BACKGROUND
Technical Field
[0001] The present disclosure generally relates to DC/DC convertors and methods for DC/DC
conversion. More particularly, it concerns a voltage polarity detection circuit adapted
for the detection of Continuous Conduction Mode (CCM) to Discontinuous Conduction
Mode (DCM) boundary of a switched DC/DC converter.
[0002] It finds application, for instance, in power-management platforms for wireless devices
such as mobile phones, smart phones, digital audio players, PDAs, e-books readers,
or the like.
Related Art
[0003] The approaches described in this section could be pursued, but are not necessarily
approaches that have been previously conceived or pursued. Therefore, unless otherwise
indicated herein, the approaches described in this section are not prior art to the
claims in this application and are not admitted to be prior art by inclusion in this
section.
[0004] A DC/DC converter is an electronic circuit which converts a source of direct current
(DC) from one voltage level to another, higher or lower voltage level. Electronic
Switched Mode Power Supply (SMPS) circuits convert one DC voltage level to another,
by controlling a switch to store the input energy temporarily and then release that
energy to the output at a different voltage. The storage may be in either magnetic
field storage components (inductors, transformers) or electric field storage components
(capacitors). In magnetic DC/DC converters, the energy is periodically stored into
and released from a magnetic field in an inductor or a transformer, typically in the
range from 300 kHz to 10 MHz. By adjusting the duty cycle of the switching, i.e.,
the ratio of ON/OFF time of the switch, the amount of energy transferred to the output
can be controlled. Usually, this is applied to control the output voltage, and therefore
a switch driving circuit is adapted to sense the output voltage and generate a control
signal for driving the switch.
[0005] With reference to Figures 1A-1C, SMPS circuits achieve synchronous DC/DC conversion
by means a converter comprising an inductance L switched by at least one power switch
S controlled by a pulse-width modulated control signal, a capacitor C, a flywheel
diode D acting as a rectifier, and a switch driving circuit (not shown) adapted to
generate the control signal. The power switch S may be a power Metal Oxyde Semiconductor
(power-MOS) transistor of the N-conduction type (commonly referred to as a NMOS) or
of the P-conduction type (commonly referred to as a PMOS).
[0006] Depending on the arrangement of the inductor L, switch S, capacitor C and rectifying
diode D, the DC/DC converter can be of the Buck, Boost or Buck-Boost type. A DC/DC
converter of the Buck type (as shown in Figure 1A) allows reducing a DC input voltage
V
i or current to generate a lower DC output voltage or current. A DC/DC converter of
the Boost type (as illustrated by Figure 1B) allows elevating a DC input voltage V
i or current to generate a higher DC output voltage or current. A DC/DC converter of
the Buck-Boost type (as illustrated by Figure 1C) is capable of performing both functions.
In all types of DC/DC converters, the feedback circuit is adapted to generate the
PWM control signal based on the DC output voltage V
o (or current) across the load R, so as to regulate said DC output voltage (or current)
to a desired value.
[0007] The efficiency of such DC/DC converters has increased thanks to the use of synchronous
rectification, by replacing the flywheel diode with a power-MOS with lower ON-resistance,
thereby reducing losses and allowing generation of supply voltages of lower value.
[0008] As shown in Figure 2, the switch S may be a PMOS power transistor M
3 arranged, in a power stage 10, in series with a NMOS power transistor M
2 acting as synchronous rectifier. Power transistors M
2 and M
3 are controlled by a driving signal CMD_N and a driving signal CMD_P, respectively.
These signals may be generated by a Pulse-Width Modulation (PWM) unit 21 of the switch
driving circuit 20, based on the output voltage V
o of the converter (not shown in Figure 2 in which only the inductance L of the DC/DC
converter is represented), that is to say the voltage across the load R as shown in
Figures 1A-1C. In a Step-down (Buck) DC/DC converter, the output voltage is lower
than the input voltage, and of the same polarity. In a Step-up (Boost) DC/DC converter,
the output voltage V
o is higher than the input voltage V
i. In a Single-Ended Primary-Inductor Converter (SEPIC) the output voltage V
o can be lower or higher than the input voltage V
i (Buck-Boost).
[0009] Discontinuous Conduction Mode (DCM) is a mode of operation of the DC/DC converter
wherein in order to protect inductance current I
L against polarity inversion during the conduction cycle of the power switch S, the
power stage is disconnected (said power stage is in high impedance state). Likewise,
Continuous conduction Mode (CCM) is a mode of the operation of DC/DC converter wherein
the inductance current I
L is not inverted during the conduction cycle. The converter operates in DCM when low
current is drawn by the load R, and in CCM at higher load current levels. Indeed,
when the amount of energy required by the load R is small enough to be transferred
in a time lower than the switching period, the current through the inductor falls
to zero during part of this period.
[0010] The DCM/CCM boundary detection is a fundamental functionality of each modern DC/DC
convertor, enabling the convertor to be operated in various operating modes, for instance
pure PWM mode or pulse-skipping mode. Pulse skipping mode is an operation mode which
enables to decrease the power consumption of the DC/DC converter and thus to increase
the battery-life of the mobile device, e.g, mobile phone. The accurate detection of
the boundary between DCM and CCM is an important issue having a major role on the
power efficiency and reliability of the DC/DC converter.
[0011] The boundary between the DCM and CCM is defined by the zero-valley inductor current,
i.e. zero-current at the end of the NMOS conduction cycle. If this zero-current is
not properly detected, the conduction on the PMOS transistor body-diode occurs, which
considerably increases the power losses of the converter. In fact, when inductor current
is inverted, the output capacitor is discharged by the power stage. This is opposite
compared to the required features of the power stage, which is supposed to drive the
power into the output capacitor during the whole PWM conduction cycle.
[0012] Therefore, and as shown further in Figure 2, the switch driving circuit 20 cooperates
with a zero-current detection circuit 30, adapted to detect whether the inductor current
I
L changes polarity during or at the end of the conduction period of the power switch,
namely of the NMOS in the shown example. Said zero-current detection circuit 30 has
an input 31 connected to the output of the power switch, i.e., the drain of the NMOS
power transistor M
2 in the shown example, for receiving its V
DS voltage. Further, it has an output 32, whose output voltage V
OUT in indicative of the polarity of the V
DS voltage of the NMOS power transistor M
2, and is fed back to the switch driving circuit 20 along with the output voltage V
o of the DC/DC converter.
