Field of the Invention
[0001] The present invention relates to the field of display technology, and particularly
relates to a manufacturing method of a flexible display device and a substrate structure
used in the process of manufacturing the flexible display device.
Background of the Invention
[0002] Flexible display technology has developed rapidly in recent years, thus bringing
great progress of flexible display devices in the aspects of screen size and display
quality. Both cathode ray tube (simply referred to as CRT) displays on the verge of
disappearance and liquid crystal displays (simply referred to as LCD) as the current
mainstream essentially belong to traditional rigid display devices. Compared with
the traditional rigid display devices, the flexible display devices have a variety
of advantages, such as high impact resistance, strong shock resistance, light weight,
small volume, increased portability and the like.
[0003] At present, the flexible display devices may be mainly divided into three types:
electronic paper (flexible electrophoretic display), flexible organic light-emitting
diodes (simply referred to as OLED) and flexible LCDs. The preparation method thereof
is generally an adhering and lower removing method, in which a flexible substrate
is adhered on a hard substrate through an adhesive layer, then display elements are
prepared on the flexible substrate, and the back surface (i.e., a surface with no
adhesive layer adhered) of the hard substrate is scanned by using a high-energy laser
beam to age the adhesive layer after the display elements are prepared, so that the
flexible substrate is stripped from the hard substrate to obtain a flexible display
device. These are done to precisely fix a position of the flexible substrate and keep
the flatness of the flexible substrate in the manufacturing process of the flexible
display, so as to prevent malposition when preparing the display elements subsequently.
[0004] However, in the above-mentioned manufacturing method of the flexible display, the
stripping uniformity is poor, and large-scale stripping could not be achieved.
Summary of the Invention
[0005] Embodiments of the present invention provide a manufacturing method of a flexible
display device and a substrate structure, which may be used for uniformly stripping
a flexible substrate of the flexible display device from a bearing substrate.
[0006] To fulfill the above-mentioned object, the embodiments of the present invention adopt
the following technical solutions.
[0007] According to one aspect of the present invention, a manufacturing method of a flexible
display device is provided, which includes:
forming an adhesive layer on a bearing substrate;
forming a flexible substrate on the adhesive layer, and fixing the flexible substrate
to the bearing substrate through the adhesive layer;
forming display elements on a surface of the flexible substrate opposite to the other
surface which adhered to the adhesive layer;
arranging an electromagnetic heater on a surface of the bearing substrate opposite
to the other surface on which formed the adhesive layer, heating the adhesive layer
via the electromagnetic heater to strip the flexible substrate from the bearing substrate,
so as to obtain the flexible display device;
wherein an adhesive in the adhesive layer is an adhesive whose viscidity is degraded
after the adhesive being heated,
and the bearing substrate includes at least a metal plate.
[0008] Optionally, the bearing substrate further includes an insulated heat conduction layer
arranged on the metal plate; and the adhesive layer is formed on the insulated heat
conduction layer.
[0009] Further optionally, the insulated heat conduction layer is a ceramic layer or a glass
layer.
[0010] Optionally, the area of the electromagnetic heater is larger than or equal to the
area of the bearing substrate, and the bearing substrate is entirely arranged above
the electromagnetic heater.
[0011] Optionally, the adhesive includes at least one of silicane adhesive, polyimide adhesive
and acrylate adhesive.
[0012] Optionally, the step of forming the display elements on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer includes:
forming at least an anode, an organic material functional layer and a cathode on the
surface of the flexible substrate opposite to the other surface which adhered to the
adhesive layer, wherein the organic material functional layer is located between the
anode and the cathode.
[0013] Further, a thin film transistor is further formed on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer, wherein
a drain electrode of the thin film transistor is electrically connected with the anode.
[0014] Optionally, the step of forming the display elements on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer includes:
forming at least a thin film transistor and a pixel electrode electrically connected
with a drain electrode of the thin film transistor on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer.
