(19)
(11) EP 2 783 395 A1

(12)

(43) Date of publication:
01.10.2014 Bulletin 2014/40

(21) Application number: 12851847.9

(22) Date of filing: 07.11.2012
(51) International Patent Classification (IPC): 
H01L 29/84(2006.01)
(86) International application number:
PCT/US2012/063901
(87) International publication number:
WO 2013/078006 (30.05.2013 Gazette 2013/22)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 23.11.2011 US 201161563455 P
26.03.2012 US 201213430528

(71) Applicant: S3C, Inc.
Sunnyvale, CA 94089 (US)

(72) Inventors:
  • NZEADIBE, Ihioma, U.
    Brentwood, CA 94513 (US)
  • HUSSAIN, Javed
    Cupertino, CA 95014 (US)
  • CASTAGNA, Joseph
    San Jose, CA 95123 (US)
  • YUAN, Li
    Fremont, CA 94539 (US)
  • HORTON, Roger
    Sunnyvale, CA 94086 (US)

(74) Representative: Smith, Jeremy Robert et al
Kilburn & Strode LLP 20 Red Lion Street
London WC1R 4PJ
London WC1R 4PJ (GB)

   


(54) MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT