(19)
(11) EP 2 823 084 A1

(12)

(43) Date of publication:
14.01.2015 Bulletin 2015/03

(21) Application number: 13710864.3

(22) Date of filing: 21.03.2013
(51) International Patent Classification (IPC): 
C23C 18/20(2006.01)
(86) International application number:
PCT/EP2013/055901
(87) International publication number:
WO 2013/143961 (03.10.2013 Gazette 2013/40)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 29.03.2012 EP 12075036

(71) Applicant: Atotech Deutschland GmbH
10553 Berlin (DE)

(72) Inventors:
  • TEWS, Dirk
    10318 Berlin (DE)
  • MICHALIK, Fabian
    10317 Berlin (DE)
  • GIL IBÀNEZ, Belen
    10717 Berlin (DE)
  • BRANDT, Lutz
    10559 Berlin (DE)
  • HSIEH, Meng Che
    Lone Tree, 80124 Colorado (US)
  • ZHIMING, Liu
    Englewood, 80111 Colorado (US)

(74) Representative: Wonnemann, Jörg 
Atotech Deutschland GmbH Patent Management Erasmusstraße 20
10553 Berlin
10553 Berlin (DE)

   


(54) METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS