ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESM..................
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BDM Ver 0.1.63 (23 May 2017) - 1620000/0
2725305
EUROPEAN PATENT APPLICATION
A3
20180321
EP
13189357.0
20131018
en
en
en
2012237624
20121029
JP
20180321
201812
20140430
201418
F24D 19/10 20060101AFI20180210BHEP
F25B 47/02 20060101ALI20180210BHEP
F24D 19/00 20060101ALI20180210BHEP
de
Warmwasserversorgungsvorrichtung und Steuerverfahren dafür
en
Hot-Water Supply Apparatus And Control Method Of The Same
fr
Appareil d'alimentation en eau chaude et son procédé de commande
1
Toshiba Carrier Corporation
101045253
204628 EP
23-17, Takanawa 3-chome Minato-ku
Tokyo 108-8580
JP
Kakuyama, Fushiki
c/o Toshiba Carrier Corporation 336, Tadehara
Fuji-shi, Shizuoka 416-8521
JP
Clarenbach, Carl-Philipp
et al
101208071
Gleiss Große Schrell und Partner mbB Patentanwälte Rechtsanwälte Leitzstraße 45
70469 Stuttgart
DE
AL
AT
BE
BG
CH
CY
CZ
DE
DK
EE
ES
FI
FR
GB
GR
HR
HU
IE
IS
IT
LI
LT
LU
LV
MC
MK
MT
NL
NO
PL
PT
RO
RS
SE
SI
SK
SM
TR
BA
ME
20180321
201812
According to one embodiment, a hot-water supply apparatus includes a hot-water supply tank (31), a heat-pump type refrigeration cycle, a bypass (24), a circulating pump (27), a refrigerant temperature sensor (26) and a control section (50). The circulating pump (27) circulates water in the supply-water tank (31) after making the water pass through the water heat exchanger (22). The refrigerant temperature sensor (26) detects a temperature of the refrigerant when the refrigerant flows between the water heat exchanger (22) and the open/close valve (23). The control section (50) performs a defrosting operation of defrosting the outdoor heat exchanger (14) by activating a defrosting circuit, and also configured to operate the circulating pump (27) in a case where the temperature detected by the refrigerant temperature sensor (26) lowers to be less than a set value during the defrosting operation.
204628 EP
EP
13189357.0
Toshiba Carrier Corporation
1
MN
20180215
F24D
F25B
WO
2011092802
A1
MITSUBISHI ELECTRIC CORP [JP]; AOYAGI YOSHIRO [JP]
20110804
X
1-15
* page 1, paragraph 1 - page 15, paragraph 45; figures 1-2 *
JP
2008070013
A
MITSUBISHI ELECTRIC CORP
20080327
A
1,14
* page 2, paragraph 1 - page 15, paragraph 74; figure 1 *
EP
2381192
A2
LG ELECTRONICS INC [KR]
20111026
A
1,14
* the whole document *
JP
2003222391
A
DAIKIN IND LTD
20030808
A,D
1
* the whole document *
Hoffmann, Stéphanie
Munich
20180206
WO
2011092802
A1
20110804
EP
2530410
A1
20121205
JP
5570531
B2
20140813
JP
WO2011092802
A1
20130530
US
2012291460
A1
20121122
WO
2011092802
A1
20110804
JP
2008070013
A
20080327
JP
4738293
B2
20110803
JP
2008070013
A
20080327
EP
2381192
A2
20111026
CN
102235775
A
20111109
EP
2381192
A2
20111026
KR
20110118417
A
20111031
US
2011259024
A1
20111027
JP
2003222391
A
20030808
EP
1484559
A1
20041208
JP
2003222391
A
20030808
US
2005150969
A1
20050714
WO
03064935
A1
20030807