(19)
(11) EP 2 748 849 A2

(12)

(88) Date of publication A3:
24.10.2013

(43) Date of publication:
02.07.2014 Bulletin 2014/27

(21) Application number: 12854047.3

(22) Date of filing: 24.08.2012
(51) International Patent Classification (IPC): 
H01L 21/8238(2006.01)
H01L 21/205(2006.01)
H01L 21/20(2006.01)
(86) International application number:
PCT/US2012/052264
(87) International publication number:
WO 2013/081694 (06.06.2013 Gazette 2013/23)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 25.08.2011 US 201113218308
25.08.2011 US 201113218273
25.08.2011 US 201113218335
25.08.2011 US 201113218345
25.08.2011 US 201113218352
25.08.2011 US 201113218292

(71) Applicant: Aeroflex Colorado Springs Inc.
Colorado Springs CO 80907-3486 (US)

(72) Inventors:
  • KERWIN, David B.
    Colorado Springs, Colorado 80919 (US)
  • BENEDETTO, Joseph M.
    Monument, Colorado 80132 (US)

(74) Representative: Freeman, Jacqueline Carol 
WP Thompson 55 Drury Lane
London WC2B 5SQ
London WC2B 5SQ (GB)

   


(54) WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING