BACKGROUND
Technical Field
[0001] The present application relates to the technical field of aluminum or aluminum alloy
surface processing, and in particular to a micro-nano processing method of an aluminum
alloy surface, a method for integrating aluminum or an aluminum alloy and a plastic,
and an aluminum or aluminum alloy structure.
Related Art
[0002] In a nano-molding technique, nano-holes are formed on a surface of a metal through
chemical or electrochemical etching, and a micro-nano porous structure having a form
similar to a coral reef is formed on the surface of the metal by selecting a special
etching solution. Next, a treated metal piece is placed in a mold for in-mold injection
molding, where a plastic component is directly injected onto the surface of the metal
and solidified, and by means of a mechanical interlocking effect of the micro-nano
porous structure, a plastic is closely combined to the surface of the metal. Finally,
all modification processing for a surface of a metal can be performed on the injection
molded piece removed from the mold. Through such micro-nano treatment on the surface
of the metal, plane bonding between the metal and the plastic can be achieved, so
that a metal-plastic bonding process is omitted. This nano-molding technique is mainly
applied in metal-plastic integration bonding. During existing current micro-nano treatment
of an aluminum alloy surface, a used etching solution contains a large amount of organic
ingredients that may pollute the environment, and the processing efficiency and effect
of nano-holes are far from desirable.
SUMMARY
[0003] In order to overcome the deficiencies in the prior art, an object of the present
application is to provide a micro-nano processing method of an aluminum or aluminum
alloy surface, which effectively solves problems of environmental pollution caused
by organics, and meanwhile, improve micro-nano hole processing efficiency and improve
processing quality.
[0004] Another object is to provide a method for integrating aluminum or an aluminum alloy
and a plastic, which has the advantages described above.
[0005] Yet another object is to provide an aluminum or aluminum alloy structure, having
micro-nano holes formed on a surface of the aluminum or aluminum alloy structure by
using the method described above.
[0006] In order to achieve the objects, the present application employs the following technical
solutions:
A micro-nano processing method of an aluminum or aluminum alloy surface includes a
step of placing aluminum or an aluminum alloy as an anode in an electrolyte containing
hydrochloric acid, sulfuric acid, phosphoric acid, and an etching inhibitor for DC
electrochemical etching, where the concentration of hydrochloric acid is 1.5 to 3
mol/L, the concentration of sulfuric acid is 0.9 to 1.2 mol/L, and the concentration
of phosphoric acid is 0.6 to 1 mol/L.
[0007] The following technical solutions may be further employed:
[0008] In some embodiments, the concentration of the etching inhibitor is 0.5 to 2.0 g/L.
[0009] In some embodiments, the etching inhibitor may be an organic etching inhibitor such
as thiourea, methyl cellulose, morpholine, butyl amine, cyclohexylamine, cyclohexanol,
ethylene diamine, triethylene tetramine, and derivatives thereof, or an inorganic
salt such as copper sulfate, potassium iodide, and potassium bromide.
[0010] In some embodiments, the etching current density is 0.1 to 0.4 A/cm
2, the temperature of the etching solution is 25°C to 70°C, and the powered etching
time is 10s to 100s.
[0011] Preferably, the temperature of the etching solution is 40°C to 70°C, and the powered
etching time is 30s to 80s.
[0012] In some embodiments, before DC electrochemical etching, the aluminum or aluminum
alloy surface is treated with an alkali solution.
[0013] Preferably, the aluminum or aluminum alloy surface is immersed in a NaOH solution
having a mass concentration of 2% to 4% for 2 to 6 min.
[0014] In some embodiments, before DC electrochemical etching, the aluminum or aluminum
alloy surface is treated with an acid solution.
[0015] Preferably, the aluminum or aluminum alloy surface is immersed in a HNO3 solution
having a mass concentration of 1% to 4% for 1 to 4 min.
[0016] A method for integrating aluminum or an aluminum alloy and a plastic includes the
following steps:
forming a micro-nano porous structure on an aluminum or aluminum alloy surface by
using the micro-nano processing method; and
closely combining a plastic and the aluminum or aluminum alloy surface by means of
the micro-nano porous structure.
[0017] An aluminum or aluminum alloy structure has a micro-nano porous structure formed
on the surface of the aluminum or aluminum alloy structure by using the micro-nano
processing method.
[0018] The present application has the following beneficial technical effects:
According to the present application, an electrolyte containing inorganic acid components
of 1.5 to 3 mol/L hydrochloric acid, 0.9 to 1.2 mol/L sulfuric acid, and 0.6 to 1
mol/L phosphoric acid and an etching inhibitor is used to perform DC electrochemical
etching on aluminum or an aluminum alloy, the hole distribution of the resulting micro-nano
porous structure is even and uniform, and the processing is rapid and efficient; moreover,
problems of environmental pollution caused by organic components contained in the
etching solution used in the prior art are completely eliminated. The processing method
of the present application has the advantages of being rapid and safe, simple process
and desirable controllability. The micro-nano porous structure formed on the aluminum
or aluminum alloy surface by using the present application makes integration of the
aluminum or aluminum alloy structure and a plastic easier, and after injection molding,
a metal-plastic component having a high bonding strength may be obtained, thereby
achieving combined preparation of integration of an aluminum alloy and a plastic in
an environmental friendly and high efficient manner.
[0019] According to a preferred embodiment, for the electrolyte containing the special inorganic
components, at a temperature of the etching solution of 25°C to 70°C, particularly,
40°C to 70°C and using an etching current density of 0.1 to 0.4 A/cm
2, powered etching lasts 10s to 100s, and preferably 30s to 80s; in this way, optimal
processing effect may be obtained.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present application will become more fully understood from the detailed description
given herein below for illustration only, and thus are not limitative of the present
application, and wherein:
FIG. 1 is an electron micrograph of an aluminum alloy plate (A5052) after etching
obtained according to an embodiment of the present application;
FIG. 2 is a high-power electron micrograph of an aluminum alloy plate (A5052) after
etching obtained according to an embodiment of the present application;
FIG. 3 is an electron micrograph of an aluminum alloy plate (A6063) after etching
obtained according to an embodiment of the present application;
FIG. 4 is a high-power electron micrograph of an aluminum alloy plate (A6063) after
etching obtained according to an embodiment of the present application;
FIG. 5 is an electron micrograph of an aluminum foil after etching obtained according
to an embodiment of the present application; and
FIG. 6 is a high-power electron micrograph of an aluminum foil after etching obtained
according to an embodiment of the present application.
DETAILED DESCRIPTION
[0021] In the following, the present application is further described in detail with reference
to preferred embodiments.
[0022] In the following, the embodiments of the present application are described in detail
with reference to the accompanying drawings. It should be emphasized that the description
below is merely exemplary, but not intended to limit the scope and application of
the present application.
[0023] Referring to FIG. 1, in some specific embodiments, a micro-nano processing method
of an aluminum or aluminum alloy surface includes the following process:
(1) Sample preparation
[0024] Aluminum or an aluminum alloy (such as 1000-7000 series aluminum alloys) is processed
into a desired shape and size, and a fit jig is designed according to the product.
(2) Sample pretreatment
[0025] The pretreatment process may be performed in the following manner:
- 1) The aluminum or aluminum alloy surface is polished by using different types of
sandpaper to remove an oxide layer generated during storage of the aluminum or aluminum
alloy, so as to obtain a new surface, or the oxide layer on the surface may be removed
by using a chemical cleaning method.
- 2) Degreasing treatment
[0026] The aluminum or aluminum alloy surface is cleaned with a solution of a detergent
and water to remove grease from the surface, is then cleaned with distilled water,
and then dried in a vacuum oven at 120°C.
3) Treatment with alkali solution
[0027] The part that does not need to be etched may be first protected through coating with
paraffin wax, and the aluminum or an aluminum alloy is then immersed in a NaOH solution
for several minutes, where the mass concentration of NaOH is preferably 2% to 4%,
and the immersion time is preferably 2 to 6 min.
4) Treatment with acid solution
[0028] The aluminum or aluminum alloy is immersed in a HNO3 solution for several minutes,
where the mass concentration of HNO
3 is preferably 1% to 4%, and the immersion time is preferably 1 to 4 min.
