DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME - Patent 2880681

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EP 2 880 681 A2

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(88)	Date of publication A3:
	24.04.2014

(43)	Date of publication:
	10.06.2015 Bulletin 2015/24

(21)	Application number: 13747606.5

(22)	Date of filing: 01.08.2013

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International Patent Classification (IPC):

H01L 21/60^(2006.01)
H01L 23/488^(2006.01)

H01L 21/98^(2006.01)
H01L 33/62^(2010.01)

(86)	International application number:
	PCT/US2013/053135

(87)	International publication number:
	WO 2014/022619 (06.02.2014 Gazette 2014/06)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME

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Priority:

02.08.2012 US 201261678933 P

(71)	Applicant: Osram Sylvania Inc.
	Danvers, MA 01923 (US)

(72)	Inventors:
	SERRE, Jeffery Peabody, Massachusetts 01960 (US) LENEF, Alan Belmont, Massachusetts 02478 (US) SCOTCH, Adam Amesbury, Massachusetts 01913 (US)

(74)	Representative: Viering, Jentschura & Partner Patent- und Rechtsanwälte
	Am Brauhaus 8 01099 Dresden 01099 Dresden (DE)

(54)	DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONENT SUBSTRATE AND METHOD EMPLOYING SAME