| (19) |
 |
|
(11) |
EP 2 695 958 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
02.07.2014 Bulletin 2014/27 |
| (43) |
Date of publication A2: |
|
12.02.2014 Bulletin 2014/07 |
| (22) |
Date of filing: 24.07.2008 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL
PT RO SE SI SK TR |
| (30) |
Priority: |
07.08.2007 JP 2007205630
07.09.2007 JP 2007232641
27.09.2007 JP 2007252036
27.09.2007 JP 2007252037
|
| (62) |
Application number of the earlier application in accordance with Art. 76 EPC: |
|
08791572.4 / 2184371 |
| (71) |
Applicant: Kabushiki Kaisha Kobe Seiko Sho |
|
Chuo-ku,
Kobe-shi,
Hyogo 651-8585 (JP) |
|
| (72) |
Inventors: |
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- Aruga, Yasuhiro
Kobe-shi, Hyogo, 651-2271 (JP)
- Hashimoto, Daisuke
Shimonoseki-shi, Yamaguchi, 752-0953 (JP)
- Nomura, Koya
Shimonoseki-shi, Yamaguchi, 752-0953 (JP)
|
| (74) |
Representative: Müller-Boré & Partner Patentanwälte PartG mbB |
|
Friedenheimer Brücke 21
80639 München
80639 München (DE) |
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| |
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(57) The present invention relates to a Cu-Ni-Sn-P-based copper alloy sheet having a specific
composition, where the X-ray diffraction intensity ratio I(200)/I(220) in the sheet
surface is set to be a given value or less and at the same time, anisotropy in the
stress relaxation resistance characteristic is reduced by fining the grain size. The
Cu-Ni-Sn-P-based copper alloy sheet of the present invention is excellent in the properties
required for a terminal or connector and further satisfies the stress relaxation resistance
characteristic in the direction orthogonal to the rolling direction.