[0029] Since the state of the aluminum or aluminum alloy surface has important influence
on the subsequent etching process, through the pretreatment on the aluminum or aluminum
alloy surface with the above steps, the grease and oxide layer on the surface may
be effectively removed, and the surface is activated, thereby improving the effect
of subsequent electrochemical etching.
(3) DC electrochemical etching
[0030] This step is a critical step for micro-nano etching of the aluminum alloy surface.
An electrolyte of a certain concentration is formulated by hydrochloric acid, sulfuric
acid, and phosphoric acid, where the concentration of hydrochloric acid is 1.5 to
3 mol/L, the concentration of sulfuric acid is 0.9 to 1.2 mol/L, the concentration
of phosphoric acid is 0.6 to 1 mol/L, a suitable amount of etching inhibitor is added,
and preferably, the concentration of the etching inhibitor is 0.5 to 2.0 g/L. The
electrolyte of the above formula may achieve the optimal etching inhibition effect.
The aluminum alloy sample after pretreatment is placed in the electrolyte as an anode,
the cathode may be an inert graphite or platinum electrode, the temperature of the
etching solution is controlled to be 25°C to 70°C, and preferably 40°C to 70°C, the
current density of the applied DC current is 0.1 A/cm
2 to 0.4 A/cm
2, and the powered time is 10s to 100s, and preferably 30s to 80s.
(4) Post-treatment
[0031] After etching, post-treatment can be implemented for cleaning and drying. For example,
the aluminum foil after DC electrochemical etching is cleaned with distilled water,
then immersed in alcohol or acetone for several seconds, and then dried in a drying
oven at 70°C.
[0032] Through the nano processing process of the aluminum or aluminum alloy surface according
to the embodiments, evenly distributed micro-nano holes whose hole diameters are between
50 nanometer to 20 micrometer are quickly generated on the aluminum or aluminum alloy
surface, thereby achieving environmental friendly, high-efficiency, and high-quality
nano molding of the aluminum or aluminum alloy surface.
[0033] Some other embodiments relate to a method for integrating aluminum or an aluminum
alloy and a plastic, where the method includes the following steps:
forming a micro-nano porous structure on an aluminum or aluminum alloy surface by
using the micro-nano processing method; and
closely combining a plastic and the aluminum or aluminum alloy surface by means of
the micro-nano porous structure.
[0034] Some other embodiments relate to an aluminum or aluminum alloy structure, having
a micro-nano porous structure formed on the surface of the aluminum or aluminum alloy
structure by using the micro-nano processing method.
[0035] In the following, features and advantages of the present application are further
demonstrated through several examples.
Example 1
[0036] A commercially available aluminum alloy plate A5052 having a thickness of 2 mm was
purchased and was evenly cut into aluminum sheets of 20 mm x 10 mm by using line cutting,
and the aluminum sheet was polished by using model 360#, 600# and 800# iron sand papers
in sequence. During polishing, each time when a sandpaper is changed, the sample needs
to be rotated by 900 degrees to ensure that all scratches left in a previous procedure
were worn off, so that the thickness of the polished sample reaches a level of about
5 µm. Next, the sample was cleaned for 10 min with ultrasonic waves in an ethanol
solution to remove the grease from the surface, and was then cleaned with deionized
water and dried in a drying oven at 120°C.
[0037] 100 ml NaOH solution having a mass concentration of 2% was formulated with ion exchange
water and heated to 40°C in water bath, and the aluminum alloy sheet was immersed
in the NaOH solution for 2 min in a suspended manner and then cleaned with deionized
water.
[0038] Next, 100 ml HNO
3 solution having a mass concentration of 1% was diluted with ion exchange water and
heated to 40°C in water bath, and the aluminum alloy sheet was immersed in the HNO
3 solution for 4 min in a suspended manner and then cleaned with deionized water.
