(19)
(11) EP 2 873 092 A1

(12)

(43) Date of publication:
20.05.2015 Bulletin 2015/21

(21) Application number: 13742776.1

(22) Date of filing: 12.07.2013
(51) International Patent Classification (IPC): 
H01L 21/56(2006.01)
(86) International application number:
PCT/US2013/050180
(87) International publication number:
WO 2014/025487 (13.02.2014 Gazette 2014/07)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 13.07.2012 US 201213548965

(71) Applicant: Nordson Corporation
Westlake, OH 44145-1119 (US)

(72) Inventors:
  • BABIARZ, Alec, J.
    Encinitas, CA 92024 (US)
  • QUINONES, Horatio
    San Marcos, CA 92078 (US)
  • RATLEDGE, Thomas, L.
    San Marcos, CA 92078 (US)
  • ZHAO, Jiangang
    Concord, CA 94521 (US)

(74) Representative: Findlay, Alice Rosemary 
Reddie & Grose LLP 16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) METHOD FOR VACUUM ASSISTED UNDERFILLING OF AN ELECTRONIC DEVICE