[0013] There are two methods which may be used in practice to detect the current polarity
of the inductor current I
L at the end of NMOS conduction period. In a first method used in DC/DC convertors
with low operating frequencies, the conduction on the body-diodes of the power-MOS
is observed. In a second method suitable for DC/DC converters with higher switching
frequency (when the non-overlapping time is not properly defined), the voltage V
DS on the power-MOS drain is observed.
[0014] The present disclosure addresses DC/DC converters relying on this second polarity
detection method.
[0015] With reference to Figure 3, there is observed the polarity of the V
DS voltage at the end of the conduction of the switch S, i.e., at time t = T
CLK, where V
DS voltage refers to the drain-source voltage of the output NMOS power transistor. In
the case of a negative voltage as shown by the curve in dotted line, no inversion
occurs during the conduction period of the NMOS, which means that the converter operates
in the CCM mode of operation. In contrast, when the voltage V
DS at the end of the NMOS conduction period is positive as shown by the curve in continuous
line, inversion occurs, and the pulse skipping mode is preferred in order to increase
the power efficiency of the converter.
[0016] The voltage V
Ds(t=TCLK) at the end of NMOS conduction period is equal to:

where R
DS_N is the ON-resistance of the power NMOS and is in order of 100 mΩ. It follows that
polarity detection circuit must handle with very low voltage levels, with accuracy
below 1 mV, and must therefore be extremely accurate.
[0017] Zero-current detection solutions known in the art are based on a comparator having
a differential input pair. In order to ensure the required accuracy, this comparator
must either be trimmed after fabrication (which is expensive) or must use a special
design technique, leading to important silicon surface and current consumption. When
the comparator is not trimmed, the system must exhibit a high robustness due to increased
dispersion, which considerably lowers the power efficiency of the convertor. Sometimes,
an additional sensing resistance is inserted to increase the V
DS voltage, which leads to additional power losses.
[0018] Other existing solutions also use sampling of the V
DS voltage at the end of NMOS conduction period, which is subsequently evaluated with
a slower, but more accuracy, differential pair based comparator.
[0019] Reference
US 2011/291632 discloses a power converter which includes a power converting unit and a switch driving
circuit. A zero-current detector is configured to adjust the offset voltage based
on a first detection voltage signal generated by a switch driving circuit and to generate
a zero-current detecting signal based on the offset voltage. The offset voltage and
the zero-current detecting signal are associated with a current in the power converting
unit.
[0020] Stephen Bryson: "Using auto-zero comparator techniques to improve PWM performance
(Part 1 of 2)" discloses using auto-zero comparator techniques to improve PWM control
used in power management. To eliminate offset variation inherent in conventional CMOS
comparator circuits, an auto-zeroing comparator is provided where a DRIVE signal is
used in combination with a capacitor C1 for changing the status of an output comparison
signal.
[0021] EP 0 049 024 A2 discloses an operational amplifier designed to eliminate the effects of voltage offsets,
wherein a switched capacitor is provided in a feedback loop of the operational amplifier.
[0022] This solution requires a high performance, i.e., high speed and high accuracy comparator,
however leading to high power consumption, or requires post-fabrication trimming of
the comparator to enhance its quality. Obtaining such high quality comparator contributes
to an important part of the DC-DC convertor design, and it costs lots of resources.
[0023] An accurate CCM to DCM boundary detection would allow to improve the converter device
features such as efficiency, and reliability of the control. This is a challenging
improvement in particular for the devices having very low resistance of power switches.
The design of a new offset-free polarity detection circuit can allow further improvement
of the DC-DC convertors efficiency, mainly for higher switching frequencies, as required
by the new power-management platforms for e.g. wireless devices.
SUMMARY
[0024] These deficiencies are overcome, at least in part, by the invention defined in the
subject matter of the independent claims. Advantageous embodiments are covered by
the dependent claims.
[0025] To address these needs, embodiments of the proposed solution rely on detecting the
inversion of the coil current at the end of the NMOS conduction cycle, defining the
crossing of the DCM/CCM boundary, by using a design based on dynamic current mirror
and auto-zero comparator providing an offset-free and very fast polarity detection.
[0026] More particularly, a first aspect relates to a voltage polarity detection circuit
adapted for the detection of a Continuous Conduction Mode to Discontinuous Conduction
Mode boundary of a power switch in a switched DC/DC converter, said circuit comprising:
- an input for receiving an input voltage representative of the conduction voltage of
the power switch;
- an output for outputting a voltage polarity detection signal;
- a dynamic current mirror having an input connected to the input of the circuit through
a first capacitor, and an output, said dynamic current mirror being controlled to
store a voltage representative of the input voltage in the first capacitor at the
end of a conduction cycle of the power switch; and,
- an auto-zero comparator having a first input connected to the output of the dynamic
current mirror, a second input connected to a second capacitor, and an output connected
to the output of the circuit, said auto-zero comparator being controlled to:
- charge the output voltage of the dynamic current mirror into the second capacitor,
during a first phase of operation corresponding to the conduction cycle of the NMOS
power switch; and,
- detect the polarity of the input voltage at the end of the first phase of operation,
by comparing the voltage stored in the second capacitor with the output voltage of
the dynamic current mirror in a second phase of operation corresponding to a non-conduction
cycle of the power NMOS switch.
[0027] The dynamic current mirror acts as an input memory element and a first comparator
stage, whereas the auto-zero comparator acts as a fast output stage providing additional
voltage gain of the voltage polarity detection circuit. As it will become apparent
from reading the following description of embodiments, the proposed circuit has the
further advantages of having no inherent comparison offset and of having a very high
detection speed (in the order of a few nanoseconds), along with very low power consumption.