[0039] Then, with the aluminum alloy sheet as an anode, a graphite sheet as a cathode, a
mixed solution in an electrolytic cell containing 1.5 mol/L hydrochloric acid, 0.9
mol/L sulfuric acid, and 0.6 mol/L phosphoric acid as an electrolyte, a certain etching
inhibitor was added, and the current density was controlled to be 0.15 A/cm
2 by a constant voltage DC source, the temperature of the electrolyte was 40°C, and
the powered time was 30s. Next, the aluminum alloy sheet was cleaned with deionized
water, then immersed for 5s in acetone, and dried in a drying oven at 70°C. Electron
micrographs of the aluminum alloy sheet after etching are shown in FIG. 1 and FIG.
2. It can be seen from the electron micrographs after etching that the hole diameter
of a large hole obtained on the etching surface is 1 to 3 micrometers, and a large
amount of nano holes having a hole diameter of 30 to 50 nanometers are evenly distributed.
Example 2
[0040] A commercially available aluminum alloy plate A6063 having a thickness of 2 mm was
purchased and was evenly cut into aluminum sheets of 20 mm x 10 mm by using line cutting.
A small hole was opened on each aluminum alloy sheet, and the surface of the aluminum
alloy sheet was polished by using model 360#, 600# and 800# iron sand papers in sequence.
During polishing, each time when a sandpaper is changed, the sample needs to be rotated
by 900 degrees, so as to ensure that all scratches left in a previous procedure were
worn off, so that the thickness of the polished sample reaches a level of about 5
µm. Next, the sample was cleaned for 10 min with ultrasonic waves in an ethanol solution
to remove grease from the surface, and then was cleaned with deionized water and dried
in a drying oven at 120°C.
[0041] 100 ml NaOH solution having a mass concentration of 2% was formulated with ion exchange
water and heated to 40°C in water bath, and the aluminum alloy sheet was immersed
in the NaOH solution for 2 min in a suspended manner and then cleaned with deionized
water.
[0042] Next, 100 ml mixed solution of HNO
3 having a mass concentration of 1% and HF having a mass concentration of 0.5% was
formulated with ion exchange water and heated to 40°C in water bath, and the aluminum
alloy sheet was immersed in the mixed solution for 1 min in a suspended manner and
then cleaned with deionized water.
[0043] Then, with the aluminum alloy sheet as an anode, the aluminum alloy sheet was treated
in an electrolyte formed by mixing 2 mol/L hydrochloric acid, 0.9 mol/L sulfuric acid,
0.8 mol/L phosphoric acid, 2.0 g/L polyethylene glycol, and 1.5 g/L thiourea for 70s,
where the etching current density was 0.3 A/cm
2,and the temperature of the electrolyte was 60°C. Next, the aluminum alloy sheet was
cleaned with deionized water, immersed in acetone for 5s, and then dried in a drying
oven at 70°C. Electron micrographs of the aluminum alloy sheet after etching are shown
in FIG. 3 and FIG. 4. It can be seen from the electron micrographs after etching that
the hole diameter of a large hole obtained on the etching surface is 1 to 3 micrometers,
and a large amount of nano holes having a hole diameter of 20 to 40 nanometers are
evenly distributed.
Example 3
[0044] A commercially available aluminum foil was purchased and was cut into thin sheets
of 20 mm x 10 mm. A small hoe was opened on each thin sheet, and the surface of the
thin sheet was directly polished by using a 800# iron sand paper; next, the thin sheet
was cleaned with ultrasonic waves for 10 min in an ethanol solution to remove the
grease on surface, and then was cleaned with deionized water and dried in a drying
oven at 120°C.
[0045] 100 ml NaOH solution having a mass concentration of 1.5% was formulated with ion
exchange water and heated to 40°C in water bath, and the aluminum foil sheet was immersed
in the NaOH solution for 2 min in a suspended manner and then cleaned with deionized
water.
[0046] Next, 100 ml HNO
3 solution having a mass concentration of 1% was diluted with ion exchange water and
heated to 40°C in water bath, and the aluminum foil sheet after being washed with
the alkali solution was immersed in the HNO
3 solution for 1 min in a suspended manner and then cleaned with deionized water.
