(19)
(11) EP 2 797 342 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
11.02.2015 Bulletin 2015/07

(43) Date of publication:
29.10.2014 Bulletin 2014/44

(21) Application number: 13004359.9

(22) Date of filing: 05.09.2013
(51) International Patent Classification (IPC): 
H04R 9/04(2006.01)
H04R 7/04(2006.01)
 H04R 31/00(2006.01)
H04R 7/14(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 25.04.2013 KR 20130046102

(71) Applicant: Em-tech. Co., Ltd.
Busan 609-390 (KR)

(72) Inventors:
  • Kim, Ji Hoon
    621-833 Gyeongsangnam-do (KR)
  • Kwon, Joong Hak
    609-843 Busan (KR)
  • Lee, Jung Hyung
    642-955 Gyeongsangnam-do (KR)
  • Oh, Hyeon Taek
    636-922 Gyeongsangnam-do (KR)

(74) Representative: Müller - Hoffmann & Partner 
Patentanwälte St.-Martin-Strasse 58
81541 München
81541 München (DE)

   


(54) Bonding structure of diaphragm for microspeaker


(57) The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.