(19)
(11) EP 2 900 319 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
30.08.2017 Bulletin 2017/35

(45) Mention of the grant of the patent:
19.04.2017 Bulletin 2017/16

(21) Application number: 13770478.9

(22) Date of filing: 26.09.2013
(51) International Patent Classification (IPC): 
A61N 1/375(2006.01)
 H05K 5/06(2006.01)
(86) International application number:
PCT/EP2013/070130
(87) International publication number:
WO 2014/049089 (03.04.2014 Gazette 2014/14)

(54)

IMPLANTABLE DEVICES

IMPLANTIERBARE VORRICHTUNGEN

DISPOSITIFS IMPLANTABLES

(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30) Priority: 28.09.2012 US 201261707473 P

(43) Date of publication of application:
05.08.2015 Bulletin 2015/32

(73) Proprietor: CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement
2002 Neuchâtel (CH)

(72) Inventors:
  • JOSE JAMES, Rony
    6055 Alpanach Dorf (CH)
  • SPINOLA DURANTE, Guido
    6003 Luzern (CH)
  • BOSSHARD, Christian
    4415 Lansen (CH)

(74) Representative: Gevers SA 
Rue des Noyers 11
2000 Neuchâtel
2000 Neuchâtel (CH)


(56) References cited: : 
WO-A2-2012/015756
US-A1- 2003 071 283
 US-A- 5 738 270
   
  • A. FAN ET AL: "Copper Wafer Bonding", ELECTROCHEMICAL AND SOLID-STATE LETTERS, vol. 2, no. 10, 1 January 1999 (1999-01-01), page 534, XP055088560, ISSN: 1099-0062, DOI: 10.1149/1.1390894
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).