DENTAL COMPOSITIONS BASED ON POLYMERIZABLE RESINS CONTAINING ISOSORBIDE

Description

RELATED PATENT APPLICATION

[0001] This application claims priority to U.S. Provisional Patent Application No. 61/753,109, filed January 16, 2013.

TECHNICAL FIELD

[0002] Disclosed herein are polymerizable dental materials and dental products based upon such materials. More particularly, disclosed are materials and products based upon BPA-free, polymerizable resins that are derived from 1,4:3,6-dianhydro-glucidol (isosorbide), which comes from renewable sources such as corn.

BACKGROUND

[0003] Dental materials such as for example, dental filling materials, often include liquid polymerizable organic monomers and/or polymers, reactive diluents, polymerization initiators, stabilizers, and fillers. Such composite materials have their good mechanical properties such as high flexural strengths, high compressive strengths and hardness. Further, they are often polishable and readily accept suitable dyes. The most frequently used monomers are esters of methacrylates and higher multifunctional alcohols or isocyanates such as the bismethacrylate of biphenol-A diglycidyl ether, urethane bismethacrylates. Aromatic diols are often used to make polymerizable resins having good thermal and mechanical stability.

[0004] Bisphenol A (BPA) has been widely used in the manufacture of plastics and is present in many products, including dental products. Both the U.S. Food and Drug Administration and the National Toxicology Program at the National Institute of Health have expressed concern about the potential health effects associated with BPA.

[0005] Although BPA is not an ingredient in any dental products, it has been detected in some of the degraded dental products that contain BPA-based dental resins. BisGMA is one such BPA-based dental resin and has been widely used in many dental products. Regardless of the debate over the effect of potentially leached BPA from cured dental products that contain BisGMA or its derivatives, there are increasing efforts to manufacture BPA-free resins.

[0006] BisGMA is a high viscosity, dimethacrylate resin. Various structural modifications on BisGMA have been made in order to reduce its viscosity and to minimize the polymerization shrinkage and curing stress. The rigid aromatic moiety in BisGMA does contribute well to the high strength in cured BisGMA and its derivatives, although they are usually accompanied by higher shrinkage and higher curing stress. Conventional aliphatic resins, such as TEGDMA or UDMA are flexible and have low viscosity but they usually offer lower mechanical property. A variety of cyclic aliphatic moieties were also incorporated into polymerizable resins and an improved chemical property was demonstrated due to the rigid nature. However, most of monomer resins containing cyclic moiety are highly crystalline due to its chain regularity, which would limit its application as matrix resin for formulated dental composites. Therefore oligomeric resins have to be prepared, but these amorphous resins tend to have higher viscosity. Accordingly there is reduced cross-linking density after curing and furthermore lower mechanical property would result.

[0007] Bisphenol A (BPA) in particular is one such aromatic diol that has been widely used in epoxy resin, modified methacrylate resin, polyethersulfone/ketone, polyester, polycarbonate and the like, for use in dental materials. Resins or polymers from fully aliphatic diols are less popular due to their relative lower thermal stability. However, there have been investigations of resins and polymers based on cyclic aliphatic compounds, especially those that are multi-cyclic. Interest in such cyclic aliphatic diols has increased due to potential concerns of some aromatic diol, especially BPA. Accordingly, BPA-free resins or polymers would be highly desirable if they possessed the same or comparable thermal and mechanical stabilities as the BPA counterparts.

[0008] * WO2012/177960 discloses polymerizable isosorbide-based bisimidazole-dimethacrylate resins with antimicrobial properties for use in dental compositions. WO 96/13511 discloses poly-unsaturated carbohydrate derivatives and polymers thereof with water-binding and biocompatible properties comparable to hydrogels. Fenouillot et al. 2010 (Progress in Polymer Science 35 (2010) 578-622) is a scientific review article disclosing polymers from 1,4:3,6-dianhydrohexitols and their derivatives including isosorbide. Nelson et al. 2012 (Polymer International 2012; 61: 1485-1491) is a scientific review article disclosing polymer technologies to replace bisphenol-A in commercial products including isosorbide. Lukaszczyk et al. 2012 (Journal of Materials Science in Medicine (2012) 23:1149-1155) is a scientific article disclosing synthesis and properties of isosorbide-based bis-GMA analogues. WO 2011/063172 discloses dental materials and dental products comprising a cyclic diol such as 2,2,4,4,-tetramethyl-1,3-cyclobutandiol (TMCD).

SUMMARY

[0009] The present invention relates to dental material and dental compositions according to claims 1 and 2.

[0010] It was theorized that by incorporating a cyclic aliphatic moiety into polymerizable resin that a rigid BPA-free polymerizable resin with balanced overall performance could be achieved.

