Technical Field
[0001] This invention relates to a molybdenum material.
Background Art
[0002] There are cases where a molybdenum material is used at a portion which becomes high
in temperature and thus requires a heat-resistant material such as a high-temperature
structural or component material. However, in the case of a pure molybdenum material
in which a specific element is not intentionally added to the material, if it is used
at about 1000°C or more, it is recrystallized into an equiaxed grain structure. If
the equiaxed grain structure is formed, grain boundary sliding tends to occur so that
creep resistance decreases. As a result, deformation tends to occur.
[0003] Therefore, when the molybdenum material is used at a high temperature of 1000°C or
more, it is necessary to improve the creep resistance at high temperature.
[0004] As a method for improving the creep resistance of the molybdenum material at high
temperature, there is known either a method for raising the recrystallization temperature
above the use temperature or a method for achieving a structure which is excellent
in creep resistance even after recrystallization.
[0005] Of these, as the method for raising the recrystallization temperature, there is known,
as described in Non-Patent Document 1, a method for raising the primary recrystallization
temperature by the use of a TZM alloy (molybdenum alloy containing titanium, zirconium,
and carbon) (Non-Patent Document 1). However, while the recrystallization temperature
of the TZM alloy is about 1400°C and thus is higher than that of the pure molybdenum
material, the TZM alloy forms an equiaxed grain structure after recrystallization
and thus is easily deformed like the pure molybdenum material at the recrystallization
temperature or higher.
[0006] As the method for achieving a material which is excellent in creep resistance even
after recrystallization, there is known a combination of Al, Si, and K as described
in Non-Patent Document 2 or, as described in Non-Patent Document 3, a method of applying
high-rate plastic working to a molybdenum sintered body added with a rare earth oxide
such as La
2O
3 so that the structure after recrystallization becomes a laminated structure of elongated
coarse grains which are elongated in a working direction (Non-Patent Documents 2 and
3). However, the additive and the structure control for the property improvement may
cause the occurrence of cracks in the plastic working, such as forging or rolling,
of the molybdenum material to adversely affect the product yield and may further cause
anisotropy in bending properties or the like due to structural anisotropy, and therefore,
the size of the molybdenum material should be limited. Further, if, as in the case
of a firing floor plate, the molybdenum material is used in contact with a firing
workpiece or the like made of other elements, the firing workpiece or the like in
contact with the molybdenum material and the additive in the molybdenum material may
react with each other and therefore there is a possibility that the kind of firing
workpiece may be limited.
[0007] On the other hand, as a method for improving the creep resistance using a pure molybdenum
material excellent in plastic workability, there is a method of using enlargement
of crystal grains due to secondary recrystallization. This is because if the crystal
grains are enlarged, grain boundaries are reduced in number so that grain boundary
sliding is difficult to occur. As a striking example, a single crystal material can
be given.
[0008] Herein, the secondary recrystallization will be explained. For example, in the case
of a molybdenum material, a phenomenon that a fibrous structure formed by plastic
working such as rolling is newly changed into a crystal grain of about 20 to 30µm
by a heat treatment at 1000°C to 1100°C using as a nucleus a strain generated by the
plastic working is called primary recrystallization or simply recrystallization while
a phenomenon that a material comprising primary recrystallized grains is heat-treated
at a higher temperature so that the adjacent primary recrystallized grains repeat
combination and growth to be changed into a giant crystal grain is called secondary
recrystallization (Non-Patent Document 4).
[0009] More specifically, primary recrystallized grains of about several ten µm are gradually
enlarged to several ten µm to several hundred µm while being supplied with thermal
energy and, when, for example, they reach a certain temperature or they are heated
at a certain temperature for a long time, they rapidly grow into a crystal grain on
the order of mm or more. This rapid grain enlargement phenomenon is called secondary
recrystallization.
[0010] In view of this, in Patent Document 1, a molybdenum plate member with a purity of
99.9% or more containing substantially no additives is subjected to a grain control
treatment for 0.5 to 5 hours in a hydrogen flow at 2250°C, thereby forming giant disk-shaped
crystal grains each having a diameter of 15 to 150mm, so that the plate member can
be excellent in creep resistance at 1800°C (Patent Document 1).
Prior Art Document
Patent Document
Non-Patent Document
[0012]
Non-Patent Document 1: T. Mrotzek et.al., "Hardening mechanisms and recrystallization behaviour of several
molybdenum alloys" International Journal of Refractory Metals & Hard Materials, 2006,
(24), p298-305.
Non-Patent Document 2: Y. Fukasawa et.al., "Very High Temperature Creep Behavior Of P/M Molybdenum Alloys",
Proceedings of the 11th International Plansee Seminar, vol.1 1985, p295-308.