[0015] Optionally, the step of forming the display elements on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer includes:
forming at least a color layer and a black matrix on the surface of the flexible substrate
opposite to the other surface which adhered to the adhesive layer, wherein the color
layer includes at least a red photoresistor, a green photoresistor and a blue photoresistor.
[0016] Further, the method further includes: further forming a common electrode on the surface
of the flexible substrate opposite to the other surface which adhered to the adhesive
layer.
[0017] Optionally, the method further includes: further forming an electrophoretic display
unit on the surface of the flexible substrate opposite to the other surface which
adhered to the adhesive layer.
[0018] According to another aspect of the present invention, a substrate structure is further
provided, which is used for bearing a flexible substrate of a flexible display device
in the manufacturing process of the flexible display device, and the substrate structure
is characterized by including:
a bearing substrate;
an adhesive layer formed on the bearing substrate; and
an electromagnetic heater arranged at a surface of the bearing substrate opposite
to other surface on which formed the adhesive layer,
wherein the adhesive layer is used for fixing the flexible substrate to the bearing
substrate in the manufacturing process of the flexible display device, and an adhesive
in the adhesive layer is an adhesive whose viscidity is degraded after the adhesive
being heated,
and wherein the bearing substrate includes at least a metal plate.
[0019] In the manufacturing method of the flexible display device and the substrate structure
provided by the embodiments of the present invention, the electromagnetic heater is
electrified to generate an alternating magnetic field. The metal plate of the bearing
substrate located above the electromagnetic heater cuts alternating magnetic field
lines so as to enable the metal plate to generate alternating current (i.e., eddy
current). The eddy current drives metal atoms in the metal plate to move irregularly
at high speed, so that the metal atoms collide and chafe against each other to generate
heat energy. The heat energy is applied on the adhesive layer, and in this way, the
adhesive in the adhesive layer is aged and the viscidity thereof is degraded. As a
result, the flexible substrate is stripped from the bearing substrate. In the method
provided by the embodiments of the present invention, the entire metal plate will
generate the heat energy, and the heat energy conversion rate of the metal plate is
high. Therefore, the converted heat energy may be uniformly applied to the entire
adhesive layer, so that the flexible substrate can be uniformly stripped from the
bearing substrate, and thus the method is suitable for manufacturing large-scale flexible
display devices.
Brief Description of the Drawings
[0020] To illustrate technical solutions in the embodiments of the present invention or
in the prior art more clearly, a brief introduction on the accompanying drawings which
are used in the description of the embodiments or the prior art is given below. Apparently,
the accompanying drawings described below are merely some of the embodiments of the
present invention, based on which drawings of other implementations may be obtained
by those of ordinary skill in the art without any creative effort.
Fig. 1 is a flow chart of a manufacturing method of a flexible display device provided
by an embodiment of the present invention;
Fig. 2a is a schematic diagram of sequentially forming an adhesive layer and a flexible
substrate on a bearing substrate consisting of a metal plate provided by an embodiment
of the present invention;
Fig. 2b is a schematic diagram of sequentially forming an adhesive layer and a flexible
substrate on a bearing substrate consisting of a metal plate and an insulated heat
conduction layer provided by an embodiment of the present invention;
Fig. 3a is a schematic diagram of forming display elements on the flexible substrate
shown in Fig. 2a;
Fig. 3b is a schematic diagram of forming display elements on the flexible substrate
shown in Fig. 2b;
Fig. 4a is a schematic diagram of a substrate structure of the present invention provided
in the embodiment shown in Fig. 3a;
Fig. 4b is a schematic diagram of a substrate structure of the present invention provided
in the embodiment shown in Fig. 3b;
Fig. 5 is a schematic diagram of stripping a flexible substrate from a bearing substrate
according to a method provided by an embodiment of the present invention;
Fig. 6 is a schematic diagram of a structure of a flexible array display device obtained
after forming a passive OLED on a bearing substrate according to a method provided
by an embodiment of the present invention;
Fig. 7 is a schematic diagram of a structure of a flexible array display device obtained
after forming an active OLED on a bearing substrate according to a method provided
by an embodiment of the present invention;
Fig. 8a is a first schematic diagram of a structure of a flexible array display device
obtained after forming an LCD on a bearing substrate according to a method provided
by an embodiment of the present invention;
Fig. 8b is a second schematic diagram of a structure of a flexible array display device
obtained after forming an LCD on a bearing substrate according to a method provided
by an embodiment of the present invention;
Fig. 9 is a schematic diagram of a structure of a flexible color filter display device
obtained after forming an LCD on a bearing substrate according to a method provided
by an embodiment of the present invention.
