Technical Field
[0001] The present invention relates to a heater that is used for a hair iron, a water heater,
an oxygen sensor, an air-fuel ratio sensor, a glow plug, various types of combustors,
a semiconductor manufacturing apparatus, etc.
Background Art
[0002] One example of heaters for use in a hair iron and so on is a ceramic heater described
in Japanese Unexamined Patent Application Publication No.
2006-40882 (hereinafter referred to as Patent Literature (PTL) 1). The ceramic heater described
in PTL 1 includes a ceramic base body, a heating section in the ceramic base body,
and a lead section in the ceramic base body, the lead section being connected to the
heating section.
[0003] In the ceramic heater (hereinafter simply referred to also as the "heater") described
in PTL 1, the heating section (heating resistor) includes two linear portions arrayed
side by side, and a folded portion connecting those linear portions to each other.
In the heater having such a shape, particularly, a portion of the ceramic base body
(ceramic structure), which is positioned between the two arrayed linear portions near
the folded portion, tends to be heated to high temperature. Therefore, a surface of
the ceramic structure exhibits a temperature distribution that a region (hereinafter
referred to as a "maximally heating region") facing the above-mentioned portion of
the ceramic base body takes the highest temperature, and that the temperature gradually
lowers as a distance from the maximally heating region increases with the maximally
heating region being a center. When an uneven temperature distribution is generated
in the surface of the ceramic structure as mentioned above, there is a possibility
that a crack may occur in the surface of the ceramic structure with repeated use of
the heater. As a result, it has been difficult to improve long-term reliability of
the heater.
Summary of Invention
[0004] A heater according to one aspect of the present invention includes a ceramic structure,
and a heating resistor embedded in the ceramic structure and including a folded portion,
in which the ceramic structure includes, in a surface facing the folded portion, a
groove portion that surrounds the folded portion in opposing relation.
[0005] A heater according to another aspect of the present invention includes a ceramic
structure, and a heating resistor embedded in the ceramic structure and including
a folded portion, in which the ceramic structure includes a recess in a region of
a surface facing the folded portion, the region overlapping the folded portion.
Brief Description of Drawings
[0006]
Fig. 1 is a perspective view of a heater according to one embodiment of the present
invention.
Fig. 2(a) is a partial enlarged view representing, in enlarged scale, an area A of
the heater illustrated in Fig. 1, and Fig. 2(b) is a sectional view taken along a
B-B' cross-section.
Fig. 3 is a partial enlarged view of a heater according to a modification of the present
invention.
Fig. 4 is a sectional view of a heater according to a modification of the present
invention.
Fig. 5 is a sectional view of a heater according to a modification of the present
invention.
Fig. 6(a) is a partial enlarged view of the heater according to a modification of
the present invention, and Fig. 6(b) is a sectional view taken along a C-C' cross-section.
Fig. 7 is a sectional view of a heater according to a modification of the present
invention.
Fig. 8 is a sectional view of a heater according to a modification of the present
invention.
Description of Embodiments
[0007] A heater 100 according to one embodiment of the present invention will be described
in detail below with reference to the drawings.
[0008] Fig. 1 is a perspective view of the heater 100 according to one embodiment of the
present invention. Fig. 2(a) is a partial enlarged view representing, in enlarged
scale, an area A of the heater 100 illustrated in Fig. 1, and Fig. 2(b) is a sectional
view taken along a B-B' cross-section. As illustrated in Fig. 1, the heater 100 according
to one embodiment of the present invention includes a ceramic structure 1, a heating
resistor 2, power feeders 3, and lead terminals 7. In Fig. 1, the heating resistor
2 and the power feeders 3 are illustrated by broken lines in a way of seeing through
the ceramic structure 1. The heater 100 is, for example, used for a hair iron, a water
heater, an oxygen sensor, an air-fuel ratio sensor, a glow plug, a semiconductor manufacturing
apparatus, and so on.
[0009] The ceramic structure 1 serves as a member for holding the heating resistor 2 and
the power feeders 3 therein. Because the heating resistor 2 and the power feeders
3 are disposed inside the ceramic structure 1, environmental resistance of the heating
resistor 2 and the power feeders 3 can be improved. The ceramic structure 1 is a rod-like
member. The ceramic structure 1 is made of a ceramic material, e.g., alumina, silicon
nitride, aluminum nitride, or silicon carbide. When the ceramic structure 1 is in
the form of a square rod, for example, a short side of an outer periphery of the ceramic
structure 1 has a length of 25 mm, and a long side thereof has a length of 25 mm.
