212, respectively, are arranged at a distance D1 and D2 from the back surface 110, respectively, the ceiling tile 100 is arranged in an inclined manner, since D1>D2.

[0064] From the B-B perspective, the ceiling tile 100 is unsupported from below, i.e. along the third 106 and fourth 108 side edges. However, the third 106 and fourth 108 side edge may engage with the fourth 108 and the third 106 side edge of an adjacent ceiling tile 100, respectively, at least along some parts. By means of the stepped profiles 114 provided in the third 106 and fourth 108 side edges, there is gap 116 arranged between adjacent ceiling tiles 100, see Fig. 2. The gap 116 has an extension in a direction perpendicular to the longitudinal direction of the T-profiles 200. Note that the top portion 115 of the step 114 may engage with an adjacent ceiling tile 100.

[0065] In Fig. 3b, the horizontal plane H coincides with the horizontal portion of the step 114 which is parallel to the front surface 110. However, when viewed from a different perspective than B-B, but closer or farther away from, say, the first side edge 102, the horizontal plane H and the horizontal portion of the step 114 may be displaced from each other.

[0066] In Fig. 4, a close-up region of two adjacent ceiling tiles 100 in Fig. 2 as mounted into an inverted T-profile is illustrated.

[0067] Note however that, as opposed to the ceiling tile 100 in Fig. 2, in the embodiment according to Fig. 4, the corner section 140 of the rightmost ceiling tile 100 in Fig. 4, defined by the front surface 112 and the second side edge 104, is rounded.

[0068] Fig. 5a-b schematically illustrate two alternative embodiments of groove arrangements which may be provided in the first 102 and second 104 side edge. Moreover, Fig. 5c-d schematically illustrate alternative embodiments of groove arrangements which may be provided in the third 106 and fourth 108 side edge.

[0069] In the cross-sectional side view illustrated in Fig. 5a, the ceiling tile 100 comprises groove arrangements 120 and 130 in the form of steps on the first 102 and the second 104 side edge, respectively. The cross-section corresponds to the lines A-A in Fig. 1, but for a ceiling tile 100 having different groove arrangments. The flanges of the left and right T-profiles 200 engage with the engagement surfaces 122 and 132, respectively.

[0070] In the cross-sectional side view illustrated in Fig. 5b, the ceiling tile 100 comprises a groove arrangement 120 in the first side edge 102 in the form of a groove having a stepped profile. Also here, the cross-section corresponds to the lines A-A in Fig. 1, but for a ceiling tile 100 having different groove arrangements. The stepped profile comprises an engagement surface 122 for a mounted state of the ceiling tile 100 and an engagement surface 123 for installation of the ceiling tile 100. The engagement surface 123 may be utilized as a confirmation during an installation process that the ceiling tile 100 is located in or close to a proper mounting position.

[0071] Moreover, on the second 104 side edge of the ceiling tile 100 in Fig. 5b, there is a groove arrangement 130 in the form of a groove comprising an engagement surface 132. In a mounted state, the flanges of the left and right T-profiles 200 engage with the engagement surfaces 122 and 132, respectively.

[0072] Note that according to an alternative embodiment, a width of the groove arrangement 120 may be larger than a width of a lower lip 133 on the second side edge 104. Hence, the lower lip 133 of a ceiling tile 100 of this type may be inserted into the groove arrangement 120 of an adjacent ceiling tile of the same type in a mounting process. Thereby, the adjacent ceiling tiles 100 may be installed so that no gap is formed between them, provided that the extensions of the lower lips 125 and 133 comprised in the first 102 and second 104 side edges, respectively, are adapted properly. According to yet another embodiment, however, the width of the lower lip 133 and the width of the groove arrangement 120 may be substantially equal so that the lower lip 133 has to be forced into the groove arrangement 120.

[0073] In the embodiments illustrated in Fig. 5c-d, the profile assembly further comprises cross runners 210 which are arranged perpendicularly to the main runners 200, thereby forming a grid of profiles. The cross runners 210 comprise inverted T-profiles which are arranged in parallel. Hence, in a mounted state the ceiling tile 100 may engage with the main runners 200 as well as the cross runners 210.