[0028] A second aspect relates to a method of detecting a voltage polarity for the detection
of a Continuous Conduction Mode to Discontinuous Conduction Mode boundary of a power
switch used in a switched DC-DC converter, comprising:
- using a dynamic current mirror to store in a first capacitor a voltage representative
of the conduction voltage of the power switch, at the end of a conduction cycle of
the power switch; and,
- using an auto-zero comparator to:
- charge the output voltage of the dynamic current mirror, into a second capacitor during
a first phase of operation corresponding to the conduction cycle of the power switch;
and,
- detect, , the polarity of the conduction voltage of the power switch at the end of
the first phase of operation, by comparing the voltage stored in the second capacitor
during the first phase of operation with the output voltage of the dynamic current
mirror in a second phase of operation corresponding to a non-conduction cycle of the
power switch.
[0029] A third aspect relates to a DC-DC converter comprising a voltage polarity detection
circuit according to the first aspect.
[0030] A fourth aspect relates to a wireless device comprising a Power Management Unit (PMU)
having a DC-DC converter circuit according to the third aspect.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Embodiments of the present invention are illustrated by way of example, and not by
way of limitation, in the figures of the accompanying drawings, in which like reference
numerals refer to similar elements and in which:
- Figures 1A, 1B and 1C are schematic views of a buck DC-DC converter, a boost DC-DC
converter, and a buck-boost DC-DC converter, respectively.
- Figure 2 is a schematic view of a synchronous rectification DC-DC converter having
a pull-up PMOS transistor and a pull-down NMOS transistor.
- Figure 3 is a graph of the drain voltage of the NMOS transistor as a function of time
over the switching cycle of the DC-DC converter of Figure 2.
- Figure 4 is a schematic block diagram of a voltage polarity detection circuit used
for the DCM/CCM boundary detection according to embodiments.
- Figure 5 are chronograms showing the waveform of the simplified schematic diagram
from Figure 4.
- Figure 6 is a detailed schematic block diagram of a voltage polarity detection circuit
used for the DCM/CCM boundary detection according to other embodiments.
- Figure 7 is a schematic block diagram of a wireless device incorporating a DC/DC converter
as shown in Figure 4 or 6.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0032] Various example embodiments will now be described more fully with reference to the
accompanying drawings in which some embodiments are shown. The proposed inventive
concepts may, however, be embodied in different forms and should not be construed
as limited to the embodiments set forth herein. Rather, example embodiments are provided
so that this disclosure is thorough and complete and fully conveys these inventive
concepts to those skilled in the art.
[0033] Referring to Figure 4, there is shown therein a schematic block diagram of a voltage
polarity detection circuit suitable for the DCM/CCM boundary detection according to
embodiments of the proposed solution.
[0035] In the contemplated implementation, the dynamic current mirror acts as the input
memory element and a first comparator stage, whereas the auto-zero comparator acts
as a fast output stage providing additional voltage gain of the voltage polarity detection
circuit. As it will become apparent from reading the following description of embodiments,
the proposed circuit has the further advantages of having no inherent comparison offset
and of having a very high detection speed (in the order of a few nanoseconds), along
with very low power consumption.
[0036] As shown in Figure 4, the voltage polarity detection circuit 10, also referred to
as a zero-current detector in the present description, has an input 31 and an output
32. Only the NMOS power transistor M
2 of the power stage 10 is represented in Figure 4. Also, the switch driving circuit
20 as shown in Figure 2 is not represented in Figure 4, in order to keep the latter
as simple and readable as possible. However, the one with ordinary skills in the art
will understand that the proposed zero-current detector of Figure 4 is adapted to
be substituted to the zero-current detector of Figure 2, namely may have its input
31 terminal and output terminal 32 connected to the same elements of the power stage
10 and the switch driving circuit 20 as described above with reference to Figure 2.
More precisely, the input terminal 31 is connected to the output, i.e., the drain
of the NMOS transistor M
2 of the power stage 10, and the output terminal 32 is connected to an input of the
switch driving circuit 20 to feed-back the zero-current detection signal V
OUT.
[0037] In the embodiment shown if Figure 4, the power stage 30 further comprises a delay
unit 11, which is adapted to delay the control signal CMD_N by a given time t
0. This ensures the absence of overlapping between the conduction periods of the power
switch M
2 controlled by signal CMD_N on one hand, and power transistor M
3 controlled by the control signal CMD_P on the other hand.
[0038] Embodiments of the proposed polarity detection circuit 30 used for the detection
of the Direct Current Mode (DCM) of the power switch M
2 comprise a dynamic current mirror and an auto-zero comparator, the combination of
which provides a fast, accurate and offset-free polarity detection.
[0039] As shown in Figure 4, the dynamic current mirror may comprise a single NMOS transistor
M
1, whose drain is connected to a current source 61 for receiving a constant current
I
0 output from said current source. The source of M
1 is connected to the ground GND. The control gate of M
1 is connected to the input 31 of the circuit through a capacitor C
1 and a first switch SW
1. It is further connected to the ground GND through capacitor C
1 and a second switch SW
2. The control gate of M
1 is finally connected to its drain through a third switch SW
3. Let us call V
HZ the voltage at the node corresponding to the drain of transistor M1, which thus also
corresponds to the output voltage of the dynamic current mirror.
[0040] Further, the auto-zero comparator may comprise a standard two stage Operational Amplifier
(OA) whose non inverting input "+" is connected to the drain of M
1, whose inverting input "-" is connected to the ground through a capacitor C
2, and whose output is connected to its inverting input "-" through a fourth switch
SW
4. Let us call V
C2 the voltage across capacitor C
2, and V
OUT the voltage at the output of the AO. Voltage V
OUT is also the output voltage of the auto-zero comparator and, hence, the voltage at
the output 32 of the polarity detection circuit 30.
[0041] In one example, switches SW
1, SW
2, SW
3 and SW
4 each comprise, for instance are implemented by, e.g., a NMOS transistor M
7, M
9, M
5 and M
12, respectively.
[0042] Switches SW
1, SW
3 and SW
4 on one hand, and switch SW
2, on the other hand, are driven by two complementary clock signals Φ
1 and Φ
2, respectively.
[0043] The operation of the circuit of Figure 4 will now be detailed with reference to the
simplified chronograms of Figure 5.
[0044] The first chronogram at top of Figure 5 shows the pulse-width modulated control signal
CMD_N generated by the switch driving circuit 20 for driving the power switch M
2. The second chronogram corresponds to the voltage V
g_N on the control gate of transistor M
2, showing in particular the delay t
0 introduced by the delay unit 11 of the power stage 10. The third and fourth chronograms
show the complementary clock signals Φ
1 and Φ
2. These clock signals Φ
1 and Φ
2 may be generated by the switch driving circuit 20. They have the same period as the
control signals CMD_N and CMD_P, which may correspond to the period T
CLK of a master clock CLK of the power management unit which incorporates the DC-DC converter.
Control signal CMD_N is in phase with clock signal Φ
1, and control signal CMD_P is in phase with clock signal Φ
2. Note, however, that a slight non-overlap of the Φ
1 and Φ
2 clock signals may be introduced.
[0045] The operation of the polarity detection circuit 30 is cyclic, one cycle corresponding
to a period of the complementary clock signals Φ
1 and Φ
2. A cycle is divided in two phases of operation.
[0046] A first phase of operation is defined by the time when clock signal Φ
1 is active, for example at the high logical state, and control signal Φ
2 is inactive, at the low logical state in such example. Conversely, the second phase
of operation is defined by the time when clock signal Φ
1 is inactive and control signal Φ
2 is active. In view of the above convention, the first phase of operation will sometimes
be referred to as phase Φ
1, and the second phase of operation will be referred to as phase Φ
2, in what follows.
[0047] The NMOS transistor M
2 of the power stage is conductive during the first phase of operation (i.e., phase
Φ
1), and is blocked during the second phase of operation (i.e., phase Φ
2). Stated otherwise, the first phase of operation of the polarity detection circuit
corresponds to the conduction period of the power transistor M
2 of the DC-DC converter. Also, the switches SW
1, SW
3 and SW
4 are closed during the first phase of operation, and are open during the second phase
of operation. Conversely, switch SW
2 is open during the first phase of operation, and is closed during the second phase
of operation.
[0048] During phase Φ
1, the drain-source voltage V
DS of the power NMOS transistor M
2 is applied to the first terminal (1) of the memory capacitor C
1 through the closed switch SW
1. Switch SW
3, being closed, configures the transistor M
1 to be diode-connected. The terminal (2) of capacitor C
1 on the side of switch SW
3 is at the voltage gate-source voltage V
GS(M1) of transistor M
1, which is therefore given by:

where :
ID is the drain current flowing through M1;
L and W designate the length and the width, respectively, of M1; and,
VTH is the threshold voltage of M1.
[0049] If follows that, during phase Φ
1, the voltage V
C1 across the capacitor C
1 is given by:

where V
DS(M2) is the drain-source voltage of the power transistor M
2.
[0050] It will be appreciated that voltage V
C1 is thus directly representative of voltage V
DS(M2)(t), since the drain current I
D is flowing through M
1 is equal to the constant current I
0 from current source 61 (I
D = I
0), so that voltage V
GS(M1) is constant during phase Φ
1. Voltage V
C1 across capacitor C
1 as a function of time is shown by the fifth chronogram from the top of Figure 5.
[0051] During this phase Φ
1, the auto-zero comparator, namely the Operational Amplifier OA, is configured as
a voltage follower (switch SW
4 being closed). Thus, the substantially constant voltage V
Hz at the high-impedance node corresponding to the drain of transistor M
1, is recopied to the capacitor C
2 as voltage V
C2. Voltage V
HZ as a function of time is shown in the sixth chronogram from the top of Figure 5.
It may be noted, that an eventual offset of the comparator is added to the V
C2.
[0052] Let us now describe the configuration of the circuit in the second phase Φ
2. In phase Φ
2, terminal (1) of capacitor C
1 on the side of switch SW
2 is connected to the ground GND through closed switch SW
2, and switches SW
1, SW
3 and SW
4 are open. Whatever the polarity of the drain-source V
DS of M
1 voltage at the end of first phase Φ
1 (noted V
DS(t=TCLK) in Figure 5), namely irrespective of whether voltage V
DS(M2) is positive or negative at the end of the conduction period of the NMOS transistor
M
2, a complementary, i.e. negative or positive excursion will immediately appear on
the gate of transistor M
1. Indeed, the voltage across capacitor C
1 remains constant upon switching of transistor M
2 from the conduction state to the non-conduction state. Further, from the end of phase
Φ
1 and beginning of phase Φ
2 we have the following relationship:

[0053] Thus, comparing above relations (3) and relation (4) at t=T
CLK, gives the following changes in the gate-source voltage V
GS(M1) of transistor M
1 :
- if the drain-source voltage VDS(t=TCLK) of transistor M2 at the end of phase Φ1 is positive (as shown on the left part of the fifth chronogram from top of Figure
5 which corresponds to the case illustrated by the graph in continuous line of Figure
3), then the gate-source voltage VGS of transistor M1 is shifted down by VDS(t=TCLK). It follows that voltage VGS(M1) of transistor M1 at the beginning of phase Φ2 is lower than at the end of phase Φ1 (which may be expressed as VGS(Φ2) < VGS(Φ1)); and, conversely,
- if the drain-source voltage VDS(t=TCLK) of transistor M1 at the end of phase Φ1 is negative (as shown on the right part of the fifth chronogram from top of Figure
5 which corresponds to the case illustrated by the graph in dotted line in Figure
3), then the gate-source voltage VGS of transistor M1 is shifted up by the absolute value of VDS(t=TCLK). It follows that voltage VGS(M1) of transistor M1 at the beginning of phase Φ2 is higher than at the end of phase Φ1 (which may be expressed as VGS(Φ2) > VGS(Φ1))-
[0054] This implies the following changes in the drain-source voltage V
DS of transistor M
1, as shown in the sixth chronogram from the top of Figure 5, on the left side, and
on the right side, respectively, wherein the substantially constant value V
C2 stored in capacitor C
2 is represented by a horizontal dotted line:
- when VGS(Φ2) < VGS(Φ1), then voltage VDS of M1 increases from voltage value VC2; and, conversely,
- in the opposite case when VGS(Φ2) > VGS(Φ1), then the drain voltage VDS of M1 decreases from the value VC2 stored in capacitor C2.
