(19)
(11) EP 2 746 876 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
10.01.2018 Bulletin 2018/02

(43) Date of publication A2:
25.06.2014 Bulletin 2014/26

(21) Application number: 13181421.2

(22) Date of filing: 22.08.2013
(51) International Patent Classification (IPC): 
G04F 5/14(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 29.10.2012 US 201213662850

(71) Applicant: Honeywell International Inc.
Morris Plains, NJ 07950 (US)

(72) Inventors:
  • Younger, Daniel W.
    Morristown, NJ 07962-2245 (US)
  • Ridley, Jeff A.
    Morristown, NJ 07962-2245 (US)
  • Lu, Son T.
    Morristown, NJ 07962-2245 (US)

(74) Representative: Houghton, Mark Phillip 
Patent Outsourcing Limited 1 King Street
Bakewell, Derbyshire DE45 1DZ
Bakewell, Derbyshire DE45 1DZ (GB)

   


(54) FABRICATION TECHNIQUES TO ENHANCE PRESSURE UNIFORMITY IN ANODICALLY BONDED VAPOR CELLS


(57) A method of fabricating one or more vapor cells comprises forming one or more vapor cell dies in a first wafer having a first diameter, and anodically bonding a second wafer to a first side of the first wafer over the vapor cell dies, the second wafer having a second diameter. A third wafer is positioned over the vapor cell dies on a second side of the first wafer opposite from the second wafer, with the third wafer having a third diameter. A sacrificial wafer is placed over the third wafer, with the sacrificial wafer having a diameter that is larger than the first, second and third diameters. A metallized bond plate is located over the sacrificial wafer. The third wafer is anodically bonded to the second side of the first wafer when a voltage is applied to the metallized bond plate while the sacrificial wafer is in place.







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