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(11)

EP 2 880 685 A1

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(43) Date of publication: 10.06.2015 Bulletin 2015/24 (21) Application number: 13750213.4 (22) Date of filing: 01.08.2013

(51) International Patent Classification (IPC):  H01L 25/065(2006.01) H01L 23/498(2006.01) H01L 23/00(2006.01) H01L 23/13(2006.01) H01L 23/50(2006.01) (86) International application number: PCT/US2013/053240 (87) International publication number: WO 2014/022675 (06.02.2014 Gazette 2014/06)

(84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME (30) Priority: 02.08.2012 US 201213565613 15.01.2013 US 201313741890 (71) Applicant: Tessera Interconnect Materials, Inc. San Jose, CA 95134 (US)	(72) Inventors: HABA, Belgacem San Jose, CA 95134 (US) ZOHNI, Wael San Jose, CA 95134 (US) CRISP, Richard Dewitt San Jose, CA 95134 (US) MOHAMMED, Ilyas San Jose, CA 95134 (US) LAMBRECHT, Frank San Jose, CA 95134 (US) (74) Representative: Ahmad, Sheikh Shakeel et al Keltie LLP No.1 London Bridge London SE1 9BA London SE1 9BA (GB)