[0055] Let us now concentrate on the operation of the auto-zero comparator.
[0056] In phase Φ
1, the switch SW
4 is closed thereby connecting the output voltage of the AO to its inverting, i.e.,
negative or "-" input. The AO is thus configured to operate as a voltage follower,
as already stated above. Its output voltage, which thus corresponds to the V
HZ voltage plus any offset value of the AO, is charged into capacitor C
2.
[0057] In phase Φ
2, the switch SW
4 is open and the AO thus operates as a comparator, whereby its output voltage is at
+V
sat if V
HZ > V
C2, and at -V
sat if V
HZ < V
C2, where +V
sat and -V
sat are the positive and negative saturation voltages, respectively, of the AO, which
corresponds to its high supply voltage and its low supply voltage, respectively. In
one example, the high supply voltage corresponds to the battery voltage V
l of the device, and the low supply voltage corresponds to the potential of the ground
GND, namely 0 Volt.
[0058] To summarize, and as is illustrated by the last chronogram at the bottom of Figure
5, the output voltage V
OUT of the comparator is:
- at voltage VC2 during phase Φ1, said voltage VC2 being substantially constant and mainly defined by the current I0 output by current source 61;
- at voltage +Vsat = Vl (where Vl is, e.g., the battery voltage) during phase Φ2 in the case where VDS(t=TCLK) > 0, namely in the inverted coil current mode of operation of the DC/DC converter;
and,
- at voltage -Vsat (e.g 0 Volt) during phase Φ2 in the case where VDS(t=TCLK) < 0, namely in the CCM mode of operation of the converter.
[0059] In other words, the output signal V
OUT at the output of the zero-current detector 30 is indicative of the polarity of the
drain-source voltage V
DS(t=TCLK) of the power transistor M
2 at the end of its conduction phase Φ
1. Yet in other words, this output signal V
OUT is representative of the result of the CCM/DCM boundary detection. Signal V
OUT is used by the switch driving circuit 20 as shown in Figure 20, for defining the
best switch strategy depending on the particular requirements of the contemplated
application.
[0060] As can be understood by the one with ordinary skills in the art, using an auto-zero
comparator as described above allows removing the effect of any offset of the AO,
thus achieving an offset-free comparison result.
[0061] Besides, as the input voltage variation in gate-source voltage V
GS of transistor M
1 from phase Φ
1 to phase Φ
2 can be very low, the voltage excursion in the V
HZ node during phase Φ
2 can be very slow. Nevertheless, one further advantage of the association of the dynamic
current mirror with an auto-zero comparator is that voltage V
HZ(Φ2) is compared with voltage V
HZ(Φ1) (stored in C
2) by the auto-zero comparator whose output response is very fast. Therefore, as illustrated
by the fifth, sixth and seventh chronograms from the top of Figure 5 showing voltages
V
C1, V
HZ, and V
OUT, respectively, even a slow voltage ramp can be detected substantially immediately
after the end of phase Φ
1 and beginning of phase Φ
2. This is due to the fact, that the comparator is pre-biased,
i.e. the starting-point of its output voltage variation is from an intermediate voltage
value V
C2. This effects allow obtaining the comparison result in a very short time compared
to the standard solutions.
[0062] Further improvements of the proposed design will now be described with reference
to the more elaborated schematic circuit diagram of Figure 6.
[0063] One key aspect of the accuracy of proposed solution as described above is to protect
the capacitor voltage V
C1 during the switching from phase Φ
1 to phase Φ
2. This is because the capacitor C
1 stores the information about the compared voltage V
DS of the power NMOS transistor M
2 of the DC-DC converter, and it is critical not to alter this information V
DS(=TCLK) at the end of the conduction phase Φ
1 of the power transistor M
2.
[0064] It will be noted that small amount of error current is passing through capacitor
C
1. This is due to the constant voltage at the plate (2) given by Eq.(2), and a small
variation of the V
DS(M2) during the conduction of the NMOS transistor M
2. This variation is caused by the triangular shape of I
L (see shape of V
C(1) in the fifth graph from top of Figure 5). As a result, in order to bring this current
to a few nanoampers, the value of capacitor C
1 should be very small, for instance 1 pF, or even less. This, however, makes the V
C1 voltage sensitive due to the possible charge injection caused by the switching. It
will be appreciated that this is not valid for C
2 which can thus have a higher value.
[0065] Thus, some refinements of the basic design may be implemented, which will now be
explained in more details. It will be appreciated, however, that these further embodiments
may or not be implemented, either separately or in combination, in any manner suitable
for the specific implementation. Stated otherwise, these further embodiments provide
additional advantages but are not necessary for implementing the inventive principle
of the proposed solution.
[0066] In one embodiment, for instance, provision can be made of a regulated cascode arrangement
63 for stabilising the V
DS voltage of transistor M
1. This solution allows preventing eventual detection errors which may be caused by
the charge injection through the drain-to-gate parasitic capacitance of transistor
M
1.
[0067] This result may be achieved by the stabilisation of V
DS voltage of M
1 with the help of at least one cascode stage in the dynamic current mirror, said cascode
stage comprising two additional transistors M
3 and M
4. The source of M
3 is connected to the source of the main transistor M
1, its drain being connected to the battery voltage through an additional current source
62 delivering an additional constant current I
Aux, and it control gate being connected to the drain of the main transistor M
1. Transistor M
4 is cascaded with transistor M
1, i.e. arranged in series within the drain path of transistor M
1. More precisely, transistor M
4 is connected by its source to the drain of transistor M
1, and by its drain to the main current source 61 which delivers the main current I
0, having its control gate connected to the drain of transistor M
3 in the current path comprising the additional current source 62.
[0068] The stabilisation effect of this cascode arrangement is obtained at the cost of consumption
of a small additional current I
AUX of e.g. a few micro-amperes (µA).
[0069] In other embodiments, dummy switches may be used to prevent the "clock feed-through"
effect from the clock signals. By "dummy switches", it must be understood dummy transistors,
that is to say transistors of same technology as their associated main transistor,
and having their current path short-circuited, namely their drain permanently connected
to their source at silicon level. In the application considered here, the gate of
any dummy transistor used as dummy switch receives a control clock signal which is
complementary to the clock signal received by the gate of their associated main transistor.
