Fuzzy logic control of thermoelectric cooling in a processor

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(11)

EP 2 889 706 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	17.02.2016 Bulletin 2016/07

(88)	Date of publication A3:
	01.07.2015 Bulletin 2015/27

(43)	Date of publication:
	01.07.2015 Bulletin 2015/27

(21)	Application number: 14194557.6

(22)	Date of filing: 24.11.2014

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International Patent Classification (IPC):

G05B 13/02^(2006.01)

G06F 1/20^(2006.01)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME

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Priority:

30.12.2013 IN CH61742013

(71)	Applicant: Intel Corporation
	Santa Clara, CA 95054 (US)

(72)	Inventors:
	Rangarajan, Thanunathan Thanu 560043 Bangalore (IN) Khanna, Rahul Portland, OR 97229 (US) De La Guardia Gonzalez, Rafael 44670 Guadalajara (MX) Le, Minh Christian North Plains, OR 97133 (US)

(74)	Representative: Hufton, David Alan et al
	HGF Limited Fountain Precinct Balm Green Sheffield S1 2JA Sheffield S1 2JA (GB)

(54)	Fuzzy logic control of thermoelectric cooling in a processor

(57) In an embodiment, a processor includes a fuzzy thermoelectric cooling (TEC) controller to: obtain a current TEC level associated with the processor; obtain a current fan power level associated with the processor; fuzzify the current TEC level to obtain a first fuzzy fan level; fuzzify the current fan power level to obtain a second fuzzy fan level; determine a new TEC power level based at least in part on the first fuzzy fan level, the second fuzzy fan level, and a plurality of fuzzy rules; and provide the new TEC power level to a TEC device associated with the processor, where the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.