[0074] According to the embodiment illustrated in the cross-sectional side view in Fig. 5c, the ceiling tile 100 comprises alternative stepped profiles 114 arranged in the third 106 and fourth 108 side edges. The cross-section corresponds to the lines B-B in Fig. 1, but for a ceiling tile 100 having different stepped profiles 114. In a mounted state, lower surfaces 126 and 128 of the stepped profiles 114 on the third 106 and the fourth 108 side edge, respectively, engage with flanges of the T-profiles 210 from below. Consequently, according to this embodiment lateral as well as vertical displacements of the ceiling tile 100 may be counteracted.

[0075] According to one embodiment, the thickness of the shoulder 142 of the stepped profiles 114 arranged on the third 106 and fourth 108 side edges is constant throughout the entire third 106 and fourth 108 side edges. In other words, the cross-section of the ceiling tile 100 is as illustrated in Fig. 5c throughout the entire region between the first and second side edge. Optionally, however, the thickness of the shoulder 142 of the stepped profiles 114 may vary along the third 106 and fourth 108 side edges, i.e. along a direction from the first to the second side edge. As a consequence, the third 106 and the fourth 108 side edge engage with the flanges of the T-profiles 210 only along parts of the third 106 and fourth 108 side edges. In one example, the thickness is constantly increasing along the third 106 and fourth 108 side edges. In another example, the thickness is piecewise constant along the third 106 and fourth 108 side edges.

[0076] Fig. 6a-c schematically illustrate three embodiments of some side projections of the inventive non-planar suspended ceiling. Note that the profile assembly is not shown in Fig. 6a-c.

[0077] Fig. 6a illustrates side projections of a sawtooth-shaped suspended ceiling 300 wherein each ceiling tile 100 is arranged at an angle α with respect to the horizontal plane H. The first side edges 102 of the ceiling tiles 100 are concealed. The second side edges 104 of the ceiling tiles 100 are exposed and are formed at right angles with respect to the front sides 112 of the ceiling tiles 100. The second side edges 104 are parallel with each other. Fig. 6b illustrates side projections of a sawtooth-shaped suspended ceiling 300 wherein each ceiling tile 100 is arranged at an angle β with respect to the horizontal plane H. The first side edges 102 of the ceiling tiles 100 are concealed. The second side edges 104 of the ceiling tiles 100 are exposed and are arranged perpendicularly to the horizontal plane H. The second side edges 104 are parallel with each other.

[0078] Fig. 6c illustrates side projections of a suspended ceiling 300 having a profile in the form of a triangle wave wherein the ceiling tiles 100 have an opposed inclination with respect to the horizontal plane H. More specifically, the adjacent ceiling tiles 100 are arranged at angles γ and -γ, respectively, with respect to the horizontal plane H. The first 102 as well as the second 104 side edges of the ceiling tiles 100 are concealed.

[0079] Next, a method to manufacture a rectangular ceiling tile 100 according to the above will be described with reference to Fig. 7.

[0080] In Fig. 7 there is illustrated a side view of a device 400 for manufacturing of the inventive ceiling tile 100 according to one embodiment. It is understood that the objects in Fig. 7 also have extensions in a third direction, i.e. in a direction perpendicular to a plane of the drawing in Fig. 7.

[0081] The device 400 is arranged to receive a ceiling tile material 500 at a feeding station 412. Moreover, the device 400 comprises a receiving surface 410 which is arranged for reception and transportation of the ceiling tile material 500, thereby forming a transport path and a transport direction R for the ceiling tile material 500 between the feeding station 412 and an output station 414 located downstream of the feeding station 412. The transport direction is indicated by an R in Fig. 7. In the present embodiment, the receiving surface 410 is constituted out of a transport conveyor belt and the ceiling tile material 500 is kept in contact with the receiving surface 410 throughout its transport from the feeding station 412 to the output station 414 by means of the gravitational force, whose direction is indicated by a G in Fig. 7. Alternatively, the ceiling tile material 500 may be kept in contact with the receiving surface 410 by means of a holding device. The device 400 further comprises a groove-forming station 420 which is arranged to provide one or several grooves 510in the ceiling tile material 500. Since the receiving surface 410 is movable and the groove-forming station 420 fixedly mounted, the ceiling tile material 500 may be displaced relatively to the groove-forming station 420. The groove-forming station 420 comprises a circular cutting device which partly extends into the transport path for forming the groove 510 in the ceiling tile material 500 which passes by the groove-forming station 420. A partitioning device 440 is located before the output station 414 in the transport direction R, downstream of the groove-forming station 420. The partitioning device 440 is arranged to partition the ceiling tile material 500 into predetermined sizes according to well-known methods for a person skilled in the art; for example, the ceiling tile material 500 may be partitioned intermittently or continuously. Note that only a part of the partitioning device 440 is shown in Fig. 7. According to the present embodiment, the partitioning device 440 comprises a cutting device 442. Lastly, the output station 414 is arranged downstream of the partitioning device 440.Next, the manufacturing method of the ceiling tile 100 according to the present embodiment will be described. First, a ceiling tile material 500 of a given thickness and width is feeded into the device 400 at the feeding station 412 and placed on the receiving surface 410. More specifically, a surface corresponding to a back surface of the ceiling tile 100 to be produced is placed on the receiving surface 410. According to the present embodiment, the ceiling tile material 500 is cut into an appropriate width and thickness before it is fed into the device 400. The ceiling tile material 500 is feeded towards the output station 414 along the transport path in the transport direction R.

[0082] The ceiling tile material 500 passes by the groove-forming station 420 which is located on a right side of the ceiling tile material 500 in the transport direction. The groove-forming station 420 arranges a groove 510 in the ceiling tile material 500 in a second side edge 504 (the first side edge is not shown in Fig. 7) by means of the circular cutting devices as explained above. The groove 510 is arranged at a distance D2 from the receiving surface 410, and hence also from the back surface, as indicated in Fig. 7. Moreover, a groove may be provided in the first side edge (not shown) of the ceiling tile material 500 on an opposite side of the second side edge 504. The groove in the first side edge is preferably provided at a distance D2 from the receiveing surface 410, and hence from the back surface, where D2 is different from D1. In one example, the ceiling tile material 500 may be rotated 180° around an axis extending in a normal direction with respect to the back surface and may then placed on the receiving surface 410, whereby the groove-forming station 420 may provide the groove also in the first side edge. In another example, an additional groove-forming station, e.g. placed on a left side of the ceiling tile material 500 in the transport direction, may provide the groove in the first side edge.

[0083] Lastly, the ceiling tile material 500 is partitioned into ceiling tiles 100 at the partitioning device 440 which thereafter are transported along the transport path to the output station 414. In Fig. 7 the ceiling tile material 500 comprises a groove 510 along a part of its side edge 504 while the ceiling tile 100, which has passed the groove-forming station 420 completely, comprises a groove 130 along its entire side edge 104. After the output station 414, the ceiling tiles 100 may be further processed. For example, they may be provided with rounded edges, chamferings, colouring, auxiliary equipment in the form of a metal strip, a LED light assembly, a décor, a sensor array or a speaker arrangement, a lighting device in the interior of the ceiling tile 100, undulations in the some of the side edges, etc.

[0084] The invention has mainly been described above with reference to a few embodiments. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of the invention, as defined by the appended patent claims.


Claims

1. A rectangular ceiling tile (100) for a non-planar suspended ceiling (300), wherein a groove arrangement (120, 130) is provided in a first (102) and a second (104) opposing side edge for installation of the ceiling tile (100) in a profile assembly (200) comprising supporting flanges (202, 212) arranged in a horizontal plane, the groove arrangements (120, 130) being arranged such that the ceiling tile (100) in an installed state is inclined with respect to said horizontal plane.
 