Reference numerals:
[0021] 10 bearing substrate; 101 metal plate; 102 insulated heat conduction layer; 20 adhesive
layer; 30 flexible substrate; 40 display element; 401 anode; 402 cathode; 403 organic
material functional layer; 404 thin film transistor; 405 pixel electrode; 406 common
electrode; 4071 red photoresistor; 4072 green photoresistor; 4073 blue photoresistor;
408 black matrix; 50 electromagnetic heater; 60 pixel isolation layer.
Detailed Description of the Embodiments
[0022] A clear and complete description of technical solutions in the embodiments of the
present invention will be given below in combination with the accompanying drawings
in the embodiments of the present invention. Apparently, the embodiments described
herein are merely a part, but not all, of the embodiments of the present invention.
All of other embodiments, obtained by those of ordinary skill in the art based on
the embodiments of the present invention without any creative effort, fall into the
protection scope of the present invention.
[0023] An embodiment of the present invention provides a manufacturing method of a flexible
display device, as shown in Fig. 1, including the following steps.
[0024] S01: as shown in Figs. 2a and 2b, an adhesive layer 20 is formed on a bearing substrate
10.
[0025] Here, the bearing substrate 10 includes at least a metal plate 101, and the metal
plate 101 may be, for example, an iron plate, a steel plate or other substrates made
of metals with good thermal conductivity.
[0026] S02: as shown in Figs. 2a and 2b, a flexible substrate 30 is formed on the adhesive
layer 20, and the flexible substrate 30 is fixed to the bearing substrate 10 through
the adhesive layer 20.
[0027] Here, the adhesive in the adhesive layer 20 is an adhesive whose viscidity is degraded
after being heated. For example, the adhesive may include at least one of silicane
adhesive, polyimide adhesive and acrylate adhesive.
[0028] S03: as shown in Figs. 3a and 3b, display elements 40 are formed on a surface of
the flexible substrate 30 opposite to the other surface which adhered to the adhesive
layer 20.
[0029] S04: as shown in Figs. 4a and 4b, an electromagnetic heater 50 is arranged on a surface
of the bearing substrate 10 opposite to the other surface on which formed the adhesive
layer 20. Namely, the electromagnetic heater 50 is arranged beneath the bearing substrate
10, and it is preferable to ensure a close contact between the bearing substrate 10
and the electromagnetic heater 50 beneath the same. The adhesive layer 20 is heated
by the electromagnetic heater 50 arranged beneath the bearing substrate 10, and as
shown in Fig. 5, the flexible substrate 30 is stripped from the bearing substrate
10 (not shown in Fig. 5 due to being blocked by the adhesive layer 20), so that the
flexible display is obtained.
[0030] In addition, an embodiment of the present invention provides a substrate structure,
which is used for bearing the flexible substrate of the flexible display device in
the manufacturing process of the flexible display device. As shown in Figs. 4a and
4b, the substrate structure includes: a bearing substrate; an adhesive layer formed
on the bearing substrate; and an electromagnetic heater arranged on a surface of the
bearing substrate opposite to the other surface on which formed the adhesive layer.
Wherein the adhesive layer is used for fixing the flexible substrate to the bearing
substrate in the manufacturing process of the flexible display device, the adhesive
in the adhesive layer is an adhesive whose viscidity is degraded after being heated.
Moreover, the bearing substrate includes at least a metal plate.
