METHOD FOR IMPROVING THE ADHESION OF PLATED METAL LAYERS TO SILICON - Patent 2896070

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EP 2 896 070 A2

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(88)	Date of publication A3:
	26.06.2014

(43)	Date of publication:
	22.07.2015 Bulletin 2015/30

(21)	Application number: 13753849.2

(22)	Date of filing: 22.08.2013

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International Patent Classification (IPC):

H01L 31/0224^(2006.01)

(86)	International application number:
	PCT/EP2013/067450

(87)	International publication number:
	WO 2014/040834 (20.03.2014 Gazette 2014/12)

(84)	Designated Contracting States:
	AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
	Designated Extension States:
	BA ME

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Priority:

17.09.2012 US 201261701843 P

(71)	Applicants:
	IMEC VZW 3001 Leuven (BE) Katholieke Universiteit Leuven 3000 Leuven (BE)

(72)	Inventors:
	RUSSELL, Richard B-3001 Leuven (BE) TOUS, Loic B-3001 Leuven (BE)

(74)	Representative: Bird Goën & Co
	Wetenschapspark Arenberg Gaston Geenslaan 9 3001 Heverlee 3001 Heverlee (BE)

(54)	METHOD FOR IMPROVING THE ADHESION OF PLATED METAL LAYERS TO SILICON