[0070] For example, one or two such dummy switches may be associated to the third switch
SW
3. For example, these dummy switches may be dummy transistors which have a size 0.5xW
and 1xL, as compared with the size W and L of the main transistor M
5 of switch SW
3, respectively, and are provided in the current path of said main transistor M
5. In the shown example, one such dummy transistor is connected on each side of transistor
M
5, namely on the drain side and the other on the source side of M
5. The former is adapted to prevent charge injection from transistor M
5 to the second capacitor C
2, and the latter is adapted to prevent charge injection from transistor M
5 to the first capacitor C
1. To that end, these dummy transistors are each controlled by the clock signal Φ
2 which is complementary to the clock signal Φ
1 controlling the transistor M
5 which implements the control switch SW
3.
[0071] It shall be appreciated that, other and possibly all control switches used in the
zero-current may have one or two associated dummy switches. For instance, a dummy
transistor may also be associated to the transistor M
12 of switch SW
4, as shown in Figure 6 as well. More precisely, a dummy transistor is provided in
the current path of the transistor M
12 implementing the control switch SW
4, on the side of the second capacitor C
2, said dummy transistor being controlled by the clock signal Φ
2 which is complementary to the clock signal Φ
1 controlling said main transistor implementing the fourth control switch. Being so
arranged, the dummy transistor associated with transistor M
12 of switch SW
4 is adapted to prevent charge injection from said transistor M
12 to the second capacitor C
2.
[0072] In still other embodiments, provision can be made of a serially connected series
and shunt switching arrangement 64, avoiding leakage of the inductor voltage V
LX at the drain of the power NMOS transistor M
2 when its body-diode is conducting.
[0073] In the shown example, such series and shunt switching arrangement is implemented
at the first switch SW
1. Stated otherwise, the circuit comprises a series and shunt switching arrangement
associated to the first switch SW
1. It may thus comprise, in addition to the serially connected transistor M
7 of switch SW
1 as described above, another serially connected transistor NMOS M
6 which is controlled by the same clock signal Φ
1 as transistor M
7, and a parallel connected (i.e. shunt) NMOS transistor M
8 controlled by a clock signal which is complementary to Φ
1, for instance by the clock signal Φ
2.
[0074] In yet other embodiments, the clock signals Φ
1 and Φ
2 are generated by the switch driving circuit so as to be slightly non-overlapping,
in order to avoid the cross-conduction current through the switches SW
2 and SW
3. By "non-overlapping" it must be understood that both signals are not active, i.e.
for instance at the logical high state, at the same time. As shown by the three first
chronograms from the top of Figure 5, clock signals Φ
1 and Φ
2 are driven by the NMOS control signal CMD_N instead of control voltage Vg_N. This
allows sampling the drain-source voltage V
DS(t=TCLK) of the NMOS transistor M
1 at the end of phase Φ
1 slightly before the end of the transistor conduction, when the power stage 10 is
still in steady-state.
[0075] In further embodiments the voltage polarity detection circuit may further comprise
a reference ground switching arrangement 65. This allows that that the reference ground
is the power ground GND_POWER of the power stage of the DC/DC converter during the
first phase of operation Φ
1, and is a "clean" ground GND_CLEAN, distinct from said power ground, during the second
phase of operation Φ
2. Indeed, it is better that the reference ground of the voltage polarity detection
circuit be the power ground of the power stage of the DC/DC converter during the first
phase of operation Φ
1 because this provides a better accuracy of the copy of the drain-source voltage V
DS(M2) of the power MOS transistor M
2 in the first transistor C
1. However, in the remaining of the time, that is to say during the second phase of
operation Φ
2, it is better that the reference ground the voltage polarity detection circuit be
distinct from the power ground of the power stage of the DC/DC converter, because
the latter may vary depending on the load current and may convey various kinds of
interferences.
[0076] This result may be achieved, as shown in Figure 4, by providing in the reference
ground switching arrangement 65, a first NMOS transistor M
10 in series between the source of the main transistor M
1 of the dynamic current source and the clean ground GND_CLEAN terminal, which is controlled
by signal Φ
2, and a second NMOS transistor M
11 in series between the source of transistor M
1 and the power ground GND_POWER terminal of the power stage 10, said transistor M
11 being controlled by signal Φ
1.
[0077] Finally, some embodiments may implement a dynamic bias in order to provide very low
current consumption. According to such embodiments, the circuit is powered during
the first phase of operation Φ
1 of the DC/DC converter, only until the voltage V
HZ at the first input of the auto-zero comparator crosses the voltage V
C2 at the second input of said auto-zero comparator, and is then turned off to save
current consumption until the beginning of the next conduction cycle of the power
switch M
2 of the DC/DC converter, that is to say until the beginning of the next iteration
of the first phase of operation Φ
1 of the DC/DC converter. In other words, the circuit is switched off and is placed
e.g. in a sleep mode, until the beginning of the next NMOS conduction cycle.
[0078] The design presented above has a major impact on the efficiency and reliability of
the DC/DC converter for e.g. mobile-phone platforms. Using such architecture can bring
a significant advancement compared to existing solutions and can also find usage in
similar products, such as any type of wireless devices.
[0079] The block diagram in Figure 7 shows the elements of a wireless device 100 incorporating
a DC/DC converter 110 as described above. Such a device 100 can be a mobile telephone,
a smart phone, a digital audio player, a PDA, an e-book reader, or any other battery
powered device.
[0080] The device 100 as shown comprises a control unit 101 such as a processor (CPU), and
a number of functional units such as, for instance, a communication unit 102 for transmitting
and receiving information to and from the outside, in particular by modulating a radio
frequency carrier, a memory 103 which can store information in digital form, for example
a piece of music, etc. The processor 101 communicates with the functional units like
102 and 103, via a communication bus 120. Each of the CPU and the functional units
is powered from the battery voltage Vbat delivered by a battery 106, through a Power
Management Unit (PMU) 130.