[0031] Herein, the principle of stripping the flexible substrate 30 from the bearing substrate
10 in the way of heating the adhesive layer 20 through the electromagnetic heater
50 is as follows: the electromagnetic heater 50 is electrified to generate an alternating
magnetic field; when the bearing substrate 10 including the metal plate 101 is located
on the electromagnetic heater 50, the metal plate 101 cuts alternating magnetic field
lines to generate alternating current (i.e., eddy current); the eddy current drives
metal atoms in the metal plate 101 to move irregularly at high speed, so that the
metal atoms collide and chafe against each other to generate heat energy; and due
to the high heat energy conversion rate of the metal plate 101, the converted heat
energy can be applied to the adhesive layer 20 located on the metal plate 101, in
order to heat the adhesive layer 20, and thus to worsen the viscidity of the adhesive
in the adhesive layer 20; in this way the flexible substrate 30 is stripped from the
bearing substrate 10.
[0032] It should be noted that, firstly, the display element 40 in the embodiment of the
present invention refers to a structure which is indispensable for displaying and
formed by layers of patterns.
[0033] For example, when the flexible display is an LCD array display device, for one minimal
display unit of the LCD array display, the display element 40 includes at least a
thin film transistor, a pixel electrode and the like; when the flexible display is
an LCD color filter display device, for one minimal display unit of the LCD color
filter display, the display element 40 includes a red or green or blue photoresistor,
a black matrix, and the like; when the flexible display is an OLED array display device,
for one minimal display unit of the OLED array display device, the display element
40 includes at least a cathode, an anode and a light-emitting layer.
[0034] Of course, in addition, the display element 40 may further include some necessary
pattern layers, such as a protection layer, or may further include some pattern layers
which are added for improving the display effect or remedying some defects. Therefore,
in the embodiment of the present invention, the display element 40 may be understood
as multiple layers of patterns arranged on the flexible substrate 30 for one minimal
display unit of the flexible display, and the flexible display may include multiple
display elements 40.
[0035] Secondly, the bearing substrate 10 may be a single-layer substrate and may also be
a substrate with composite structure composed of at least two layers. No matter whether
the bearing substrate 10 is composed of one layer or multiple layers, the entire bearing
substrate 10 should be a hard substrate and have good flatness.
[0036] In addition, according to the stripping principle described above, when the bearing
substrate 10 includes at least two layers, the other layers excluding the metal plate
101 are preferably made of a material with excellent thermal conductivity.
[0037] Thirdly, the thickness of the bearing substrate 10 is not limited; when the bearing
substrate 10 includes at least two layers, a ratio between the thicknesses of the
metal plate 101 and the other layers excluding the metal plate 101 is not limited
either, as long as the heat generated by the metal plate 101 can be applied to the
adhesive layer 20 to heat the adhesive layer 20, and further to strip the flexible
substrate 30 from the bearing substrate 10.
[0038] Fourthly, in order to strip the entire flexible substrate 30 from the bearing substrate
10, preferably, the area of the electromagnetic heater 50 should be larger than or
equal to the area of the bearing substrate 10, and the entire bearing substrate 10
is completely arranged on the electromagnetic heater 50.
[0039] In addition, the internal structure of the electromagnetic heater 50 is not limited,
and the electromagnetic heater may include an electronic circuit board capable of
generating an alternating magnetic field.
[0040] In the manufacturing method of the flexible display and the substrate structure provided
by the embodiments of the present invention, the electromagnetic heater 50 is electrified
to generate an alternating magnetic field. The metal plate 101 of the bearing substrate
10 located on the electromagnetic heater 50 cuts alternating magnetic field lines
to generate alternating current (i.e., eddy current) in the metal plate 101. The eddy
current drives metal atoms in the metal plate 101 to move irregularly at high speed,
so that the metal atoms collide and chafe against each other to generate heat energy.
The heat energy is applied to the adhesive layer 20 to age the adhesive in the adhesive
layer 20 and worsen the viscidity of the adhesive. Thus the flexible substrate 30
is stripped from the bearing substrate 10. In the method provided by the embodiment
of the present invention, since the entire metal plate 101 may generate the heat energy,
and the heat energy conversion rate of the metal plate 101 is high, the converted
heat energy may be uniformly applied to the entire adhesive layer 20, so as to uniformly
strip the flexible substrate 30 from the bearing substrate 10, and thus the method
is suitable for manufacturing large-scale flexible displays.
[0041] Optionally, as shown in Figs. 2a, 3a and 4a, the bearing substrate 10 merely includes
one layer of metal plate 101, that is, the metal plate 101 forms the bearing substrate
10.
[0042] Or, optionally, as shown in Figs. 2b, 3b and 4b, the bearing substrate 10 includes
the metal plate 101 and an insulated heat conduction layer 102 arranged on the metal
plate 101, wherein the adhesive layer 20 is formed on the insulated heat conduction
layer 102.
[0043] Further, the insulated heat conduction layer 102 may be a ceramic layer made of a
ceramic material, or a glass layer.
[0044] Based on the above descriptions, the step of forming the display elements 40 on a
surface of the flexible substrate 30 opposite to the other surface which adhered to
the adhesive layer 20 may specifically includes the following several cases:
In the first case, as shown in Fig. 6, when the flexible display device to be manufactured
is a passive OLED array display device, an anode 401, an organic material functional
layer 403 and a cathode 402 are sequentially formed on the surface of the flexible
substrate 30 opposite to the other surface which is adhered with the adhesive layer
20, wherein the organic material functional layer 403 is located between the anode
401 and the cathode 402; the organic material functional layer 403 may include at
least an electron transport layer, a light-emitting layer and a hole transport layer.
The light-emitting layer is located between the electron transport layer and the hole
transport layer, and the hole transport layer is located between the anode 401 and
the light-emitting layer. In order to improve the efficiency of injecting electrons
and holes into the light-emitting layer, preferably, the organic material functional
layer 403 may further include an electron injection layer arranged between the cathode
402 and the electron transport layer, and a hole injection layer arranged between
the anode 401 and the hole transport layer. That is, the anode 401, the five layers
of the hole injection layer, the hole transport layer, the light-emitting layer, the
electron transport layer, the electron injection layer (the five layers from the hole
injection layer to the electron injection layer form the organic material functional
layer 403) and the cathode 402 are sequentially formed on the surface of the flexible
substrate 30 opposite to the other surface which adhered to the adhesive layer 20.
[0045] Here, any one anode 401, one cathode 402 corresponding to the anode 401 and the organic
material functional layer 403 located between the anode 401 and the cathode 402 form
one display element 40. In addition, as shown in Fig. 6, a pixel isolation layer 60
may be arranged between any two adjacent display elements 40 to isolate the adjacent
display elements 40.
[0046] In the second case, as shown in Fig. 7, when the flexible display device to be manufactured
is an active OLED array display device, a thin film transistor 404, an anode 401,
an organic material functional layer 403 and a cathode 402 are sequentially formed
on the surface of the flexible substrate 30 opposite to the other surface which adhered
to the adhesive layer 20, wherein the organic material functional layer 403 is located
between the anode 401 and the cathode 402; the thin film transistor 404 includes a
gate electrode, a gate insulation layer, an active layer, a source electrode and a
drain electrode, and the drain electrode is electrically connected with the anode
401.
[0047] Here, any one thin film transistor 404, the anode 401 electrically connected with
the drain electrode of the thin film transistor 404, one cathode 402 corresponding
to the anode 401 and the organic material functional layer 403 located between the
anode 401 and the cathode 402 form one display element 40. Of course, the pixel isolation
layer 60 may be arranged between any two adjacent display elements 40 to isolate the
adjacent display elements 40.
[0048] It should be noted that, for the first and second cases, the sequence of forming
the anode 401, the organic material functional layer 403 and the cathode 402 described
in Figs. 6 and 7 is as follows: the anode 401 is firstly formed, then the organic
material functional layer 403 is formed, and further the cathode 402 is formed, however,
the sequence of forming the anode 401 and the cathode 402 is not limited in the present
invention. That is to say, the anode 401 may be firstly formed, then the organic material
functional layer 403 is formed, and further the cathode 402 is formed; alternatively,
the cathode 402 may be firstly formed, then the organic material functional layer
403 is formed, and further the anode 401 is formed. Regardless of the sequence of
forming the anode 401 and the cathode 402, the organic material functional layer 403
must be located between the anode 401 and the cathode 402.