Non-Patent Document 3: R. Bianco et.al., "Mechanical Properties of Oxide Dispersion Strengthened (ODS) Molybdenum",
Molybdenum and Molybdenum Alloys Edited by A. Crowson, E.S. Chen, J.A. Shields, and
P.R. Subramanian, 1998, p125-142.
Non-Patent Document 4: "Powder and Powder Metallurgy Glossary" edited by The Japan Society of Powder and Powder
Metallurgy, The Nikkan Kogyo Shimbun, Ltd., 2001, p558-559.
Summary of the Invention
Problem to be Solved by the Invention
[0013] The technique described in Patent Document 1 uses no additives and thus is free
of the problem of the occurrence of cracks in the plastic working to cause the reduction
in product yield and the problem of the reaction with the firing workpiece and, further,
the technique does not require the high-rate plastic working and thus is free of the
structural anisotropy and the anisotropy in properties. Therefore, this technique
can be said to be an excellent technique.
[0014] However, in Patent Document 1, the heat treatment temperature required for causing
the secondary recrystallization of the molybdenum plate member is 2250°C which is
quite high in consideration of the primary recrystallization start temperature being
1000°C. Therefore, in terms of the productivity and the energy cost, it is desirable
to lower the heat treatment temperature required for causing the secondary recrystallization.
[0015] This invention has been made in view of the above-mentioned problem and it is an
object of this invention to provide an industrially advantageous molybdenum material
which is capable of causing secondary recrystallization to occur at a temperature
lower than conventional and which, after the secondary recrystallization, can have
a structure that comprises giant crystal grains with less grain boundaries and thus
is excellent in creep resistance.
Means for Solving the Problem
[0016] In order to solve the above-mentioned problem, the present inventors have paid attention
to the relationship between the intensities of crystal diffraction planes by X-ray
diffraction of a molybdenum material and the secondary recrystallization behavior
of the molybdenum material and, as a result of intensive studies, have found that
there is a significant relationship between the peak intensities of specific crystal
diffraction planes in a certain region in a thickness direction of the molybdenum
material and the secondary recrystallization temperature of the molybdenum material.
[0017] Further, the present inventors have found that enlargement of crystal grains due
to secondary recrystallization can be achieved at a temperature lower than that of
the prior art by controlling those peak intensities, and have completed this invention.
[0018] According to a first aspect of the present invention, there is provided a molybdenum
material characterized by having, in at least a part thereof, a portion having a region
where peak intensities of (110) and (220) diffraction planes are each less than a
peak intensity of a (211) diffraction plane, as measured by X-ray diffraction, in
a region at a depth of one-fifth of an entire thickness in a thickness direction from
a surface.
[0019] According to a second aspect of the present invention, there is provided a molybdenum
material characterized by being obtained by heat-treating the molybdenum material
according to the first aspect at 1700°C or more, wherein the average grain size of
crystal grains in a cross-section of the plate member by a linear analysis method
is 15mm or more.
[0020] According to a third aspect of the present invention, there is provided a heating
furnace structural member characterized by comprising the molybdenum material according
to the first or second aspect.
[0021] According to a fourth aspect of the present invention, there is provided a firing
floor plate characterized by comprising the molybdenum material according to the first
or second aspect.
Effect of the Invention
[0022] According to this invention, it is possible to provide an industrially advantageous
molybdenum material which is capable of causing secondary recrystallization to occur
at a temperature lower than conventional and which, after the secondary recrystallization,
can have a structure that comprises giant crystal grains with less grain boundaries
and thus is excellent in creep resistance.
Brief Description of the Drawings
[0023]
Fig. 1 is a perspective view showing surfaces of a molybdenum plate member of this
invention and a rolling direction.
Fig. 2 is a partial perspective view of the molybdenum plate member of this invention.
Fig. 3 is a diagram for explaining the principle of a linear analysis method.
Fig. 4A is an exemplary diagram showing the structural shape and size of the molybdenum
plate member of this invention, wherein the structural shape and size after rolling
are shown.
Fig. 4B is an exemplary diagram showing the structural shape and size of the molybdenum
plate member of this invention, wherein the structural shape and size after primary
recrystallization are shown.
Fig. 4C is an exemplary diagram showing the structural shape and size of the molybdenum
plate member of this invention, wherein the structural shape and size after secondary
recrystallization are shown.
Fig. 5 is a diagram showing the X-ray diffraction results of a molybdenum plate member
according to an Example of this invention.
Fig. 6 is a diagram showing the X-ray diffraction results of a molybdenum plate member
according to a Comparative Example.
Fig. 7 is a table showing the relationships between the heating temperature and the
crystal grain size of molybdenum plate members according to the Example and the Comparative
Example.
Fig. 8 is a schematic diagram of a load test for evaluating the creep resistance of
the molybdenum plate members according to the Example and the Comparative Example.
Fig. 9 is a table showing the results of the load test of the molybdenum plate members
according to the Example and the Comparative Example.
Mode for Carrying Out the Invention
[0024] Hereinbelow, a preferred embodiment of this invention will be described in detail
with reference to the drawings.
[0025] As described before, a molybdenum material according to this invention is such that
the peak intensities of specific diffraction planes in a certain region in a thickness
direction are controlled. Hereinbelow, the conditions of the molybdenum material of
this invention will be described in detail by using a plate member as an example.
<Composition>
[0026] The composition of a molybdenum plate member of this invention is sufficient if it
is mainly composed of molybdenum.
[0027] Specifically, in consideration of contamination to a material which is brought into
contact with the plate member of this invention when used at high temperature, such
as a firing workpiece which is heated on the molybdenum plate member of this invention,
the plate member of this invention preferably contains 99.9mass% or more molybdenum,
but not limited thereto. For example, even in the case of a material in which molybdenum
is a main component (98mass% or more), more specifically, for example, even in the
case of a plate member containing molybdenum and 0.1 to 2.0mass% lanthanum oxide (La
2O
3) or a plate member containing molybdenum, 0.3 to 1.0mass% titanium, 0.01 to 0.10mass%
zirconium, and 0.01 to 0.1mass% carbon, it is also possible to obtain an effect such
that secondary recrystallization occurs at a temperature lower than conventional.
That is, even if a molybdenum plate member with an additive is in the form of an alloy,
the same effect is obtained.
<Manufacturing Method>
[0028] The molybdenum plate member of this invention is obtained by pressing a molybdenum
powder and sintering and then applying thereto plastic working such as rolling or
forging. Hereinbelow, a method for obtaining the molybdenum plate member by rolling
will be described. However, if the peak intensities by X-ray diffraction are controlled
according to this invention, the manufacturing method is not limited thereto.
[0029] The molybdenum powder for use in obtaining the molybdenum plate member of this invention
preferably has a purity of 99.9mass% or more. The powder properties such as the particle
size and bulk density of the material powder and the methods and conditions of a pressing
process and a sintering process for obtaining a sintered body are satisfactory if
it is possible to obtain a sintered body having a relative density of 90% or more
which is a density large enough for plastic working.
[0030] If the relative density of the sintered body is less than 90%, this causes the occurrence
of cracks or the like due to voids in the sintered body when plastic working is applied
to the sintered body to form a plate member, which is thus not preferable.
[0031] As a molybdenum powder pressing method, for example, using a molybdenum powder having
a particle size of 1.0 to 10µm as measured by the Fsss method (Fischer method, Fischer
Sub-Sieve Sizer), a pressed body may be formed by the molybdenum powder with use of
a known single-shaft press machine, a known cold isostatic press machine (CIP), or
the like. As a pressed body sintering method, the above-mentioned pressed body may
be sintered by a heat treatment at 1700 to 2000°C in a non-oxidizing atmosphere such
as hydrogen, argon, or vacuum.
[0032] When an additive is present in addition to molybdenum as the main component, the
powder properties such as the purity and particle size of the additive may be properly
set so that the additive is uniformly dispersed in the sintered body and that the
yield is not degraded in plastic working after the sintering.
[0033] When rolling the sintered body, the roll-to-roll distance, i.e. the rolling rate
(= ((thickness before rolling) - (thickness after rolling)) x 100 / (thickness before
rolling), the unit is %), per pass is controlled so that the intensities of specific
crystal planes in X-ray diffraction are controlled in a region at a depth of one-fifth
of the plate thickness in a plate thickness direction from an arbitrary portion of
at least one of upper and lower surfaces, facing each other, of a plate member. A
product of this invention is such that, by setting the rolling rate per rolling pass
to less than 20% (not including 0), the peak intensities of the (110) and (220) diffraction
planes can each be controlled to less than the peak intensity of the (211) diffraction
plane, as measured by X-ray diffraction, in a region at a depth of one-fifth of the
plate thickness in a plate thickness direction from an arbitrary portion of at least
one of upper and lower surfaces, facing each other, of a plate member.
[0034] Herein, the reason for setting the rolling rate to less than 20% per rolling pass
is that this condition can surely control the intensities of the specific diffraction
planes according to this invention, while if the rolling rate is set to 20% or more,
it is difficult to control the intensities of the crystal diffraction planes and further
the product yield is reduced due to rolling cracks or the like. The lower limit of
the rolling rate per pass is preferably 5% or more and more preferably 15% or more.
This is because if it is less than 5%, the number of rolling passes increases to raise
the manufacturing cost.
[0035] There is no particular limitation to the thickness of the sintered body for obtaining
the molybdenum plate member of this invention. Therefore, for example, the thickness
of the sintered body for obtaining the plate member of 20mm thick may be 50mm or 150mm.
[0036] Herein, unless the total rolling rate (= ((thickness of sintered body) - (final thickness
of plate member after rolling)) x 100 / (thickness of sintered body), the unit is
%) is at least 50% or more, it is difficult to obtain the X-ray diffraction peak intensities
of this invention. More preferably, it is 85% or more.
[0037] In order to satisfy the rolling rate per pass and the total rolling rate described
above, several tens of times, for example, 20 times, of rolling (number of rolling
passes) are required. A surface and inner X-ray diffraction pattern of a molybdenum
plate member which is obtained by limiting the rolling rate per pass to 20% largely
changes due to many times of rolling (number of rolling passes).
[0038] Fig. 4A shows an exemplary diagram of the structure of an obtained molybdenum plate
member, wherein a fibrous structure is exhibited due to the rolling.
<X-ray Diffraction Intensity>
[0039] Next, the X-ray diffraction intensities of crystal planes of a plate member of this
invention will be described. Fig. 1 shows a schematic diagram of the plate member.
ND plane of the plate member are surfaces to be rolled, i.e. surfaces to be brought
into contact with rolling rolls, and correspond to upper and lower surfaces of the
plate member as defined in this embodiment.
[0040] The molybdenum plate member of this invention has, in at least a part thereof, a
portion having a region where the peak intensities of the (110) and (220) diffraction
planes are each less than the peak intensity of the (211) diffraction plane, as measured
by X-ray diffraction, in a region at a depth of one-fifth of the plate thickness in
a plate thickness direction from at least one of upper and lower surfaces, facing
each other, of the plate member.
[0041] That is, an important portion, which significantly affects secondary recrystallization,
of the plate member in this invention, i.e. a region in which the X-ray diffraction
intensities of the molybdenum plate member are controlled, is, as shown in Fig. 2,
set to a region at one-fifth of the plate thickness in a plate thickness direction
from an arbitrary portion of at least one of upper and lower surfaces, facing each
other, of the plate member.
[0042] Herein, "a region at one-fifth of the plate thickness" represents a range of ±50µm
of a depth corresponding to one-fifth from a substantial surface of the plate member,
wherein the substantial surface is a surface after removing an oxide which is inevitably
produced at a surface of a plastically worked material. The oxide removal is carried
out after the rolling and removes an oxide layer of the surface produced during the
rolling by a heat-reduction treatment in a hydrogen atmosphere, a chemical treatment
using aqua regia, a mixture of hydrofluoric acid and nitric acid, or the like, mechanical
removal by cutting, grinding, or the like, or a combination thereof.
[0043] The reason why the control of the intensities of the diffraction planes is carried
out for at least one of the upper and lower surfaces, facing each other, of the plate
member, i.e. the ND plane in Fig. 1, is that if either one of the upper and lower
surfaces is controlled, secondary recrystallization occurs in the entire molybdenum
plate member by a heat treatment at 1700°C or more so that the average size of crystal
grains in plate cross-sections, i.e. on TD and RD plane in Fig. 1, becomes 15mm or
more. Further, the reason for limiting the distance from the plate surface is that
it has been found that the X-ray diffraction intensities in the region at one-fifth
of the plate thickness from the plate surface significantly affect the secondary recrystallization
temperature.
[0044] Details are unclear about the mechanism in which the secondary recrystallization
occurs at the temperature lower than conventional by setting the peak intensities
of the diffraction planes to the above-mentioned conditions. As recrystallization
phenomena, there are primary recrystallization and secondary recrystallization. In
the primary recrystallization, strains generated by applying working such as rolling
or forging to crystal grains of a molybdenum plate member are released by a heat treatment
and crystal grains are newly formed using as nuclei the strains generated by the working.
The secondary recrystallization is a phenomenon in which enlargement and combination
of the primary recrystallized grains occur. In the case of the molybdenum plate member
according to this invention, the factor that largely affects the secondary recrystallization
phenomenon is considered to be a state of the molybdenum plate member before the primary
recrystallization such that portions to be nuclei for the recrystallization are present
in the region where the peak intensities of the crystal diffraction planes satisfy
the above-mentioned conditions.
[0045] Herein, while there are cases where only one of the ND plane in Fig. 1 exhibits the
X-ray diffraction intensities of this invention as described above, this depends on
the plastic working conditions, for example, in the case of rolling of the molybdenum
plate member, this depends on conditions for reversal of the upper and lower surfaces
and so on when rolling the plate member. On the other hand, when the upper and lower
surfaces are uniformly rolled, both ND plane tend to exhibit the X-ray diffraction
intensities of this invention.
