(19)
(11) EP 2 950 360 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
17.02.2016 Bulletin 2016/07

(43) Date of publication:
02.12.2015 Bulletin 2015/49

(21) Application number: 14743708.1

(22) Date of filing: 23.01.2014
(51) International Patent Classification (IPC): 
H01L 35/34(2006.01)
(86) International application number:
PCT/JP2014/051375
(87) International publication number:
WO 2014/115803 (31.07.2014 Gazette 2014/31)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 24.01.2013 JP 2013011514

(71) Applicant: DENSO CORPORATION
Kariya-city, Aichi 448-8661 (JP)

(72) Inventors:
  • MIYAGAWA, Eijirou
    Kariya-city Aichi 448-8661 (JP)
  • SAITOU, Keita
    Kariya-city Aichi 448-8661 (JP)
  • SHIRAISHI, Yoshihiko
    Kariya-city Aichi 448-8661 (JP)
  • YAZAKI, Yoshitaro
    Kariya-city Aichi 448-8661 (JP)
  • TANIGUCHI, Toshihisa
    Kariya-city Aichi 448-8661 (JP)
  • SAKAIDA, Atusi
    Kariya-city Aichi 448-8661 (JP)

(74) Representative: Kuhnen & Wacker 
Patent- und Rechtsanwaltsbüro Prinz-Ludwig-Straße 40A
85354 Freising
85354 Freising (DE)

   


(54) METHOD FOR MANUFACTURING THERMOELECTRIC CONVERTER


(57) An insulating substrate (10) is prepared. In the substrate, plurality via holes (11 and 12) penetrating in a thickness direction are filled with a conductive paste (41 and 51). This paste is produced by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms retain a predetermined crystalline structure, and by processing the powder to a paste. The insulating substrate (10) is then pressed from a front surface (10a) and a back surface (10b) of the insulating substrate (10), while being heated. The conductive paste (41 and 51) is solid-phase sintered and interlayer connecting members (40 and 50) are formed. A front surface protective member (20) is disposed on a front surface (10a) of the substrate (10) and a back surface protective member (20) is disposed on a back surface (10b) of the substrate (10), and a laminate (80) is formed. The laminate (80) is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members (40 and 50).