[0049] In addition, after the display elements 40 are formed, through the use of the electromagnetic
heater 50, the above-mentioned passive or active OLED array display device may be
firstly stripped from the bearing substrate 10 and then packaged by a packaging material;
alternatively, after the display elements 40 are formed, package is directly performed,
and then through the use of the electromagnetic heater 50, the packaged passive or
active OLED array display device is stripped from the bearing substrate 10.
[0050] In the third case, as shown in Fig. 8a, when the flexible display to be manufactured
is an LCD array display, a thin film transistor 404 and a pixel electrode 405 electrically
connected with a drain electrode of the thin film transistor 404 are formed on the
surface of the flexible substrate 30 opposite to the other surface which adhered to
the adhesive layer 20. Of course, as shown in Fig. 8b, a common electrode 406 may
also be additionally formed.
[0051] Here, any one thin film transistor 404 and the pixel electrode 405 electrically connected
with the drain electrode of the thin film transistor 404 form one display element
40. When the LCD array display device further includes the common electrode 406, any
one thin film transistor 404, the pixel electrode 405 electrically connected with
the drain electrode of the thin film transistor 404 and the common electrode 406 corresponding
to the pixel electrode 405 form one display element 40.
[0052] In the fourth case, as shown in Fig. 9, when the flexible display device to be manufactured
is an LCD color filter display device, a color layer and a black matrix 408 are formed
on the surface of the flexible substrate 30 opposite to the other surface which adhered
to the adhesive layer 20; of course, a common electrode 406 may also be additionally
formed. The color layer includes a red photoresistor 4071, a green photoresistor 4072
and a blue photoresistor 4073, and may further include a white photoresistor.
[0053] Here, the photoresistor of any color and the black matrix 408 surrounding the same
form one display element 40.
[0054] It should be noted that, for the third and fourth cases, after the display elements
40 are formed, the LCD array display and the LCD color filter display may be respectively
stripped from the bearing substrate 10 through the electromagnetic heater 50, and
then cell-aligning processing is performed on the LCD array display device and the
LCD color filter display device; alternatively, after the display elements 40 are
formed, the cell-aligning process may be directly performed, and then the liquid crystal
display device formed after the cell-aligning process is stripped from the bearing
substrate 10 through the electromagnetic heater 50.
[0055] In addition, an electrophoretic display unit may also be formed on the surface of
the flexible substrate 30 opposite to the other surface which adhered to the adhesive
layer 20and is specifically set according to actual conditions, and will not be repeatedly
described herein.
[0056] Based on the above descriptions, those skilled in the art should understand that,
all the accompanying drawings in the embodiments of the present invention are schematic
diagrams briefly illustrating the preparation process of the flexible display and
the substrate structure, and are merely used for clearly describing the structures
related to the inventive concept in the solution, while other structures irrelevant
to the inventive concept may use the existing structures, and are not illustrated
or merely partially illustrated in the accompanying drawings.
[0057] The foregoing descriptions are merely specific implementations of the present invention,
rather than limiting the protection scope of the present invention. Those skilled
in the art could readily conceive of variations or substitutions within the technical
scope disclosed by the present invention, and these variations or substitutions shall
fall within the protection scope of the present invention. Accordingly, the protection
scope of the present invention should be defined by the appended claims.