[0081] To generate supply voltages from the battery voltage Vbat, the PMU 130 comprises
at least one voltage DC/DC converter 131 of the SMPS type, for which embodiments have
been described above. More than one such DC/DC converter may be provided for generating
a plurality of supply voltages Vdd1, Vdd2, ... of different values for e.g. supplying
respective groups of functional units, and/or respective functional blocks thereof.
The DC/DC converters may be of any one of the buck, boost or buck-boost type, as previously
described with reference to Figures 1A-1C.
[0082] Unless otherwise defined, all terms (including technical and scientific terms) used
herein have the same meaning as commonly understood by one of ordinary skill in the
art to which inventive concepts belong. It will be further understood that terms,
such as those defined in commonly used dictionaries, should be interpreted as having
a meaning that is consistent with their meaning in the context of the relevant art
and will not be interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0083] It will be further understood that, although the terms first, second, third, etc.
may be used herein to describe various elements, components, regions, layers and/or
sections, these elements, components, regions, layers and/or sections should not be
limited by these terms. These terms are only used to distinguish one element, component,
region, layer or section from another region, layer or section. Thus, a first element,
component, region, layer or section discussed below could be termed a second element,
component, region, layer or section without departing from the teachings of inventive
concepts.
[0084] The terminology used herein is for the purpose of describing particular embodiments
only and is not intended to be limiting of inventive concepts. As used herein, the
singular forms "a," "an" and "the" are intended to include the plural aims as well,
unless the context clearly indicates otherwise.
[0085] Also; expressions such as "comprise", "include", "incorporate", "contain", "is" and
"have" are to be construed in a non-exclusive manner when interpreting the description
and its associated claims, namely construed to allow for other items or components
which are not explicitly defined also to be present. Reference to the singular is
also to be construed in be a reference to the plural and vice versa.
[0086] While there has been illustrated and described what are presently considered to be
the preferred embodiments of the present invention, it will be understood by those
skilled in the art that various other modifications may be made, and equivalents may
be substituted, without departing from the true scope of the present invention. Additionally,
many modifications may be made to adapt a particular situation to the teachings of
the present invention without departing from the central inventive concept described
herein. Furthermore, an embodiment of the present invention may not include all of
the features described above. Therefore, it is intended that the present invention
not be limited to the particular embodiments disclosed, but that the invention include
all embodiments falling within the scope of the appended claims.
[0087] The present invention can be implemented in hardware, software, or a combination
of hardware and software. Any processor, controller, or other apparatus adapted for
carrying out the functionality described herein is suitable. A typical combination
of hardware and software could include a general purpose microprocessor (or controller)
with a computer program that, when loaded and executed, carries out the functionality
described herein.
[0088] The present invention can also be embedded in a computer program product, which comprises
all the features enabling the implementation of the methods described herein, and
which - when loaded in an information processing system - is able to carry out these
methods. Computer program means or computer program in the present context mean any
expression, in any language, code or notation, of a set of instructions intended to
cause a system having an information processing capability to perform a particular
function either directly or after either or both of the following a) conversion to
another language. Such a computer program can be stored on a computer or machine readable
medium allowing data, instructions, messages or message packets, and other machine
readable information to be read from the medium. The computer or machine readable
medium may include non-volatile memory, such as ROM, Flash memory, Disk drive memory,
CD-ROM, and other permanent storage. Additionally, a computer or machine readable
medium may include, for example, volatile storage such as RAM, buffers, cache memory,
and network circuits. Furthermore, the computer or machine readable medium may comprise
computer or machine readable information in a transitory state medium such as a network
link and/or a network interface, including a wired network or a wireless network,
that allow a device to read such computer or machine readable information.
[0089] A person skilled in the art will readily appreciate that various parameters disclosed
in the description may be modified and that various embodiments disclosed and/or claimed
may be combined without departing from the scope of the invention.
[0090] It is stipulated that the reference signs in the claims do not limit the scope of
the claims, but are merely inserted to enhance the legibility of the claims.
1. Spannungspolaritäts-Erfassungsschaltung (30), umfassend:
einen Eingang (31), der konfiguriert ist, um eine Eingangsspannung (VLx) zu empfangen,
die für die Leitungsspannung eines Leistungsschalters-FET repräsentativ ist;
einen Ausgang (32), der konfiguriert ist, um ein Spannungspolaritätserfassungssignal
auszugeben;
eine Stromquelle (61), die angepasst ist, um einen Konstantstrom (I0) auszugeben;
einen MOS-Transistor (M1) aufweisend:
- einen Drain, der mit der Stromquelle verbunden ist, um den Konstantstrom zu empfangen,
- ein Gate, das über einen ersten Kondensator (C1) und einen ersten Steuerschalter
(SW1) mit dem Eingang, über einen dritten Steuerschalter (SW3) mit seinem Drain und
über den ersten Kondensator (C1) und einen zweiten Steuerschalter (SW2) mit einer
ersten Stromversorgung (GND) verbunden ist; und
- eine Quelle, die mit der ersten Stromversorgung (GND) verbunden ist;
dadurch gekennzeichnet, dass die Spannungspolaritäts-Erfassungsschaltung (30) weiter umfasst:
einen Vergleicher, umfassend einen Operationsverstärker (OA), aufweisend:
- einen nichtinvertierenden Eingang, der mit dem Drain des MOS-Transistors verbunden
ist,
- einen invertierenden Eingang, der über einen zweiten Kondensator (C2) mit der ersten
Stromversorgung (GND) verbunden ist, und
- einen Ausgang, der mit dem nicht-invertierenden Eingang über einen vierten Steuerschalter
(SW4) und mit dem Ausgang (32) verbunden ist; wobei die Spannungspolaritäts-Erfassungsschaltung
(30) so konfiguriert ist, dass:
während einer ersten Betriebsphase (ϕ1), die einem Leitungszyklus des Leistungsschalters-FET entspricht, der erste, zweite
und vierte Steuerschalter geschlossen sind und der dritte Steuerschalter geöffnet
ist, sodass eine Ausgangsspannung (VHz) des MOS-Transistors (M1) in den zweiten Kondensator (C2) geladen wird; und
während einer zweiten Betriebsphase (φ2), die einem Nichtleitungszyklus des Leistungsschalters-FET entspricht; der erste,
zweite und vierte Steuerschalter geöffnet sind und der dritte Steuerschalter geschlossen
ist, und die Polarität der Eingangsspannung (VLx) am Ende der ersten Betriebsphase
durch Vergleichen der im zweiten Kondensator gespeicherten Spannung mit der Ausgangsspannung
(VHz) des MOS-Transistors erfasst wird; und wobei
der erste, zweite und vierte Steuerschalter durch ein erstes Taktsignal und der dritte
Steuerschalter durch ein zweites Taktsignal gesteuert werden, das zu dem ersten Taktsignal
komplementär ist.