A length of the ceramic structure 1 in the longitudinal direction is 50 mm.
[0010] The heating resistor 2 is a member that generates heat when a current is supplied
to it. The heating resistor 2 is embedded in the ceramic structure 1. The heating
resistor 2 faces a surface (hereinafter referred to as a "principal surface") of the
ceramic structure 1, the surface including the long side of the outer periphery of
the ceramic structure 1 and the side of the ceramic structure 1 in the longitudinal
direction. As illustrated in Fig. 2, the heating resistor 2 includes two linear portions
22 arrayed side by side, and a folded portion 21 connecting those linear portions
22 to each other and having outer and inner circumferences each of which has a semicircular
shape. Also in Fig. 2, the heating resistor 2 is illustrated by broken lines in a
way of seeing through the ceramic structure 1. The folded portion 21 of the heating
resistor 2 is disposed near a fore end of the ceramic structure 1, and the linear
portions 22 extend from respective ends of the folded portion 21 toward the rear end
side of the ceramic structure 1. The heating resistor 2 is made of a conductive ceramic
material, e.g., tungsten carbide. The heating resistor 2 has a line width of 0.2 to
1.5 mm and a thickness of 0.3 to 3 mm, for example. The curvature radius of the folded
portion 21 is, for example, 0.15 to 1 mm at the inner circumference and 0.5 to 2 mm
at the outer circumference. The heat generated from the heating resistor 2 is conducted
through the ceramic structure 1 and is radiated to the outside from surfaces of the
ceramic structure 1.
[0011] Returning to Fig. 1, the power feeders 3 are a pair of wiring members that electrically
connects the heating resistor 2 to a power supply (not illustrated) outside the ceramic
structure 1 in cooperation with the lead terminals 7. The power feeders 3 are mostly
embedded in the ceramic structure 1, and are electrically connected at one ends to
the heating resistor 2. Stated in another way, respective one ends of the power feeders
3 are electrically connected to different ends of the heating resistor 2. On the other
hand, respective other ends of the power feeders 3 are led out to the surface of the
ceramic structure 1 at the rear end side and are connected to the different lead terminals
7 for connection to the external power supply. The power feeders 3 are formed linearly
as wired lines that are routed inside the ceramic structure 1. The power feeders 3
are each made of a conductive ceramic material, e.g., tungsten carbide, and formed
as a wired line having lower resistance than the heating resistor 2. Each of the power
feeders 3 has a line width of, e.g., 0.2 to 2 mm and a thickness of, e.g., 0.3 to
4 µm.
[0012] The lead terminals 7 are rod-like conductive members that electrically connect the
power feeders 3 to the external power supply. The lead terminals 7 are joined respectively
to the power feeders 3 that are led out to different surfaces of the ceramic structure
1 at the side opposite to the side where the heating resistor 2 is disposed. The lead
terminals 7 are made of, e.g., nickel. The lead terminals 7 and the power feeders
3 are joined to each other by employing, e.g., a brazing alloy. For example, a silver
solder is used as the brazing alloy. Dimensions of each of the lead terminals 7 are,
for example, 0.2 to 2 mm in width, 0.2 to 2 mm in thickness, and 10 mm or more in
length.
[0013] Returning to Fig. 2(a), in the heater 100 of this embodiment, the heating resistor
2 includes the two linear portions 22 arrayed side by side, and the folded portion
21 connecting those linear portions 22 to each other. In the heater 100 having such
a shape, particularly, a portion of the ceramic structure 1, which is positioned between
the two arrayed linear portions 22 near the folded portion 21, tends to be heated
to high temperature. Therefore, a surface of the ceramic structure 1 takes high temperature
particularly in a region (maximally heating region 10) that faces the above-mentioned
portion of the ceramic base body. In Fig. 2(a), the maximally heating region 10 is
denoted by a two-dot-chain line.