[0011] As one isomer of 1,4:3,6-dianhydro-hexitol (see above), the 1,4:3,6-dianhydro-glucidol (Isosorbide) is particularly of interest for its potential use In formulated dental products such as restoratives and the like. It is expected that such a moiety would provide an improved optical, thermal and mechanical properties in comparison to linear aliphatic analogies. Like TMCD, Isosorbide has been used in many polyesters or polycarbonates and is known to be a co-monomer. Some of key features from such polymers are high impact resistance, optical clarity, thermal stability and biodegradability in addition to being BPA-free.

[0012] During investigations, TMCD was used in BPA-free polymerizable resins and an effectively optimized resin composition/process for TMCD-based urethane resin had been developed, from which polymerlzable resin with high TMCD-content and lower viscosity resulted. However, though its overall mechanical property is better than UDMA resin, the mechanical properties remain lower than those of BisGMA-based resin systems. Therefore, suitable monomers to serve as components for BPA-free polymerizable resins are still desired. Isosorbide caught our attention because polymer grade isosorbide recently become commercially available, and is similar to TMCD in structure since both of them are a bicyclic diol, which would offer high heat-resistance and high Tg due to the rigid nature.

DETAILED DESCRIPTION

[0013] As stated above dental restorative materials, such as composites, adhesives, and cements have traditionally contained derivatives of BPA as the base polymeric component. These include monomers such as Bis-GMA, Bis-DMA, EPADMA and BADGE. There are also many examples of urethane resins produced by combining BPA and BPA derivatives with di-isocyanates. These components have provided exceptional properties such as high durability, chemical resistance and optical properties to formulated dental products.

[0014] Due to potential health concerns over human exposure to BPA, many producers of polymers which contain BPA and derivatives of BPA have been seeking new chemistry approaches. For instance, TMCD has been shown to be an effective substitute for BPA in polyester resin systems.

[0015] Disclosed herein, isosorbide is used as a building block for the development of new dental resin systems. The resultant isosorbide derivatives are substituted for their BPA derivative analogues in restorative formulations. The result is that high performance dental restorative materials are made free of BPA containing materials.

[0016] It is therefore, an accomplishment of the present disclosure to provide the use of isosorbide based monomers used in dental formulations, including restorative composites, bonding agents, cements, luting agents, bases, and liners.

[0017] Isosorbide monomers with pendant vinyl groups, namely, methacrylic moieties are provided according to the present invention.

[0018] The isosorbide monomers disclosed herein may have one or more pendant epoxy groups. Urethane derivatives are provided, normally produced through reaction of isosorbide with isocyanate based compounds. Isosorbide derivatives with phosphate, and other ionic functionalities, and isosorbide derivatives which may contain combinations of functionalities are disclosed. Resins or macromonomers which may incorporate isosorbide in its structure and dental formulations with isosorbide based compounds are also disclosed

[0019] Therefore, according to the present invention a dental material is provided based upon an isosorbide polymerizable resin. An example of such a dental product is a dental restorative that is light curable, such that it is placed into a prepared dental cavity and then exposed to electromagnetic radiation of an appropriate wavelength to initiate (or co-initiate if other initiators are useful) to polymerize the material. Before polymerization, the material must have suitable flow properties to allow it to be placed into the prepared cavity, yet may also be required to have a certain stiffness or resistance to flow to allow the dental practitioner the ability to manipulate it. Further, after polymerization, wear, toughness, fracture resistance, and other thermal and mechanical stabilities must be of a certain, desirable nature. While such aspects of dental restoratives are well developed with respect to BPA dental materials, it has been unexpected that such properties could be achieved by isosorbide materials.

[0020] Isosorbide is a diol molecule and it should be readily reacted with other condensation monomers to build up linkages such as ester, carbonate, urethane and the like (see Scheme 1) and to form polymerizable resins accordingly. Additional examples of isosorbide-based polymerizable resins are given in Scheme 2 through 8. For example, if isosorbide reacts with an isocyanate, it would yield a urethane-based resin; if isosorbide reacts with a carboxylic monomer, then it would yield an ester type of resin. The physical and mechanical properties of the resulting isosorbide-based resins would vary depending upon the resin's linkages, detailed molecular structures and the pathways to make such resins.

[0021] In Table I and II, examples are given for typical isosorbide-based polymerizable resins as illustrated by Scheme 1. In addition, such typical reaction pathways towards different types of polymerizable resin based on isosorbide are also given in Scheme 2-7. The resulting resins ranged from semicrystalline to low viscosity liquid or higher viscosity liquids, depending upon the resin compositions. These resins can be further formulated with any other resin and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be resulted after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO.

[0022] In Scheme 2, the reaction pathway towards urethane trimer resin based on isosorbide is illustrated. This resulting trimer resin is semi-crystalline with a melting point of 125°C. This resin can be formulated with other resins and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be achieved after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO and exposed to visible light.

