(19)
(11) EP 2 952 886 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
10.02.2016 Bulletin 2016/06

(88) Date of publication A3:
09.12.2015 Bulletin 2015/50

(43) Date of publication:
09.12.2015 Bulletin 2015/50

(21) Application number: 14171633.2

(22) Date of filing: 06.06.2014
(51) International Patent Classification (IPC): 
G01N 27/12(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(71) Applicant: Sensirion AG
8712 Stäfa (CH)

(72) Inventors:
  • Mayer, Felix
    8712 Stäfa (CH)
  • Hunziker, Werner
    8712 Stäfa (CH)
  • Pustan, David
    8712 Stäfa (CH)
  • Bühler, Johannes
    8712 Stäfa (CH)

   


(54) Method for manufacturing a gas sensor package


(57) A method for manufacturing a gas sensor package, comprising the steps of mounting a semiconductor chip (3) on a carrier (2) and applying a mold compound (1) for at least partially enclosing the semiconductor chip (3) thereby generating an opening (11) in the mold compound (1), wherein the opening (11) provides access to a portion of the semiconductor chip (3) being uncovered by the mold compound (1). After molding, a sensitive material is applied through the opening (11) onto the uncovered portion of the semiconductor chip (3) for building a layer (31) sensitive to a gas.