[0014] In consideration of the above point, in the heater 100 of this embodiment, the ceramic
structure 1 includes, in the surface of its region at the side closer to the fore
end than the maximally heating region 10, a groove portion 4 surrounding the folded
portion 21 of the heating resistor 2 in opposing relation. In this embodiment, the
groove portion 4 is in the form of a rectangular frame surrounding the folded portion
21 in opposing relation. Therefore, the surface of a portion of the ceramic structure
1 where the groove portion 4 is formed (i.e., a bottom surface of the groove portion
4) can be positioned closer to the heating resistor 2 than the surface of a region
around such a portion. With that arrangement, temperature in the surface of the portion
of the ceramic structure 1 where the groove portion 4 is formed is more apt to increase.
Thus, since the groove portion 4 in which temperature is more apt to increase is formed
near the maximally heating region 10, the temperature difference between the maximally
heating region 10 and a region in the vicinity of the former can be reduced. Hence
unevenness of temperature distribution in a surface of the heater 100 can be suppressed.
As a result, long-term reliability of the heater 100 can be improved.
[0015] When the outer circumference of the folded portion 21 has the curvature radius of
1 mm, the groove portion 4 is formed in a square shape dimensioned, for example, such
that a width is 0.15 mm, a depth is 0.1 mm, and one side of an outer periphery is
2 mm.
[0016] Furthermore, in the heater 100 of this embodiment, a region surrounded by the groove
portion 4 is positioned at the side closer to the fore end of the ceramic structure
1 than the maximally heating region 10. Stated in another way, a part of the groove
portion 4, the part being positioned closest to the rear end of the ceramic structure
1, is positioned at the side closer to the fore end of the ceramic structure 1 than
the maximally heating region 10. With that arrangement, unevenness of the temperature
distribution can be further suppressed at the fore end side of the ceramic structure
1 where a heating target is disposed. It is to be noted that the position of the maximally
heating region 10 can be confirmed by measuring the temperature of the surface of
the ceramic structure 1 with a radiation thermometer, for example.
[0017] Moreover, as illustrated in Fig. 2(b), when looking at a cross-section of the ceramic
structure 1 sectioned in a direction perpendicular to the surface of the ceramic structure
1, the groove portion 4 preferably has a curved shape. With that feature, thermal
stress generated upon the ceramic structure 1 being heated to the high temperature
can be suppressed from being concentrated in the groove portion 4.
[0018] In addition, preferably, a slope of the groove portion 4 at the inner peripheral
side is more moderate than that at the outer peripheral side. With that feature, when
gas is supplied and flows around the heater 100, the gas flow coming into the groove
portion 4 from the outer peripheral side is moderated at the inner peripheral side,
whereby the gas is made more likely to stay in the groove portion 4.
[0019] The present invention is not limited to the above-described embodiment, and it can
be practiced with a variety of modifications, improvements, etc. within the scope
not departing from the gist of the present invention. For example, as illustrated
in Fig. 3, the groove portion 4 may be formed in a circular ring shape. With that
feature, thermal stress generated upon the ceramic structure 1 being heated to the
high temperature can be suppressed from being concentrated in the groove portion 4.
[0020] Alternatively, as illustrated in a sectional view of Fig. 4, a projection 5 may be
formed on the surface of the ceramic structure 1 along the outer periphery of the
groove portion 4 in continuous relation. With the presence of the projection 5 surrounding
the groove portion 4, when gas is supplied and flows around the heater 100, the gas
is even more likely to stay in the groove portion 4. When the depth of the groove
portion 4 is, for example, 0.1 mm as measured from the region surrounded by the groove
portion 4, the projection 5 is formed at a height of 0.01 mm or more as measured from
the region surrounded by the groove portion 4.
[0021] As illustrated in Fig. 5, when looking at a cross-section of the ceramic structure
1 sectioned in the direction perpendicular to the surface of the ceramic structure
1, the projection 5 may have a curved shape. With that feature, when gas is supplied
and flows around the heater 100, the gas can more easily flow into the inside surrounded
by the projection 5. As a result, the gas can be efficiently combusted at the inside
surrounded by the projection 5. The shape of the projection 5 may be, e.g., circular-arc
or semi-elliptic.
[0022] As illustrated in Figs. 6(a) and 6(b), a recess 6 may be formed, instead of the groove
portion 4 surrounding the folded portion 21 in opposing relation, in a region of the
surface of the ceramic structure 1, the region overlapping the folded portion 21.