[0023] In Scheme 3, the reaction pathway towards urethane type of polymerizable resin based on isosorbide from isosorbide/TMDI/HEMA in the presence of TEGDMA is illustrated. This resulting urethane resin is liquid resin but with very high viscosity. This resin can be formulated with other resins and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be achieved after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO and exposed to visible light.

[0024] In Scheme 4, the reaction pathway towards urethane type of polymerizable resin based on Isosorbide from isosorbide/TMDI/HPMA in the presence of TEGDMA is illustrated. This resulting urethane resin is liquid resin but with very high viscosity. This resin can be formulated with other resins and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be achieved after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO and exposed to visible light.

[0025] In Scheme 5, another reaction pathway towards urethane type of polymerizable resin based on isosorbide from isosorbide/IPDI/HEMA in the presence of TEGDMA is illustrated. This resulting urethane resin is liquid resin with high isosorbide content but very low viscosity. This resin can be formulated with other resins and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be achieved after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO and exposed to visible light.

[0026] In Scheme 6-7, the reaction pathway towards carbonate trimer type of polymerizable resin based on isosorbide from CDI/Isosorbide/HEMA or CDI/Isosorbide/AMAHP via a solution process is illustrated. This resulting carbonate resin is a liquid resin with low viscosity. This resin can be formulated with other resins and conventional initiators to make it polymerizable. Thus, clear, rigid cured resin can be achieved after it is formulated with different photoinitiators, such as CQ/EDAB or CQ/LTPO and exposed to visible light.

[0027] The polymerizable isosorbide-based composition according to the present disclosure may include a filler, stabilizer, polymerization initiator or cure package, or the like. Fillers may be inorganic filler and/or organic filler. In embodiments, fillers suitable for use in dental compositions in accordance with the present disclosure include quartz, glass ceramic or glass powders, as well as aluminium- and silicon oxide powder, in particular silicate glasses, Ba/Al silicate glasses and barium glasses as well as mixtures thereof. Other inorganic powders such as La₂O₃, ZrO₂, BiPO₄, CaWO₄, BaWO₄, SrF₂, Bi₂O₃, and/or organic fillers, such as polymer granulate or a combination of organic/or inorganic fillers could are also suitable filler materials. The filler are used as powders with a particle size of from about 0.010 micron to about 50 micron.

[0028] Total filler loading should vary from about 1% to about 95% by weight, depending upon the end applications. In Table II and III, examples of formulated isosorbide-based resin systems and their corresponding composites with about 40% of filler loading are shown. As can be seen from these Tables, extremely low curing stress can be achieved from the BPA-free resin systems formulated according to the present disclosure, though they offer only slightly lower shrinkage in comparison to a BPA-containing resin (for example, TPH resin, a urethane-modified BisGMA derivative).

[0029] An exemplary cement in accordance with a one embodiment of the present disclosure for dental and/or medical use includes from about 10 to about 30 percent by weight of an isosorbide monomer or co-monomer having at least one polymerizable group, from about 15 to about 35 percent by weight of a polymerizable monomer as diluent and a stabilizer, from about 50 to about 65 percent by weight of a filler and from about 0.34 to about 12 percent by weight of the polymerization initiator component(s).

[0030] A composite restorative composition in accordance with another embodiment of the present disclosure for dental and/or medical use includes from about 5 to about 25 percent by weight of an isosorbide monomer or co-monomer having at least one polymerizable group, from about 5 to about 20 percent by weight of a polymerizable monomer as diluent and a stabilizer, from about 50 to about 85 percent by weight of a filler and from about 0 to about 12 percent by weight of the polymerization initiator component(s).

[0031] A dental/medical sealer in accordance with one embodiment of the present disclosure for dental and/or medical use includes from about 15 to about 55 percent by weight of an isosorbide monomer or co-monomer having at least one polymerizable group, from about 20 to about 40 percent by weight of a polymerizable monomer as diluent and a stabilizer and from about 10 to about 50 percent by weight of a filler and 0.34 to about 12 percent by weight of the polymerization initiator component(s).

TEST METHODS:

[0032] NMR Analysis: 300MHz NMR (Varian) was used to elusive the molecular structure and to monitor the reaction processing.

[0033] Photo DSC: DSC 2529 with photocaltometor (TA Instrument) was used to evaluate the photolysis and photopolymerization for the neat resin and/or any formulated resin system. Under both air and nitrogen, the test was performed. The light outputs and light spectrum can be tuned by using build-in filter, or additional UV filter or intensity-reducing filter.

[0034] Flexural strength and modulus are tested according to ISO 4049, 2x2x25mm specimens were cured by three overlapped spot curing with Spectrum 800 with 13mm light guide at 800mw/cm², 20" for each spot on one side only. The cured specimens (6-10) were placed in DI water and stored at 37°C for 24hrs, then were sanded prior to the test at room temperature.

