(19)
(11) EP 2 743 979 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
13.12.2017 Bulletin 2017/50

(43) Date of publication A2:
18.06.2014 Bulletin 2014/25

(21) Application number: 13193497.8

(22) Date of filing: 19.11.2013
(51) International Patent Classification (IPC): 
H01L 23/36(2006.01)
H01L 23/00(2006.01)
H01L 25/065(2006.01)
 H01L 23/367(2006.01)
H01L 23/31(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 17.12.2012 TW 101147925

(71) Applicant: Princo Corp.
Taiwan (CN)

(72) Inventor:
  • Yang, Chih-kuang
    300 Hsinchu (TW)

(74) Representative: Petraz, Gilberto Luigi et al
GLP S.r.l.
Viale Europa Unita, 171 33100 Udine
Viale Europa Unita, 171 33100 Udine (IT)

   


(54) Chip thermal dissipation structure


(57) Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board.







Search report












Search report