2. A rectangular ceiling tile according to claim 1, wherein said ceiling tile (100) has an essentially uniform thickness.
 
3. A rectangular ceiling tile according to claim 1 or 2, wherein the groove arrangement (120) in the first side edge (102) comprises an engagement surface (122) arranged at a distance D1 as measured in a thickness direction from a back surface (110) of the ceiling tile and wherein the groove arrangement (130) in the second side edge (104) comprises an engagement surface (132) arranged at a distance D2 as measured in said thickness direction from the back surface (110) of the ceiling tile (100), wherein the distance D1 is different from the distance D2.
 
4. A rectangular ceiling tile according to any of the preceding claims, wherein at least a part of said first (102) and/or second (104) side edge is undulating.
 
5. A rectangular ceiling tile according to any of the preceding claims, wherein a corner section (140) defined by a front surface (112) of the ceiling tile (100) and the first (102) and/or second (104) side edge is rounded or chamfered.
 
6. A rectangular ceiling tile according to any of the preceding claims, further comprising a third (106) and a fourth (108) side edge, wherein at least a part of said third (106) and fourth (108) side edges is arranged to engage with said supporting flanges (202, 212) from below in an installed state of the ceiling tile (100).
 
7. A rectangular ceiling tile according to any of the preceding claims, wherein the groove arrangement (120, 130) provided in the first (102) and/or second (104) side edges is arranged to counteract a lateral displacement of the ceiling tile (100) with respect to the horizontal plane.
 
8. A non-planar suspended ceiling comprising a plurality of ceiling tiles (100) as claimed in any one of claims 1-7.
 
9. A non-planar suspended ceiling according to claim 8, wherein said plurality of ceiling tiles comprises ceiling tiles (100) having at least two different sizes.
 
10. A non-planar suspended ceiling according to claim 8 or 9, wherein pairs of adjacent ceiling tiles (100) comprised in said plurality of ceiling tiles have a uniform inclination with respect to said horizontal plane so that at least a part of said first (102) or second (104) side edges is exposed.
 
11. A non-planar suspended ceiling according to claim 10, wherein at least one of the exposed first (102) or second (104) side edges of the ceiling tiles (100) is provided with auxiliary equipment chosen from the group consisting of a metal strip, a LED light assembly, a décor, a sensor array or a speaker arrangement.
 
12. A non-planar suspended ceiling according to claim 8 or 9, wherein pairs of adjacent ceiling tiles (100) comprised in said plurality of ceiling tiles have an opposed inclination with respect to said horizontal plane.
 
13. A non-planar suspended ceiling according to any of claims 8-12, wherein said plurality of ceiling tiles comprises a pair of adjacent ceiling tiles (100) forming a gap between each other.
 
14. A non-planar suspended ceiling according to any of claims 8-12, wherein said plurality of ceiling tiles comprises a first ceiling tile (100) and a second ceiling tile (100) which is adjacent to the first ceiling tile, the first side edge (102) of said first ceiling tile (100) engaging with the second side edge (104) of said second ceiling tile (100).
 
15. A method to manufacture a rectangular ceiling tile (100) for a non-planar suspended ceiling (300), comprising:

- providing ceiling tile material (500);

- arranging said ceiling tile material (500) on a receiving surface (410);

- forming a groove arrangement in a first side edge of said ceiling tile material (500) at a first distance from said receiving surface (410) by means of a relative displacement of a groove-forming station (420) and said ceiling tile material (500);

- forming a groove arrangement (510) in a second side edge (504) of said ceiling tile material (500), which is opposed to the first side edge, at a second distance from said receiving surface (410) by means of a relative displacement of said groove-forming station (420) and said ceiling tile material (500); and

- partitioning said ceiling tile material (500) into said rectangular ceiling tile (100).


 




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Cited references

REFERENCES CITED IN THE DESCRIPTION



This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

Patent documents cited in the description