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(11) | EP 2 881 182 A3 |
| (12) | EUROPEAN PATENT APPLICATION |
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| (54) | Capacitive micromachined ultrasonic transducer and method of fabricating the same |
| (57) A capacitive micromachined ultrasonic transducer includes a device substrate including
a first trench confining a plurality of first parts corresponding to a plurality of
elements and a second trench confining a second part separated from the plurality
of first parts, a supporting unit provided on the device substrate for confining a
plurality of cavities corresponding to each of the plurality of elements, a membrane
provided on the supporting unit to cover the plurality of cavities, an upper electrode
provided on the membrane and electrically connected to the second part in the second
trench through a via hole passing through the membrane and the supporting unit, and
a through-silicon via (TSV) substrate provided on a lower surface of the device substrate,
and including a plurality of first via metals connected to the plurality of first
parts and a second via metal connected to the second part.
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