(19)
(11) EP 2 837 490 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
21.11.2018 Bulletin 2018/47

(45) Mention of the grant of the patent:
26.09.2018 Bulletin 2018/39

(21) Application number: 13776372.8

(22) Date of filing: 09.04.2013
(51) International Patent Classification (IPC): 
B29C 65/14(2006.01)
B32B 27/36(2006.01)
B32B 37/02(2006.01)
B32B 37/20(2006.01)
B29C 59/14(2006.01)
B32B 27/08(2006.01)
B29C 65/00(2006.01)
 B32B 27/28(2006.01)
B32B 37/00(2006.01)
B32B 37/18(2006.01)
B32B 37/24(2006.01)
C08J 5/12(2006.01)
B32B 17/06(2006.01)
(86) International application number:
PCT/JP2013/060732
(87) International publication number:
WO 2013/154107 (17.10.2013 Gazette 2013/42)

(54)

METHOD FOR BONDING POLYMER FILM TO POLYMER FILM OR INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE

VERFAHREN ZUM BINDEN EINES POLYMERFILMS AN EINEN POLYMERFILM ODER AN EIN SUBSTRAT AUS ANORGANISCHEM MATERIAL, POLYMERFILMLAMINAT SOWIE LAMINAT AUS DEM POLYMERFILM UND DEM SUBSTRAT AUS ANORGANISCHEM MATERIAL

PROCÉDÉ DE LIAISON D'UN FILM POLYMÈRE À UN FILM POLYMÈRE OU À UN SUBSTRAT DE MATIÈRE INORGANIQUE, STRATIFIÉ DE FILM POLYMÈRE, ET STRATIFIÉ DE FILM POLYMÈRE ET SUBSTRAT DE MATIÈRE INORGANIQUE

(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 10.04.2012 JP 2012089260

(43) Date of publication of application:
18.02.2015 Bulletin 2015/08

(73) Proprietors:
  • Suga, Tadatomo
    Tokyo 164-0003 (JP)
  • Lan Technical Service Co., Ltd.
    Shinjuku-ku Tokyo 163-0532 (JP)

(72) Inventors:
  • SUGA, Tadatomo
    Tokyo 164-0003 (JP)
  • MATSUMOTO, Yoshiie
    Tokyo 163-0532 (JP)

(74) Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)


(56) References cited: : 
EP-A1- 1 332 867
WO-A1-2012/105474
JP-A- 2004 141 918
JP-A- 2004 337 927
US-A1- 2007 128 825
 WO-A1-2008/090701
JP-A- H09 226 135
JP-A- 2004 223 637
JP-A- 2010 120 088
   
  • TADATOMO SUGA ET AL: "Direct bonding of polymer to glass wafers using surface activated bonding (SAB) method at room temperature", LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2012 3RD IEEE INTERNATIONAL WORKSHOP ON, IEEE, 22 May 2012 (2012-05-22), page 161, XP032200395, DOI: 10.1109/LTB-3D.2012.6238098 ISBN: 978-1-4673-0743-7
  • T. MATSUMAE ET AL: "Room Temperature Bonding of Polymer to Glass Wafers Using Surface Activated Bonding (SAB) Method", ECS TRANSACTIONS, vol. 50, no. 7, 15 March 2013 (2013-03-15) , pages 297-302, XP055215060, ISSN: 1938-6737, DOI: 10.1149/05007.0297ecst
  • TADATOMO SUGA: 'Fureru dake de Kuttsuku? -Joon Setsugo no Sekai' GENDAI KAGAKU July 1998, pages 31 - 38, XP008175175
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).