1. A manufacturing method of a flexible display device, comprising:
forming an adhesive layer on a bearing substrate;
forming a flexible substrate on the adhesive layer, and fixing the flexible substrate
to the bearing substrate through the adhesive layer;
forming display elements on a surface of the flexible substrate opposite to the other
surface which adhered to the adhesive layer,; and
arranging an electromagnetic heater on a surface of the bearing substrate, opposite
to the other surface on which formed the adhesive layer, heating the adhesive layer
via the electromagnetic heater to strip the flexible substrate from the bearing substrate,
so as to obtain the flexible display device;
wherein an adhesive in the adhesive layer is an adhesive whose viscidity is degraded
after the adhesive being heated,
and the bearing substrate comprises at least a metal plate.
2. The manufacturing method of claim 1, wherein the bearing substrate further comprises
an insulated heat conduction layer arranged on the metal plate; and the adhesive layer
is formed on the insulated heat conduction layer.
3. The manufacturing method of claim 2, wherein the insulated heat conduction layer is
a ceramic layer or a glass layer.
4. The manufacturing method of claim 1, wherein the area of the electromagnetic heater
is larger than or equal to the area of the bearing substrate, and the bearing substrate
is entirely arranged above the electromagnetic heater.
5. The manufacturing method of any one of claims 1 to 4, wherein the adhesive comprises
at least one of silicane adhesive, polyimide adhesive and acrylate adhesive.
6. The manufacturing method of claim 1, wherein,
the step of forming the display elements on the surface of the flexible substrate
opposite to the other surface which adhered to the adhesive layer, comprises:
forming at least an anode, an organic material functional layer and a cathode on the
surface of the flexible substrate opposite to the other surface which adhered to the
adhesive layer, wherein the organic material functional layer is located between the
anode and the cathode.
7. The manufacturing method of claim 6, wherein a thin film transistor is further formed
on the surface of the flexible substrate opposite to the other surface which adhered
to the adhesive layer, and a drain electrode of the thin film transistor is electrically
connected with the anode.
8. The manufacturing method of claim 1, wherein,
the step of forming the display elements on the surface of the flexible substrate
opposite to the other surface which adhered to the adhesive layer comprises:
forming at least a thin film transistor and a pixel electrode electrically connected
with a drain electrode of the thin film transistor on the surface of the flexible
substrate opposite to the other surface which adhered to the adhesive layer.
9. The manufacturing method of claim 1, wherein the step of forming the display elements
on the surface of the flexible substrate opposite to the other surface which adhered
to the adhesive layer comprises:
forming at least a color layer and a black matrix on the surface of the flexible substrate
opposite to the other surface which adhered to the adhesive layer,
wherein the color layer comprises at least a red photoresistor, a green photoresistor
and a blue photoresistor.
10. The manufacturing method of claim 8 or 9, further comprising: further forming a common
electrode on the surface of the flexible substrate opposite to the other surface which
adhered to the adhesive layer.
11. The manufacturing method of claim 1, further comprising: further forming an electrophoretic
display unit on the surface of the flexible substrate opposite to the other surface
which adhered to the adhesive layer.
12. A substrate structure, used for bearing a flexible substrate of a flexible display
device in the manufacturing process of the flexible display device, comprising:
a bearing substrate;
an adhesive layer formed on the bearing substrate; and
an electromagnetic heater arranged at a surface of the bearing substrate opposite
to the other surface on which formed the adhesive layer,
wherein the adhesive layer is used for fixing the flexible substrate to the bearing
substrate in the manufacturing process of the flexible display device, and an adhesive
in the adhesive layer is an adhesive whose viscidity is degraded after the adhesive
being heated,
and wherein the bearing substrate comprises at least a metal plate.
13. The substrate structure of claim 12, wherein the bearing substrate further comprises
an insulated heat conduction layer arranged on the metal plate; and the adhesive layer
is formed on the insulated heat conduction layer.
14. The substrate structure of claim 13, wherein the insulated heat conduction layer is
a ceramic layer or a glass layer.
15. The substrate structure of claim 12, wherein the area of the electromagnetic heater
is larger than or equal to the area of the bearing substrate, and the bearing substrate
is entirely arranged above the electromagnetic heater.
16. The substrate structure of any one of claims 12 to 15, wherein the adhesive comprises
at least one of silicane adhesive, polyimide adhesive and acrylate adhesive.