(19)
(11) EP 2 858 134 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
27.05.2015 Bulletin 2015/22

(88) Date of publication A3:
08.04.2015 Bulletin 2015/15

(43) Date of publication:
08.04.2015 Bulletin 2015/15

(21) Application number: 13797607.2

(22) Date of filing: 26.04.2013
(51) International Patent Classification (IPC): 
H01L 35/34(2006.01)
H02N 11/00(2006.01)
 H01L 23/38(2006.01)
(86) International application number:
PCT/JP2013/062460
(87) International publication number:
WO 2013/179840 (05.12.2013 Gazette 2013/49)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 30.05.2012 JP 2012122824
24.01.2013 JP 2013011513

(71) Applicant: DENSO CORPORATION
Aichi-ken, 448-8661 (JP)

(72) Inventors:
  • TANIGUCHI, Toshihisa
    Kariya-city, Aichi 448-8661 (JP)
  • SHIRAISHI, Yoshihiko
    Kariya-city, Aichi 448-8661 (JP)
  • SAKAIDA, Atusi
    Kariya-city, Aichi 448-8661 (JP)
  • OKAMOTO, Keiji
    Kariya-city, Aichi 448-8661 (JP)
  • MIYAGAWA, Eijirou
    Kariya-city, Aichi 448-8661 (JP)

(74) Representative: Kuhnen & Wacker 
Patent- und Rechtsanwaltsbüro Prinz-Ludwig-Straße 40A
85354 Freising
85354 Freising (DE)

   


(54) THERMOELECTRIC CONVERTER MANUFACTURING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE PROVIDED WITH THERMOELECTRIC CONVERTER, AND THERMOELECTRIC CONVERTER


(57) As the first conductive paste 41, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste 51, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body 80, cavities 13 to 17 are formed in the stack body 80. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste 41 to unite the stack body 80, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste 41 to make the first layer-to-layer connecting member 40.