[0046] The X-ray diffraction intensities in the region at one-fifth of the plate thickness
do not necessarily satisfy the above-mentioned conditions over the entire surface
of the plate member. If a portion satisfying the above-mentioned conditions is present
in at least a part of the surface of the plate member, secondary recrystallization
occurs starting from that portion.
<Primary Recrystallization Temperature>
[0047] The primary recrystallization temperature is generally about 1000°C to 1100°C although
there is some difference depending on the processing conditions. Also in the case
of the plate member of this invention, it is about 1000°C to 1100°C as the conventional
one.
[0048] For reference, Fig. 4B shows an exemplary diagram of a primary recrystallized structure.
An atmosphere for causing primary recrystallization is not particularly limited as
long as it is a non-oxidizing atmosphere. For example, a hydrogen atmosphere, an argon
atmosphere, a vacuum atmosphere, or the like can be given and it may alternatively
be an atmosphere in a combination thereof.
<Secondary Recrystallization Temperature>
[0049] Next, in order to cause secondary recrystallization of the molybdenum plate member
in this invention, it is necessary to carry out a heat treatment at 1700°C or more.
This is because, with the current technique, it is difficult to cause secondary recrystallization
to occur at less than that temperature, for example, by a heat treatment at 1600°C
for 10 hours. The heating time is required to be about 10 hours at 1700°C while, at
a temperature above it, secondary recrystallization occurs in a shorter time. An atmosphere
for the heat treatment is the same as in the case of the primary recrystallization.
<Grain size after secondary recrystallization>
[0050] After the molybdenum plate member of this invention is heat-treated at 1700°C, the
average size of crystal grains in a plate cross-section is preferably 15mm or more.
This is because it is the grain size necessary for obtaining excellent creep resistance.
In Patent Document 1, the maximum grain size is set to 150mm in terms of economic
load for the treatment temperature and time. On the other hand, if the product of
this invention is used, grains can be enlarged at a relatively low temperature in
a relatively short time and, depending on the conditions, can be formed into a single
crystal. Even if the size of the plate member increases, if a heating furnace having
a size capable of heat-treating it is prepared, the grain size after secondary recrystallization
can be increased according to the size of the plate member and therefore the maximum
crystal grain size is not limited.
[0051] The average grain size referred to herein represents a value obtained by drawing
three arbitrary lines parallel to plate member upper and lower surfaces of a single
test piece as shown in Fig. 3, calculating grain sizes along the respective lines,
and averaging them.
[0052] There is basically no limitation to the size of a molybdenum material of this invention.
The size of the molybdenum material is determined by manufacturing facilities such
as a heating furnace and a plastic working machine such as a rolling, forging, or
wire drawing machine. In an experiment by the present inventors, it was possible to
obtain a molybdenum material of this invention in the form of a large-size plate member
with a length of 1500mm, a width of 1000mm, and a thickness of 20mm as one example.
Examples
[0053] Hereinbelow, this invention will be described in further detail with reference to
an Example.
(Example 1 and Comparative Example 1)
[0054] Molybdenum plate members were prepared under various processing conditions and the
relationship between the peak intensities in a plate thickness direction and the secondary
recrystallization temperature, the creep resistance after secondary recrystallization,
and so on were evaluated. Specific sequences were as follows.
<Preparation of Samples of Example 1>
[0055] A molybdenum powder having a purity of 99.9mass% and a particle size of 4µm as measured
by the Fsss method was used as a starting material. The molybdenum powder was filled
into rubber molds, pressed at a pressure of 2 ton/cm
2 by CIP (Cold Isostatic Pressing), and sintered in a hydrogen atmosphere at 1800°C
for 10 hours, thereby obtaining two sintered bodies having a width of 300mm, a length
of 400mm, and thicknesses of 20mm and 150mm. The relative densities of the obtained
sintered bodies were respectively 94.2% and 94.4%.
[0056] These sintered bodies were heated at 1500°C for 20 minutes and then rolling in two
to three passes and reheating at 1200°C were repeated, thereby finally obtaining molybdenum
plate members having plate thicknesses of 1.0, 1.5, 2.0, 3.0, 10, and 20mm. In Example
1 of this invention, the plate members having the plate thicknesses of 1.0 to 3.0mm
were prepared by rolling the sintered body having the thickness of 20mm while the
plate members having the plate thicknesses of 10 and 20mm were prepared by rolling
the sintered body having the thickness of 150mm.
[0057] Herein, for each sample of Example 1, the rolling rate (= ((thickness before rolling)
- (thickness after rolling)) x 100 / (thickness before rolling), the unit is %) per
pass was set to less than 20%, specifically 10 to 19.8%.