2. Spannungspolaritäts-Erfassungsschaltung nach Anspruch 1, weiter umfassend eine Kaskodenstufe
mit einem ersten zusätzlichen MOS-Transistor (M3), dessen Quelle mit der Quelle des MOS-Haupttransistors (M1) verbunden ist, dessen Drain mit einer zusätzlichen Stromquelle (62) verbunden ist,
die angepasst ist, einen zusätzlichen Konstantstrom (Iaux) ausgeben kann, und dessen Steuer-Gate mit dem Drain des Haupttransistors (M1) verbunden ist, sowie einen zweiten zusätzlichen MOS-Transistor (M4), dessen Quelle mit dem Drain des Haupttransistors (M1) verbunden ist, dessen Drain mit der Hauptstromquelle (61) zum Empfangen des Hauptkonstantstroms
(I0) und dessen Steuer-Gate mit dem Drain des ersten zusätzlichen Transistors (M3) verbunden ist.
3. Spannungspolaritäts-Erfassungsschaltung nach Anspruch 1 oder 2, wobei der dritte Steuerschalter
(SW3) durch einen Haupttransistor (M5) implementiert ist, wobei die Spannungspolaritäts-Erfassungsschaltung weiter einen
ersten und/oder einen zweiten Blindtransistor umfasst, der in dem Strompfad des Haupttransistors
bereitgestellt ist, der den dritten Steuerschalter implementiert, jeweils auf jeder
Seite des Haupttransistors, der den dritten Steuerschalter implementiert, nämlich
jeweils auf der Drain-Seite und auf der Quellenseite des Haupttransistors, wobei die
ersten und/oder zweiten Blindtransistoren jeweils durch das erste Taktsignal gesteuert
werden.
4. Spannungspolaritäts-Erfassungsschaltung nach Anspruch 3, wobei die ersten und/oder
zweiten Blindtransistoren eine Größe von 0,5xW und 1xL, jeweils verglichen mit der
Größe W und L des Haupttransistors, aufweisen.
5. Spannungspolaritäts-Erfassungsschaltung nach einem der Ansprüche 1 bis 4, wobei der
vierte Steuerschalter (SW4) durch einen Haupttransistor (M12) implementiert ist, wobei die Spannungspolaritäts-Erfassungsschaltung weiter einen
Blindtransistor umfasst, der im Strompfad des Haupttransistors, der den vierten Steuerschalter
implementiert, auf der Seite des zweiten Kondensators (C2) bereitgestellt ist, wobei der Blindtransistor durch das zweite Taktsignal gesteuert
wird.
6. Spannungspolaritäts-Erfassungsschaltung nach einem der Ansprüche 1 bis 5, wobei der
erste Steuerschalter (SW1) durch einen Haupttransistor (M7) implementiert ist, wobei die Spannungspolaritäts-Erfassungsschaltung weiter eine
Reihen- und Nebenschluss-Schaltanordnung (64) umfasst, die dem Haupttransistor zugeordnet
ist, der den ersten Steuerschalter (SW1) implementiert, wobei die Reihen- und Nebenschluss-Schaltanordnung zusätzlich zu
dem seriell verbundenen Haupttransistor (M7), der den ersten Steuerschalter (SW1) implementiert, einen weiteren seriell verbundenen Transistor (M8), der durch das gleiche erste Taktsignal (φ1) gesteuert wird wie der Haupttransistor (M7), der den ersten Steuerschalter (SW1) implementiert, und einen parallel verbundenen Transistor (M8), der durch das zweite Taktsignal (φ2) gesteuert wird, umfasst.
7. Spannungspolaritäts-Erfassungsschaltung nach einem der Ansprüche 1 bis 6, wobei die
beiden komplementären ersten und zweiten Taktsignale (φ1,φ2) nicht überlappend sind.
8. Spannungspolaritäts-Erfassungsschaltung nach einem der Ansprüche 1 bis 7, weiter umfassend
eine Bezugsmasse-Schaltungsanordnung (65), so angeordnet, dass die erste Stromversorgung
die Leistungsmasse der Leistungsstufe des DC/DC-Wandlers während der ersten Betriebsphase
(φ1) ist und sich von der Leistungsmasse während der zweiten Betriebsphase (φ2) unterscheidet.
9. Schaltung nach einem der Ansprüche 1 bis 6, wobei die Schaltung während der ersten
Betriebsphase (φ1) nur so lange mit Leistung versorgt wird, bis die Spannung (VHz) am ersten Eingang des Vergleichers die Spannung (Vc2) am zweiten Eingang des Vergleichers erreicht und dann bis zum Beginn des nächsten
Leitungszyklus des Leistungsschalters ausgeschaltet wird.
10. Ein DC/DC-Wandler, umfassend:
a. eine Leistungsstufe (10) aufweisend mindestens einen Leistungsschalter-FET (M2); und
b. mindestens eine Spannungspolaritäts-Erfassungsschaltung (30) nach einem der Ansprüche
1 bis 9.
11. DC/DC-Wandler nach Anspruch 11, wobei der Leistungsschalter-FET (SW1) einen Leistungs-Metall-Oxid-Halbleiter-, MOS-, Transistor (M1) umfasst und wobei die Eingangsspannung der Spannungspolaritäts-Erfassungsschaltung
(30) die Drain-Quelle-Spannung (VDs(M1)) des Leistungs-MOS-Transistors ist.
12. Mobilgerät, umfassend einen DC/DC-Wandler nach Anspruch 10 oder 11.