[0035] Compressive strength and modulus are tested according to ISO 9917, which is actually for water-based cements since ISO 4049 does not specify for compressive strength. φ4x6mm glass slave as mold for specimen preparation (6). It was cured by Spectrum 800 at 800mw/ cm² from both top and bottom, at 20" each. The cured specimens (6-10) were placed in DI water and stored at 37°C for 24hrs, and then were sanded prior to the test at room temperature.

[0036] Polymerization Shrinkage was calculated from the density change before and after curing, which were measured by helium pycnometer (Micromeritics, AccuPyc II 1340) at 25.0°C. New in-house shrinkage test protocol was followed in this test: 3 pieces of round disc samples from a φ10x2mm Teflon mold. It was presses between Mylar films and cured by Spectrum 800 at 800mw/cm² for 20 seconds from top and bottom sides, respectively. The cured specimen is stored at room temperature for 2-3hrs or for 24hrs prior to the density measurement.

[0037] Shrinkage Stress was measured by using NIST/ADA's tensometer. Specimen with 2.25mm in thickness (c-factor as 1.33) is cured for 60 seconds by DENTSPLY/Cauk's QHL light at 550mw/cm2. The total stress at the 60^th minute is taken to rank different materials.

EXAMPLES

Example 1: Synthesis of Isosorbide-based Carbonate Resin

[0038] A carbobate-based dimethacrylate resin (XJ7-191 in Table I) was prepared by a two-step condensation reaction from Isosorbide and CDI in methylene dichloride under a dry air atmosphere at room temperature, then AMAHP was added along with potassium carbonate and tetrabutyl ammnium bromide into the system for additional couple of hours. After extraction to remove the catalysts and imidazole, additional diluent of TEGDMA was mixed in and the final liquid resin with higher viscosity of 430Pa.s@20°C could be achieved after removal of the solvent.

Example 2: Synthesis of Isosorbide-based Carbonate Resin (Scheme 6)

[0039] Isosorbide carbonate dimethacrylate trimer (XJ7-205 in Table I) was prepared by a two-step condensation reaction from Isosorbide and CDI in methylene dichloride under a dry air atmosphere at room temperature, then HEMA was added along with potassium carbonate and tetrabutyl ammnium bromide into the system for additional couple of hours. After extraction to remove the catalysts and imidazole, low viscosity liquid resin of 10Pa.s@20°C could be achieved after removal of the solvent.

Example 3: Synthesis of isosorbide-based Urethane Resin (Scheme 2)

[0040] A urethane dimethacrylate trimer (XJ8-4 in Table I) was prepared by a one-step condensation reaction from Isosorbide and 2-isocyanateethyl methacrylate (IEM). The reaction was carried out in the presence of dibutyltin dilaurate in methylene dicloride under a dry air atmosphere at 30-35°C for 4 h. After solvent was removed, semicrystallime resin could be achieved with T_m of 125°C.

Example 4: Synthesis of Isosorbide-based Urethane Resin

[0041] A urethane dimethacrylate oligomer (XJ7-189 in Table I) was prepared by a one-step condensation reaction from a preformed monohydroxy-monmethacrylate (ICEM, derived from TMDI and HPMA) and Isosorbide in the presence of dibutyltin dilaurate under a dry air atmosphere at 30-35°C for 14 h. High viscosity liquid resin of 2180Pa.s@20°C was achieved.

Example 5/6: Synthesis of Isosorbide-based Urethane Resin (Scheme 3)

[0042] Urethane dimethacrylate oligomers (XJ8-19/XJ8-69 in Table I) were prepared by a two-step condensation reaction from isosorbide and slight excess of TMDI in presence of a diluent such as TEGDMA, followed by a reaction between the NCO-terminated prepolymer and 2-hydroxyethyl methacrylate(HEMA). The first reaction was carried out in the presence of dibutyltin dilaurate under a dry air atmosphere at 30-35°C for 4 h. To the resulting prepolymer, BHT was added as inhibitor. TEGDMA can be used as inert diluent for ease of the reaction process. Liquid resin with moderate viscosity of 270-280Pa.s@2O°C was achieved.

Example 7: Synthesis of Isosorbide-based Urethane Resin (Scheme 4)

[0043] Urethane dimethacrylate oligomers (XJ8-72 in Table I) were prepared by a two-step condensation reaction from isosorbide and slight excess of TMDI in presence of a diluent such as TEGDMA, followed by a reaction between the NCO-terminated prepolymer and 2-hydroxypropyl methacrylate(HPMA). The first reaction was carried out in the presence of dibutyltin dilaurate under a dry air atmosphere at 30-35°C for 4 h. To the resulting prepolymer, BHT was added as inhibitor. TEGDMA can be used as inert diluent for ease of the reaction process. Liquid resin with higher viscosity of 550Pa.s@20°C was achieved.