[0058] Finally, a surface oxide was removed by aqua regia after a reducing treatment in
a hydrogen atmosphere at 800°C and, thereafter, washing with pure water was carried
out, thereby obtaining samples of Example 1.
<X-ray Diffraction>
[0059] Then, X-ray diffraction was applied to the obtained samples in the following sequences,
thereby measuring the peak intensities in a plate thickness direction.
[0060] First, an ND plane (rolling surface) of each sample was wet-polished using a waterproof
abrasive paper sheet (#100 to #1000) and the polished sample was immersed in an electrolyte
solution (perchloric acid:ethanol = 1:9) and subjected to electrolytic polishing with
a current of 1A for 150 seconds, thereby polishing the sample to a plate thickness
direction depth where X-ray diffraction was to be carried out.
[0061] Then, with an X-ray diffraction apparatus (RAD-2X) manufactured by Rigaku Corporation,
X-ray diffraction of each sample was carried out using a Cu tube with a tube current
of 30mA and a tube voltage of 40kV under the conditions such that scan speed: 1 deg/min,
divergence slit: 1 degree, scattering slit: 1 degree, receiving slit: 0.15mm, and
measurement angle 2θ = 30 to 120 degrees. Then, the magnitudes of the intensities
of the (110), (220), and (211) planes as the output measurement results were compared.
The data herein were obtained by automatically performing background processing, smoothing
processing, and Kα2 removal of measured raw data using device software.
[0062] Then, again, the above-mentioned polishing was carried out to polish each sample
to a plate thickness direction depth where X-ray diffraction was to be carried out
and X-ray diffraction was carried out at that depth. This operation was repeated a
plurality of times until a predetermined depth was reached, thereby measuring changes
in peak density in the plate thickness direction of the ND plane in X-ray diffraction.
[0063] Table 1 shows one example (plate member thickness 1.5mm) of changes in peak density
in the plate thickness direction of the ND plane in X-ray diffraction of the obtained
molybdenum plate member. Fig. 5 shows a graph representing Table 1.
[Table 1]
| |
Intensity [cps] |
| Plate Thickness Direction Depth from Surface [µm] |
(110) |
(211) |
(220) |
| 97 |
7347 |
16019 |
669 |
| 308 |
1018 |
21218 |
79 |
| 492 |
317 |
13767 |
22 |
| 740 |
223 |
9237 |
15 |
| 997 |
539 |
16173 |
36 |
| 1200 |
5338 |
20851 |
417 |
| 1394 |
4293 |
8970 |
3672 |
[0064] As is clear from Table 1 and Fig. 5, it is seen that, at the middle in the plate
thickness direction, the intensity ratio of (211) is high compared to (110) and (220)
and the intensities of (110) and (220) are values close to 0. In a region at 300µm
from the surface which corresponds to one-fifth of the plate thickness, the intensities
of (110) and (220) are less than the intensity of (211). In the other samples of Example
1, distributions of the crystal planes all showed the same tendency.
[0065] The crystal structure was in a state typified by the exemplary diagram of Fig. 4A.
<Composition Measurement Results>
[0066] Then, the compositions of the obtained samples were measured.
[0067] Specifically, metal components were measured using a plasma emission spectrometer
ICPS-8100 manufactured by Shimadzu Corporation. As gas impurities, O and C were measured
such that O was measured using TC-600 manufactured by LECO Corporation while C was
measured using WC-230 manufactured by LECO Corporation.
[0068] As a result, the composition of each sample was composed of 98.0mass% or more molybdenum
and the balance inevitable impurities. Herein, the inevitable impurities were metal
impurities of Al, Ca, Cr, Cu, Fe, Mg, Mn, Ni, ) Pb, Si, Sn, Ti, Zr, and Zn and gas
impurities of O and C. The purity excluding these impurities was defined as a molybdenum
purity.
<Preparation of Samples of Comparative Example 1 and X-ray Diffraction>
[0069] In the same manner as in Example 1, two sintered bodies having a width of 300mm,
a length of 400mm, and thicknesses of 20mm and 150mm were obtained, then these sintered
bodies were heated at 1500°C for 20 minutes, and then rolling in two to three passes
and reheating at 1200°C were repeated, thereby finally obtaining molybdenum plate
members having plate thicknesses of 1.0, 1.5, 2.0, 3.0, 10, and 20mm. Herein, the
rolling rate per pass was set to 20 to 23%. In the same manner as in Example 1, the
plate members having the plate thicknesses of 1.0 to 3.0mm were prepared by rolling
the sintered body having the thickness of 20mm while the plate members having the
plate thicknesses of 10 and 20mm were prepared by rolling the sintered body having
the thickness of 150mm, thereby obtaining samples of Comparative Example 1.
[0070] Using the sample having the plate thickness of 1.5mm among the samples of Comparative
Example 1, changes in X-ray peak intensity in a plate thickness direction were measured
in the same manner as in Example 1, thereby obtaining the results shown in Table 2
and Fig. 6.
[Table 2]
| |
Intensity [cps] |
| Plate Thickness Direction Depth from Surface [µm] |
(110) |
(211) |
(220) |
| 102 |
25820 |
5279 |
7174 |
| 285 |
18506 |
11157 |
2099 |
| 521 |
915 |
10842 |
78 |
| 694 |
1388 |
7523 |
101 |
| 903 |
748 |
10244 |
111 |
| 1044 |
7208 |
12460 |
689 |
| 1311 |
28830 |
5000 |
7096 |
[0071] As shown in Table 2 and Fig. 6, the sample of Comparative Example 1 was the plate
member in which the peak intensities of the (110) and (220) diffraction planes were
respectively not less than the peak intensity of the (211) diffraction plane in a
region at one-fifth in the plate thickness direction from a surface of the plate member.
<Secondary Recrystallization Temperature Measurement>
[0072] Then, the samples obtained in Example 1 and Comparative Example 1 were heat-treated
in a hydrogen atmosphere at 1600 to 2200°C for 1 hour to 10 hours at maximum. Then,
the structure of a TD plane (see Fig. 1) of each plate member after the heat treatment
was observed to calculate an average grain size using the above-mentioned linear analysis
method, thereby evaluating the secondary recrystallization temperature.
[0073] In the samples obtained in Example 1 and Comparative Example 1, primary recrystallization
occurred before the above-mentioned temperature was reached, specifically, at 1000°C
to 1100°C.
[0074] In the average grain size measurement, the structural observation of the TD plane
in Fig. 1 was carried out to calculate the grain size. Each plate member was cut into
a test piece having a length of 30mm. The test piece was adjusted by polishing and
etching to enable observation of grain sizes and then the grain size was calculated
by the linear analysis method. More specifically, three arbitrary lines parallel to
plate member upper and lower surfaces of a single test piece were drawn as shown in
Fig. 3, then grain sizes were calculated along the respective lines, and the average
value thereof was defined as an average grain size of the sample.
[0075] However, crystal grain sizes after secondary recrystallization become 1 mm or more
and the structure is as shown in an exemplary diagram of Fig. 4C so that there are
cases where it is difficult to specify grain sizes. Therefore, grain sizes of 15mm
or more were all indicated as "15mm or more". The results are shown in Fig. 7.
[0076] As is clear from Fig. 7, the grain size becomes 15mm or more by heating at 1700°C
or more and for at least 10 hours in the entire region of the TD plane in each sample
of Example 1, while, in Comparative Example 1, grains were enlarged to 15mm or more
by a heat treatment at 2000°C only in the case of the sample having the plate thickness
of 1.0mm and grains of 15mm or more were not obtained unless heating at 2200°C was
carried out in the case of the other samples of Comparative Example 1. On the other
hand, at 1600°C, the crystal grain sizes were 100µm or less and thus secondary recrystallization
did not occur in Example 1 and Comparative Example 1. There was no significant difference
among the three arbitrary lines used for measuring the average grain size. The structure
having been subjected to the secondary recrystallization was similar to that shown
in the exemplary diagram of Fig. 4C.
[0077] For each sample of Example 1, the measurement of the grain size in the molybdenum
plate member cross-section was carried out by observing the TD plane. However, the
same structure was obtained also on an RD plane.
[0078] In Patent Document 1, there is no description about the rolling conditions, crystal
planes, or the like of the molybdenum plate member. However, on checking up with the
results this time, it is considered that all the samples of Comparative Example 1
in which the grains were enlarged by heating at 2200°C regardless of the heating time
are the plate members substantially corresponding to that of Patent Document 1. That
is, it is seen that, in each sample of Example 1, the enlargement of grains occurred
at a low temperature compared to the products similar to that of Patent Document 1.
<Creep Resistance Evaluation>
[0079] Then, the creep resistance of the samples of Example 1 and Comparative Example 1
was evaluated based on the deformation amount in a load test at 1800°C.
[0080] Specifically, test pieces of Example 1 were heated in a hydrogen atmosphere at 1800°C
for 5 hours to cause secondary recrystallization and were processed to a size of width
20mm x length 150mm. The plate thicknesses were 1.0, 1.5, 2.0, 3.0, 10, and 20mm.
Test pieces of Comparative Example 1 were also heat-treated and processed into the
predetermined size in the same manner. Secondary recrystallization did not occur in
any of the samples of Comparative Example 1.
[0081] Then, as shown in Fig. 8, a test piece 1 was set on tungsten jigs 2 and 2'. The distance
between the jigs 2 and 2' was set to 100mm and a load 3 was applied to a middle portion
of the test piece on the jigs 2 and 2'. In a test, the load was set to 125g for the
thickness 1 mm, 280g for the thickness 1.5mm, 500g for the thickness 2mm, and 1.1
kg for the thickness 3mm. Taking into account the safety of the test, the load was
set to 12.5kg for the thicknesses 10mm and 20mm.
[0082] Then, in the state where the load was applied to the test piece, the test piece was
heated in a hydrogen atmosphere at 1800°C for 100 hours at maximum and the deformation
amount of the sample was measured. The deformation amount is, as shown in Fig. 8,
given by a difference between positions of upper surfaces of the test piece 1 before
the test and a test piece 1' after the test and was measured using a micro-gauge.
Taking into account the safety of the test, the test was stopped when the test piece
was deformed by 20mm so that the test under the longer heating time conditions was
not performed.
[0083] Fig. 9 shows measured deformation amounts. In the figure, "stop" means that the test
was stopped due to the deformation amount having reached 20mm.
[0084] As shown in Fig. 9, the samples of Comparative Example 1 were deformed by 20mm after
a lapse of 20 hours regardless of the plate thickness while the samples of Example
1 were hardly deformed even after a lapse of 100 hours and exhibited excellent creep
resistance. In Patent Document 1 as prior art, data for the plate thickness 2mm obtained
by the same test method is described. However, with the product of this invention,
there were obtained excellent results equal to or better than those test results.
(Comparative Example 2)
[0085] With respect to the plate member having the thickness of 1.5mm among the plate members
of Example 1, regions at a depth of one-fifth + 50µm from both surfaces were removed
by polishing. Then, the plate member was heat-treated in a hydrogen atmosphere at
1600 to 2200°C for 1 hour to 10 hours at maximum. Then, the structure of a TD surface
(see Fig. 1) of the sample after the heat treatment was observed to calculate an average
grain size using the above-mentioned linear analysis method, thereby evaluating the
secondary recrystallization temperature.
[0086] As a result, this plate member, like the samples of Comparative Example 1, did not
cause enlargement of grains due to secondary recrystallization unless heated to 2200°C.
[0087] This is considered to be because nuclei serving to cause secondary recrystallization
to occur at a temperature lower than conventional were formed in regions at a depth
of one-fifth from both surfaces of the sample of Example 1.
[0088] From the results described above, it is seen that, by controlling the peak intensities
of diffraction planes at a plane parallel to a rolling direction in a region at a
depth of one-fifth of the plate thickness in a plate thickness direction from an arbitrary
portion of at least one of upper and lower surfaces, facing each other, of a molybdenum
plate member, it is possible to obtain an industrially advantageous molybdenum plate
member which is capable of causing secondary recrystallization to occur at a temperature
lower than that of the prior art (Patent Document 1) and which is excellent in creep
resistance.
Industrial Applicability
[0089] While this invention has been described with reference to the embodiment and the
Example, this invention is not limited thereto.
[0090] It is apparent that those skilled in the art can think of various changes and improvements
in the scope of this invention and it is understood that those are also included in
the scope of this invention.
[0091] For example, while the molybdenum plate member is manufactured by rolling in the
above-mentioned embodiment and Example, even a molybdenum plate member by forging
or the like can similarly cause secondary recrystallization as long as the peak control
of X-ray diffraction planes described in the embodiment and the Example is carried
out.
[0092] In the above-mentioned embodiment and Example, the shape of molybdenum is the plate
shape. However, even in the case of a shape other than the plate shape, for example,
a wire or rod shape, since the recrystallization phenomenon is basically the same,
it is considered to be possible to cause secondary recrystallization to occur at a
low temperature similarly as long as the peak control of X-ray diffraction planes
described above is carried out. In this case, it is satisfactory if the peak intensities
of X-ray diffraction planes in a region at a depth of one-fifth of the diameter of
a linear rod toward the central axis from a surface of the linear rod satisfy the
above-mentioned conditions.
[0093] This invention is applicable to high-temperature structural and component materials,
in particular, a wall surface forming a high temperature furnace and other components
supporting constituent materials, more specifically, materials forming a high temperature
furnace body, such as a base plate, a heater, a reflector, and fasteners such as bolts,
and firing floor plates for use in the manufacture of sintered products such as ceramics,
MIM (metal injection molding) products , and rare earth magnets.
[0094] Further, this invention is also applicable to members of a single crystal growth
furnace, specifically, for example, members forming a single crystal growth furnace
for manufacturing a sapphire single crystal by melting alumina and members for use
in lifting a sapphire single crystal because of less deformation after secondary recrystallization.
Description of Symbols
[0095]
- 1
- test piece before creep test
- 1'
- test piece after creep test
- 2, 2'
- creep test jigs
- 3
- creep test load