With the arrangement that the recess 6 is formed in a region of a surface of the ceramic
structure 1, the surface facing the folded portion 21 and the region overlapping the
folded portion 21, the surface of a portion of the ceramic structure 1 where the recess
6 is formed (i.e., a bottom surface of the recess 6) can be positioned closer to the
heating resistor 2 than the surface of a region around such portion. Accordingly,
temperature in the surface of the portion of the ceramic structure 1 where the recess
6 is formed is more apt to increase. Thus, since the recess 6 in which temperature
is more apt to increase is formed near the maximally heating region 10, the temperature
difference between the maximally heating region 10 and a region in the vicinity of
the former can be reduced. Hence unevenness of temperature distribution in the surface
of the heater 100 can be suppressed. As a result, long-term reliability of the heater
100 can be improved. When the outer circumference of the folded portion 21 has the
curvature radius of 1 mm, the recess 6 is formed in a square shape dimensioned, for
example, such that a depth is 0.1 mm and one side of an outer periphery is 2 mm.
[0023] Furthermore, in the heater 100 illustrated in Fig. 6, the region where the recess
6 overlaps the folded portion 21 is positioned at the side closer to the fore end
of the ceramic structure 1 than the maximally heating region 10. Stated in another
way, a part of the recess 6, the part being positioned closest to the rear end of
the ceramic structure 1, is positioned at the side closer to the fore end of the ceramic
structure 1 than the maximally heating region 10. With that arrangement, unevenness
of the temperature distribution can be further suppressed at the fore end side of
the ceramic structure 1 where a heating target is disposed.
[0024] As illustrated in Fig. 7, when looking at a cross-section of the ceramic structure
1 sectioned in the direction perpendicular to the surface of the ceramic structure
1, the recess 6 may have a curved shape. With that feature, concentration of thermal
stress generated upon the ceramic structure 1 being heated to the high temperature
can be suppressed in the recess 6.
[0025] As illustrated in Fig. 8, a recess 61 may be formed in overlapped relation to a region
of a surface of the ceramic structure 1 at the side opposite to the surface where
the recess 6 is formed, the region facing the folded portion 21 of the heating resistor
2. With that feature, even when both the surfaces of the heater 100 are used to heat
a heating target, the temperature distribution in the surface of the ceramic structure
1 can be made more even.
[0026] The shape of the ceramic structure 1 is not limited to the above-mentioned square
rod, and it may be a round rod. Furthermore, a fore end portion of the ceramic structure
1 may have a hemisphere shape.
[0027] The folded portion 21 of the heating resistor 2 is not always limited to the form
folded into a semicircular shape as illustrated in the drawings, and it may be folded
into a an acute-angular shape or a polygonal shape, e.g., a rectangular shape.
[0028] The folded portion 21 of the heating resistor 2, which faces the surface of the ceramic
structure 1, is not always required to be formed such that the folded portion 21 and
the linear portions 22 face the surface of the ceramic structure 1 in parallel as
illustrated in the drawings. The folded portion 21 may face the surface of the ceramic
structure 1 in a state inclined relative to the same.
[0029] One example of a method for manufacturing the heater 100 of this embodiment will
be described below. First, conductive pastes each containing conductive ceramic powder,
a resin binder, etc. and becoming one of the heating resistor 2 and the power feeders
3 after firing are prepared. Furthermore, a ceramic paste containing insulating ceramic
powder, a resin binder, etc. and becoming an insulating base body, which constitutes
the ceramic structure 1, after firing is prepared.
[0030] Then, a compact made of the conductive paste, having a predetermined shape, and becoming
the heating resistor 2 is formed, for example, by the injection molding method using
the conductive paste for the heating resistor 2. In a state where the compact becoming
the heating resistor 2 is held in a metallic mold, the metallic mold is filled with
the conductive paste for the power feeders 3, and compacts made of the conductive
paste, having predetermined shapes, and becoming the power feeders 3 are formed integrally
with the above-mentioned compact. This leads to a state where the compacts of the
heating resistor 2 and the power feeders 3 connected to the heating resistor 2 are
held in the metallic mold.
[0031] Then, in the state where the compacts of the heating resistor 2 and the power feeders
3 are held in the metallic mold, a part of the metallic mold is replaced with another
one for molding the ceramic structure 1. Thereafter, the ceramic paste for the ceramic
structure 1 is filled into the metallic mold.
[0032] At that time, by employing the metallic mold capable of forming the groove portion
4 or the recess 6 in a region of the surface of the ceramic structure 1, the region
facing the folded portion 21 of the heating resistor 1, a compact of the heater 100
is obtained in which the heating resistor 2 and the power feeders 3 are covered with
the compact of the ceramic paste, and in which the groove portion 4 surrounding the
folded portion 21 in opposing relation or the recess 6 overlapping the folded portion
21 is formed in the region of the surface of the ceramic structure 1, the region facing
the folded portion 21 of the heating resistor 2. Then, the compact of the heater 100
including the groove portion 4 or the recess 6, which has the desired shape and size,
in the surface of the ceramic structure 1 can be obtained by a method of raising pressure
applied to eject an ejection pin when the compact is released from the metallic mold,
or by a method of cutting a principal surface of the compact.
[0033] Then, the heater 100 can be fabricated by firing the obtained compact at about 1700°C.
The firing is preferably performed in an atmosphere of non-oxidizing gas, e.g., hydrogen
gas.
EXAMPLE
[0034] The heater 100 according to EXAMPLE of the present invention was fabricated as follows.
First, the heating resistor 2 was fabricated by injection molding, namely by injecting
a conductive paste, which contained 50% by mass of tungsten carbide powder, 35% by
mass of silicon nitride powder, and 15% by mass of a resin binder, into a metallic
mold. In a state where the molded heating resistor 2 was held in the metallic mold,
the metallic mold was filled with the above-mentioned conductive paste becoming the
power feeders 3, whereby the power feeders 3 were formed and connected to the heating
resistor 2.
[0035] Next, in a state where the heating resistor 2 and the power feeders 3 were held in
a metallic mold, injection molding was performed by injecting, into the metallic mold,
a ceramic paste containing 85% by mass of silicon nitride powder, and 10% by mass
of biytterbium trioxide, and 5% by mass of tungsten carbide, the latter two serving
as sintering aids. As a result, the heater 100 was formed in which the heating resistor
2 and the power feeders 3 were embedded in the ceramic structure 1, the heating resistor
2 including the folded portion 21 near the fore end of the ceramic structure 1.
[0036] As Sample 1, a sample was fabricated in which the recess 6 in a depth of 50 µm with
one side having a length of 2.3 mm was formed in a region of a principal surface (5
mm x 30 mm) of the ceramic structure 1, the region being positioned at the fore end
side of the ceramic structure 1 and overlapping the folded portion 21. Furthermore,
metallic molds having various shapes were prepared, and heaters 100 (Samples 2 to
4) having principal surfaces different in configuration from that of Sample 1 were
fabricated. Those Samples each had dimensions of 5 mm in thickness, 10 mm in width,
and 30 mm in length, and they were different only in configuration of the principal
surface from Sample 1.
[0037] More specifically, in Sample 2, the groove portion 4 in a depth of 50 µm with one
side having a length of 2.3 mm was formed in the principal surface in such a configuration
that an inner wall surface at the inner side is inclined more moderately than an inner
wall surface at the outer side. In Sample 3, the groove portion 4 in a depth of 50
µm with one side having a length of 2.3 mm was formed in the principal surface, and
the projection 5 having a height of 20 µm was further formed in a state surrounding
the groove portion 4. In Sample 4, the groove portion 4 in a depth of 50 µm with one
side having a length of 2.3 mm was formed in the principal surface, and the projection
5 having a curved surface with a height of 20 µm at a top thereof was further formed
in a state surrounding the groove portion 4. In addition, Comparative Example 1 in
which the principal surface was flat was prepared as a comparative sample.
[0038] Next, after putting each of Samples 1 to 4 and Comparative Example 1, obtained as
described above, in a cylindrical die made of carbon, it was hot-pressed at temperature
of 1650°C to 1780°C under pressure of 30 MPa to 50 MPa for sintering in a non-oxidizing
gas atmosphere of nitrogen gas.
[0039] By comparing with the heater of Comparative Example 1, the heaters 100 of Samples
1 to 4 representing EXAMPLE of the present invention were confirmed on whether durability
was improved.
[0040] In more detail, each sample was set in a gas heater, and an ignition temperature
of the gas heater was examined. On the basis of the examined result, an endurance
test was carried out by repeating a cycle of, after supplying a current for 30 sec
at the ignition temperature, raising temperature at the fore end of the ceramic structure
up to 1200°C, and then stopping the supply of the current for 60 sec.
[0041] As a result, the heaters 100 of Samples 1 to 4 continued the normal operation even
after the number of cycles reached 230000 or more. In the heater of Comparative Example
1, however, a crack occurred in the principal surface of the ceramic structure 1 near
the maximally heating region 10 when the number of cycles reached about 60000.
[0042] As another evaluation test, a temperature distribution in a region from the fore
end of the ceramic structure 1 to the maximally heating region 10 was measured by
employing a radiation thermometer. In more detail, the temperature distribution in
the surface of the ceramic structure 1 was measured under the condition that, after
raising the temperature at the fore end of the ceramic structure 1 up to 1200°C, the
ceramic structure 1 was left to stand for 5 min in a state keeping application of
a voltage.
[0043] As a result, in the heater of Comparative Example 1, the temperature in the maximally
heating region of the ceramic structure was 1240°C, and the temperature at the fore
end of the ceramic structure was 1200°C. In contrast, in the heater 100 of Sample
1, the temperature in the maximally heating region 10 was 1250°C, the temperature
at the fore end was 1230°C, and the temperature in the recess 6 was 1240°C. In the
heater 100 of Sample 2, the temperature in the maximally heating region 10 was 1250°C,
the temperature at the fore end was 1230°C, and the temperature in the groove portion
4 was 1240°C. In the heater 100 of Sample 3, the temperature in the maximally heating
region 10 was 1250°C, the temperature at the fore end was 1230°C, and the temperature
in the groove portion 4 was 1240°C. In the heater 100 of Sample 4, the temperature
in the maximally heating region 10 was 1250°C, the temperature at the fore end was
1230°C, and the temperature in the groove portion 4 was 1240°C.
[0044] As seen from the above results, the temperature difference in the principal surface
of the ceramic structure was relatively large, i.e., 40°C, in the heater of Comparative
Example 1, while the relevant temperature difference was relatively small, i.e., 20°C,
in the heaters 100 of Samples 1 to 4. Thus, it was confirmed that unevenness of the
temperature distribution in the principal surface of the ceramic structure 1 can be
reduced by employing the configuration of the heater 100 of the present invention.
Consequently, it was also understood that a possibility of the occurrence of a crack
in the principal surface of the ceramic structure 1 can be reduced even with repeated
use of the heater 100.
[0045] As still another evaluation test, Samples 2 to 4 and Comparative Example 1 were each
set inside a casing for the test, the casing being provided with a gas inlet. While
continuously supplying gas to flow into the casing, measurement was performed on a
time until the gas was ignited after starting supply of a current to each of the heaters
100 of Samples 2 to 4 and the heater of Comparative Example 1, and a time until extinction
after stopping the supply of the current. The gas was prepared by evaporating diesel
fuel. As a result, in the heaters 100 of Samples 2 and 3, the time until the ignition
was within 40 sec. In contrast, in the heater of Comparative Example 1, the time until
the ignition took 60 sec. As seen from that result, in the heaters 100 of Samples
2 and 3, the time until the ignition is shortened by 20 sec and ignitibility is improved
in comparison with the heater of Comparative Example 1.
[0046] The above result is presumably attributable to the fact that, since the heater 100
of Sample 2 includes the groove portion 4 in which the inner wall surface at the inner
side is inclined more moderately than the inner wall surface at the outer side, the
flow of the gas incoming from the outer peripheral side of the groove portion 4 is
moderated near the inner wall surface at the inner side and the gas is more likely
to stay in the groove portion 4, whereby ignitibility is improved. Regarding Sample
3, it is thought that, because of including the projection 5 that surrounds the groove
portion 4, the gas is even more likely to stay in the groove portion 4, whereby ignitibility
is improved.
[0047] Moreover, comparing the time taken for the extinction after the end of heating between
the heater of Comparative Example 1 and the heater 100 of Sample 4, the time until
the extinction after stopping the supply of the current was about 70 sec in the heater
100 of Sample 4, while the time until the extinction was about 100 sec in the heater
of Comparative Example 1. Such a result is presumably attributable to the fact that,
because of the projection 5 having the curved shape, when the gas is supplied and
flows around the heater 100, the gas can more easily flow into the inside surrounded
by the projection 5, whereby the gas can be efficiently combusted at the inside surrounded
by the projection 5.
Reference Signs List
[0048]
1: ceramic structure
10: maximally heating region
2: heating resistor
21: folded portion
22: linear portion
3: power feeder
4: groove portion
5: projection
6: recess
7: lead terminal
100: heater