[0047] Then, with the aluminum foil sheet as an anode and a graphite sheet as a cathode,
the aluminum foil sheet was treated for 70s in an electrolyte having an etching solution
including 2 mol/L hydrochloric acid, 0.9 mol/L sulfuric acid, 0.6 mol/L phosphoric
acid, and 0.4 g/L triethylene tetramine, where the temperature was maintained at 60°C,
and the applied DC current was 0.15A/cm
2. Next, the aluminum foil sheet was cleaned with deionized water, immersed in acetone
for 5s, and then dried in a drying oven at 70°C. Electron micrographs of the aluminum
foil sheet after etching are shown in FIG. 5 and FIG. 6. It can be seen from the electron
micrographs after etching that the hole diameter of a large hole obtained on the etching
surface is 1 to 5 micrometers, and a large amount of nano holes having a hole diameter
of 30 to 60 nanometers are evenly distributed.
[0048] It is verified by numerous other examples (which are not repeated herein), in the
electrolyte of the present application, it is feasible that the concentration of hydrochloric
acid is 1.5 to 3 mol/L, the concentration of sulfuric acid is 0.9 to 1.2 mol/L, and
the concentration of phosphoric acid is 0.6 to 1 mol/L; moreover, in the case that
the electrolyte of the present application is used, the temperature of the etching
solution is as low as 25°C, the etching current density is as low as 0.1 A/cm
2, and the continuous powered etching is as short as 10s, although the hole processing
effect is not ideal, a nano hole structure with desirable shapes and distribution
may be obtained.
[0049] In the above, the present application is further described in detail with reference
to the specific preferred embodiments, and it should not be construed that the specific
implementation of the present application is limited to these descriptions. Several
simple derivations and replacements may be made by persons of ordinary skill in the
art without departing from the concept of the present application should be considered
as falling within the protection scope of the present application.
1. A micro-nano processing method of an aluminum or aluminum alloy surface, comprising:
placing the aluminum or aluminum alloy as an anode in an electrolyte containing hydrochloric
acid, sulfuric acid, phosphoric acid, and an etching inhibitor for DC electrochemical
etching, wherein the concentration of hydrochloric acid is 1.5 to 3 mol/L, the concentration
of sulfuric acid is 0.9 to 1.2 mol/L, the concentration of phosphoric acid is 0.6
to 1 mol/L.
2. The micro-nano processing method according to claim 1, wherein the concentration of
the etching inhibitor is 0.5 to 2.0 g/L, the etching inhibitor is selected from thiourea,
methyl cellulose, morpholine, butyl amine, cyclohexylamine, cyclohexanol, ethylene
diamine, triethylene tetramine and derivatives thereof, or is selected from copper
sulfate, potassium iodide and potassium bromide.
3. The micro-nano processing method according to claim 1 or 2, wherein the etching current
density is 0.1 to 0.4 A/cm2, the temperature of the etching solution is 25°C to 70°C, and the powered etching
time is 10s to 100s.
4. The micro-nano processing method according to claim 3, wherein the temperature of
the etching solution is 40°C to 70°C, and the powered etching time is 30s to 80s.
5. The micro-nano processing method according to any one of claims 1 to 4, wherein, before
DC electrochemical etching, the aluminum or aluminum alloy surface is treated with
an alkali solution.
6. The micro-nano processing method according to claim 5, wherein the aluminum or aluminum
alloy surface is immersed in a NaOH solution having a mass concentration of 2% to
4% for 2 to 6 min.
7. The micro-nano processing method according to any one of claims 1 to 6, wherein, before
DC electrochemical etching, the aluminum or aluminum alloy surface is treated with
an acid solution.
8. The micro-nano processing method according to claim 7, wherein the aluminum or aluminum
alloy surface is immersed in a HNO3 solution having a mass concentration of 1% to
4% for 1 to 4 min.
9. A method for integrating aluminum or an aluminum alloy and a plastic, comprising:
forming a micro-nano porous structure on an aluminum or aluminum alloy surface by
using the micro-nano processing method according to any one of claims 1 to 8; and
closely combining a plastic and the aluminum or aluminum alloy surface by means of
the micro-nano porous structure.
10. An aluminum or aluminum alloy structure, having a micro-nano porous structure formed
on the surface by using the micro-nano processing method according to any one of claims
1 to 8.