Example 8: Synthesis of Isosorbide-based Urethane Resin (Scheme 5)

[0044] Urethane dimethacrylate oligomers (XJ8-78 in Table I) were prepared by a two-step condensation reaction from isosorbide and slight excess of IPDI in presence of a diluent such as TEGDMA, followed by a reaction between the NCO-terminated prepolymer and 2-hydroxyethyl methacrylate(HEMA). The first reaction was carried out in the presence of dibutyltin dilaurate under a dry air atmosphere at 30-35°C for 4 h. To the resulting prepolymer, BHT was added as inhibitor. TEGDMA can be used as inert diluent for ease of the reaction process. Liquid resin with high viscosity of 1310Pa.s@20°C was achieved.

Example 9: Synthesis of Isosorbide-based Urethane Resin

[0045] Urethane dimethacrylate oligomers (XJ8-11 in Table I) were prepared by a two-step condensation reaction from isosorbide and slight excess of TMDI in presence of a diluent such as HMDMA, followed by a reaction between the NCO-terminated prepolymer and 2-hydroxyethyl methacrylate(HEMA). The first reaction was carried out in the presence of dibutyltin dilaurate under a dry air atmosphere at 30-35°C for 4 h. To the resulting prepolymer, BHT was added as inhibitor. TEGDMA can be used as inert diluent for ease of the reaction process. Liquid resin with high viscosity of 270Pa.s@20°C was achieved.

[0046] In Table II, Examples 8 through 15 showed further formulated resin compositions, which were comprised of Isosorbide-based polymerizable resins previously described, and other conventional (meth)acrylate resins and a variety of photoinitaitors (CQ, LTPO etc). A comparable example 1 was also included with the exclusion of any Isosorbide-based resins disclosed herein.

[0047] Examples 16 through 23 showed those formulated composite compositions, which are comprised of a variety of formulated isosorbide-based polymerizable resins as described herein, and 40-82% wt/wt of glass filler mixtures. A comparable example 2 is also included with the exclusion of any isosorbide-based resins dislcosed herein.

Table la: Resin Composition and Viscosity (at 20°C/500Pa)

Resins	Diol	Isocyanate or CDI	Hydroxylated Mathacrylate	Diluents	Viscosity at 20°C/500Pa
	(grams)	(grams)	(grams)	(grams)	(Pa.s)
Control Example 1	TMCD	TMDI	HEMA	TEGDMA	80
	25	81	60	30
Control Example 2	TMCD	IPDI	HEMA	TEGDMA	1010
	25	85	60	30
Sample 1 (XJ7-191)	Isosorbide	CDI	AMAHP	TEGDMA	430
	37	82	110	19
Example 2 (XJ7-205)	Isosorbide	CDI	HEMA		10
	37	81	66
Example 3 (XJ8-4)	Isosorbide	IEM			crystalline
	74	155			Tm=125°C
Example 4 (XJ8-189)	Isosorbide	ICEM			2180
	40	275
Example 5 (XJ8-19)	Isosorbide	TMDI	HEMA	TEGDMA	270
	40	127	91	45
Example 6 (XJ8-69)	Isosorbide	TMDI	HEMA	TEGDMA	280
	73	231	165	85
Example 7 (XJ8-72)	Isosorbide	TMDI	HPMA	TEGDMA	550
	73	231	183	85
Example 8 (XJ8-78)	Isosorbide	IPDI	HEMA	TEGDMA	1310
	73	245	165	185
Example 9 (XJ8-82)	Isosorbide	TMDI	HEMA	TEGDMA	250
	73	231	165	85
Example 10 (XJ8-86)	Isosorbide	TMDI	HEMA	TEGDMA	290
	73	231	165	85
Example 11 (XJ8-90)	Isosorbide	TMDI	HEMA	HMDMA	270
	73	231	165	81
Example 12 (EBR10220)	Isosorbide	TMDI	HEMA	TEGDMA	240
	658	2083	1488	766
Example 13 (EBR10224)	Isosorbide	TMDI	HEMA	TEGDMA	260
	658	2083	1488	766

Table IIa: Composition Examples for Various Isosorbide-based Polymerizable Resins

	Example 1 (XJ7-191)	Example 2 (XJ7-205)	Example 3 (XJ8-4)	Example 4 (XJ7-189)
Resin Composition	Isosorbide/AMAHP/ TEGDMA	Isosorbide/HEMA	Isosobide/IEM	Isosobide/ICEMI HEMA
Isosorbide-based Resin,	90	100	100	67
TEGDMA,	10	0	0	0
UDMA, (wt/wt, %)	0	0	0	33
Resin Form	Liquid	Liquid	crystalline	Liquid
Viscosity @ 20°C Pa.s	430	10	Tm=125°C	2180
Solubility @ 37°C in water	partially soluble	insoluble	Insoluble	Insoluble
Solubility @ 37°C in water/ethanol(50:50, w/w%)	soluble	partially soluble	insoluble	insoluble

Table IIb: Composition Examples for Various Isosorbide-based Polymerizable Resins

	Example 5 (XJ8-19)	Example 6 (XJ8-69)	Example 7 (XJ8-72)	Example 8 (XJ8-78)
Resin Composition	TEGDMA/ Isosorbide/TMDI/ HEMA	TEGDMA/ Isosorbide/TMDI/ HEMA	TEGDMA/ Isosorbide/TMDI/ HPMA	TEGDMA/ Isosorbide/IPDI/ HEMA
Isosorblde-based Resin,	74.8	74.5	74.7	63.7
TEGDMA,	15.0	15.4	14.8	27.7
HEMA	1.8	1.6	0	1.4
HPMA	0	0	1.8	0
UDMA, (wt/wt, %)	8.5	8.5	8.7	7.2
Resin Form	Liquid	Liquid	Liquid	Liquid
Viscosity @ 20°C Pa.s	270	280	550	1310
Solubility @ 37°C In water	insoluble	insoluble	Insoluble	insoluble
Solubility @ 37°C In water/ethanol(50:50, w/w%)	insoluble	insoluble	Insoluble	insoluble

Table IIIa: Physical Property for Various Formulated Isosobide-based Resins

	Formulated Resin 1 (DP1-21)	Formulated Resin 2 (XJ7-196)	Formulated Resin 3 (XJ7-208)	Formulated Resin 4 (XJ8-22)	formulated Resin 5 (XJ8-23)
	75% Example 4	80% Example 1	100% Example 2	92.5% Example 5	80% Example 5
	25% TEGDMA	20% TEGDMA		7.5% TEGDMA	10% TEGDMA 10% Example 3
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Viscosity @20°C Pa.s	8	12	10	66	53
Stress @ 60 min MPa	0.36	1.10	2.30	1.32	1.92

Table IIIb: Physical Property for Various Formulated Isosorbide-based Composites

	Composite 9 XJ8-24	TMCD Composite 4 XJ7-132
Resins	Formulated Isosorbide Resin 4 (XJ8-22)	Formulated TMCD Resin 4 (XJ7-130)
Fillers	DP1-64/	LB8-131
(wt/wt)	40%	40%
Stress @ 60 min MPa	1.15/1.80	0.91/NA
Compressive Yield St.(MPa)	142 ± 2	116±3
Compressive Modulus(MPa)	3900 ± 80	3220 ± 440
Flexural St.(MPa)	94 ± 6	91 ± 2
Flexural Modulus(MPa	2980 ± 200	2710 ± 240

Table IVa: Compositions and Physical Property for Various Formulated Resins

	Example 14	Example 15	Example 16	Example 17
	DP2-76	DP2-77	DP2-78	DP2-149
	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin
	90% XJ8-19	80% XJ8-65	80% XJ8-65	90% XJ8-69
	10% TEGDMA	20% TEGDMA	20% HEDMA	10% HEDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Viscosity@20°C Pa.s	40	10	20	40
Stress @ 60 min (Vis/UV-Vis), MPa	1.40/1.80	2.1/2.60	1.90/2.30	1.72/1.80
Compressive Yield St.(MPa)	133 ± 6	130 ± 5	134 ± 2	136 ± 2
Compressive Modulus(MPa)	2300 ± 110	2320 ± 120	2430 ± 240	2270 ± 160
Flexural St.(MPa)	79 ± 4	80 ± 6	73 ± 1	76 ± 4
Flexural Modulus(MPa	2020 ± 50	2020 ± 230	1750 ± 50	1930 ± 200

Table IVb: Compositions and Physical Property for Various Formulated Resins

	Example 18	Example 19	Example 20	Example 21
	DP2-164	DP2-194	DP3-9	DP3-30
	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin
	85% XJ8-78	90% XJ8-72	83% XJ8-78	90% XJ8-86
	15% TEGDMA	10% TEGDMA	17% TEGDMA	10% HEDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Viscoslty@20°C Pa.s	40	65	25	40
Stress @ 60 min (Vis/UV-Vis), MPa	2.20/2.63	1.30/1.60	1.40/1.80	1.35/1.85
Compressive Yield St.(MPa)	150 ± 9	116 ± 4	127 ± 4	124 ± 1
Compressive Modulus(MPa)	2860 ± 50	2480 ± 80	2600 ± 90	2610 ± 40
Flexural St.(MPa)	92 ± 7	81 ± 5	103 ± 3	83 ± 4
Flexural Modulus(MPa	2430 ± 250	2050 ± 280	2630 ± 150	2170 ± 120

Table V: Compositions and Physical Property for Various Formulated Resins

	Example18	Example 19	Example 20	Example 21	Example 22	Example 23
	DP2-106	DP2-107	DP2-150	DP2-165	DP3-10	DP3-31
	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin
	90% XJ8-19	85% XJ8-65	90% XJ8-69	85% XJ8-78	83% XJ8-78	85% XJ8-65
	10% TEGDMA	15% TEGDMA	10% TEGDMA	15% TEGDMA	17% TEGDMA	15% TEGDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Viscosity@20°C Pa.s	40	40	40	40	25	40
Stress @ 60 min (Vis/UV-Vis), MPa	2.25/2.65	2.05/2.60	2.05/2.60	2.45/2.90	3.00/3.00	2.20/2.40
Compressive Yield St.(MPa)	133 ± 5	125 ± 8	136 ± 4	150 ± 4	131 ±4	123 ± 1
Compressive Modulus(MPa)	2000 ± 300	2110 ± 400	2220 ± 410	2110 ± 400	2700 ± 80	2610 ± 80
Flexural St.(MPa)	101 ± 15	88 ± 7	90 ± 5	80 ± 9	131 ± 4	99 ± 6
Flexural Modulus(MPa)	2530 ± 200	2150 ± 300	2240 ± 60	2150 ± 300	2830 ± 100	2450 ± 170

Table VIa: Compositions and Properties for Various Resin Composite

	Composite 10	Composite 11	Composite 12	Composite 13
Composite	DP2-24	DP2-80	DP2-82	DP2-83
		Example 14	Example 15	Example 16
Resins	DP2-9	DP2-76	DP2-77	DP2-78
(wt/wt, %)
	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin
	90% XJ8-19	90% XJ8-19	80% XJ8-65	80% XJ8-65
	10% TEGDMA	10% TEGDMA	20% TEGDMA	20% HMDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Fillers	DP1-64	DP1-64	DP1-64	DP1-64
(wt/wt, %)	80.0	80.2	80.8	80.8
Stress @ 60 min (Vis/UV-Vis), MPa	1.85/2.30	2.20/2.25	2.60/2.70	2.422.35
Compressive St.(MPa)	305 ± 15	294 ± 19	294 ± 12	322 ± 15
Compressive Modulus(MPa)	6040 ± 620	5985 ± 430	5990 ± 390	6200 ± 330
Flexural St.(MPa)	135 ± 8	122 ± 18	118 ± 10	102 ± 19
Flexural Modulus(MPa	10000 ± 830	10140 ± 1080	10280 ± 150	8810 ± 600

Table Vlb: Compositions and Properties for Various Resin Composite

Composite	Composite 14	Composite 15	Composite 16	Composite 17
	DP2-151	DP2-166	DP2-196	DP3-12
Resins	Example 14	Example 14	Example 15	Example 16
	DP2-149	DP2-164	DP2-194	DP3-9
(wt/wt, %)
	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin
	90% XJ8-19	85% XJ8-78	90% XJ8-72	83% XJ8-78
	10% TEGDMA	15% TEGDMA	10% TEGDMA	17% HMDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Fillers	DP1-64	DP1-64	DP1-64	DP3-11
(wt/wt, %)	80.0	80.0	80.8	80.2
Stress @ 60 min (Vis/UV-Vis), MPa	1.85/2.30	1.85/2.30	2.60/2.70	2.10/2.22
Compressive St.(MPa)	305 ± 15	305 ± 15	297 ± 15	310 ± 16
Compressive Modulus(MPa)	6040 ± 620	6040 ± 620	5400 ± 540	5500 ± 480
Flexural St.(MPa)	135 ± 8	100 ± 10	117 ±10	91 ± 13
Flexural Modulus(MPa	10000 ± 830	10900 ± 500	9840 ± 860	11190 ± 650

Table VIc: Compositions and Properties for Various Resin Composite

Composite	Composite 18	Composite 19	Composite 20	Composite 21	Composite 22
	DP3-28	DP3-32	DP3-35	DP3-58	DP3-60
Resins	Example 16	Example 21	Example 21	Example 21	Example 21
	DP3-9	DP3-30	DP3-30	DP3-30	DP3-30
(wt/wt, %)
	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin	Isosobide Resin
	83% XJ8-78	90% XJ8-86	90% XJ8-86	90% XJ8-86	90% XJ8-86
	17% TEGDMA	10% TEGDMA	10% TEGDMA	10% HMDMA	10% HMDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB	0.30% EDAB
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Fillers	DP3-11	DP3-11	DP3-34	DP3-11	DP3-34
(wt/wt, %)	83.0	83.0	83.0	65.0	65.0
Stress @ 60 min (Vis/UV-Vis), MPa	2.02/2.12	2.02/2.12	2.20/2.50	1.83/2.15	1.56/2.10
Compressive St.(MPa)	305 ± 17	316 ± 24	310 ± 24	302 ± 14	291 ± 23
Compressive Modulus(MPa)	5860 ± 450	5730 ± 370	5430 ± 350	4630 ± 410	4140 ± 510
Flexural St.(MPa)	100 ± 10	138 ± 12	137 ± 10	119 ± 10	115 ± 7
Flexural Modulus(MPa)	11950 ± 470	10900 ± 630	11150 ±640	5700 ± 420	5600 ± 40

Table VIIa: Compositions and Properties for Various Resin Composite

Composite	DP2-109	DP2-110	DP2-152	DP2-167	DP2-197
Resins	DP2-106	DP2-107	DP2-150	DP2-165	DP2-195
(wt/wt. %)
	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin
	90% XJ8-19	85% XJ8-65	90% XJ8-69	85% XJ8-78	90% XJ8-72
	10% TEGDMA	15% TEGDMA	10% TEGDMA	15% TEGDMA	10% TEGDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Fillers	DP1-64	DP1-64	DP1-64	DP1-64	DP1-64
(wt/wt, %)	80.0	80.0	80.0	80.9	80.9
Stress @ 60 min (Vis/UV-Vis), MPa	2.05/2.22	2.05/2.20	2.25/2.40	2.28/2.32	1.95/2.15
Compressive St.(MPa)	272 ± 16	278 ± 23	333 ± 12	310 ± 7	300 ± 12
Compressive Modulus(MPa)	5910 ± 300	5700 ± 330	6050 ± 340	6140 ± 110	5570 ± 350
Flexural St.(MPa)	121 ± 17	114 ± 13	138 ± 10	121 ± 9	134 ± 9
Flexural Modulus(MPa	10870 ± 900	9690 ± 1280	10500 ± 740	12800 ± 900	11210 ± 830

Table VIIb: Compositions and Properties for Various Resin Composite

Composite	DP3-13	DP3-29	DP3-33	DP3-36	DP3-59	DP3-61
Resins	DP3-10	DP3-10	DP3-31	DP3-31	DP3-31	DP3-31
(wt/wt, %)
	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin	Isosorbide Resin
	83% XJ8-78	83% XJ8-78	90% XJ8-86	90% XJ8-86	90% XJ8-86	90% XJ8-86
	17% TEGDMA	17% TEGDMA	10% TEGDMA	10% TEGDMA	10% TEGDMA	10% TEGDMA
	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ	0.165% CQ
	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO	0.40% LTPO
	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT	0.015% BHT
Fillers	DP3-11	DP3-11	DP3-11	DP3-34	DP3-11	DP3-34
(wt/wt, %)	80.2	83.0	83.0	83.0	65.0	65.0
Stress @ 60 min (Vis/UV-Vis), MPa	2.12/2.41	2.10/2.10	2.22/2.25	1.90/2.50	2.10/2.38	2.10/2.50
Compressive St.(MPa)	303 ± 21	325 ± 20	298 ± 18	315 ± 14	289 ± 14	283 ± 10
Compressive Modulus(MPa)	5410 ± 310	6360 ± 420	5730 ± 720	5900 ± 420	4550 ± 510	4430 ± 380
Flexural St.(MPa)	102 ± 9	118 ± 11	153 ± 8	140 ± 12	130 ± 9	129 ± 7
Flexural Modulus(MPa	12400 ± 730	11980 ± 950	12700 ± 380	12330 ±610	6550 ± 330	6700 ± 340

[0048] It will be appreciated that various of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also, various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art.

Claims

1. A polymerizable dental material derived from 1,4:3,6-dianhydro-glucidol, wherein the dental material is







or

2. A dental composition comprising the dental material according to claim 1 or a dental material, which is

a filler, a stabilizer, and a cure package.

Ansprüche

1. Polymerisierbares Dentalmaterial, abgeleitet von 1,4:3,6-Dianhydro-glucidol, wobei das Dentalmaterial Folgendes ist:







oder

2. Dentalzusammensetzung, umfassend das Dentalmaterial nach Anspruch 1 oder ein Dentalmaterial, das Folgendes ist:

ein Füllstoff, ein Stabilisator und ein Härtungspaket.

Revendications

1. Matériau dentaire polymérisable dérivé de 1,4:3,6-dianhydro-glucidol, dans lequel le matériau dentaire est







ou

2. Composition dentaire comprenant le matériau dentaire selon la revendication 1 ou un matériau dentaire, qui est

un amalgame, un stabilisant et une formulation de polymériseur.