(19)
(11) EP 2 960 931 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
04.11.2020 Bulletin 2020/45

(45) Mention of the grant of the patent:
26.08.2020 Bulletin 2020/35

(21) Application number: 15169502.0

(22) Date of filing: 24.07.2008
(51) International Patent Classification (IPC): 
H01L 21/60(2006.01)
H01B 5/02(2006.01)
 H01L 23/49(2006.01)
H01L 23/00(2006.01)

(54)

COPPER BOND WIRE

KUPFERBONDDRAHT

FIL DE CONNEXION EN CUIVRE

(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

(30) Priority: 24.07.2007 JP 2007192193

(43) Date of publication of application:
30.12.2015 Bulletin 2015/53

(62) Application number of the earlier application in accordance with Art. 76 EPC:
08791508.8 / 2221861

(73) Proprietors:
  • NIPPON STEEL Chemical & Material Co., Ltd.
    Tokyo 103-0027 (JP)
  • Nippon Micrometal Corporation
    Iruma-shi, Saitama 358-0032 (JP)

(72) Inventors:
  • Uno, Tomohiro
    Tokyo 100-8071 (JP)
  • Kimura, Keiichi
    Tokyo 100-8071 (JP)
  • Terashima, Shinichi
    Tokyo 100-8071 (JP)
  • Yamada, Takashi
    Iruma-shi, Saitama 358-0032 (JP)
  • Nishibayashi, Akihito
    Iruma-shi, Saitama 358-0032 (JP)

(74) Representative: Vossius & Partner Patentanwälte Rechtsanwälte mbB 
Siebertstrasse 3
81675 München
81675 München (DE)


(56) References cited: : 
EP-A1- 1 447 842
JP-A- 4 184 946
JP-A- 2001 196 411
JP-A- 2006 190 763
JP-A- 2007 123 597
 WO-A1-2006/073206
JP-A- H11 243 111
JP-A- 2006 100 777
JP-A- 2007 012 776
US-A- 6 140 583
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).