(19)
(11) EP 2 965 349 A2

(12)

(88) Date of publication A3:
26.02.2015

(43) Date of publication:
13.01.2016 Bulletin 2016/02

(21) Application number: 14712447.3

(22) Date of filing: 03.03.2014
(51) International Patent Classification (IPC): 
H01L 21/683(2006.01)
 H01L 21/78(2006.01)
(86) International application number:
PCT/US2014/019914
(87) International publication number:
WO 2014/137905 (12.09.2014 Gazette 2014/37)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 06.03.2013 US 201313787032

(71) Applicant: Plasma-Therm, LLC
St. Petersburg, FL 33716 (US)

(72) Inventors:
  • MARTINEZ, Linnell
    Lakeland, FL 33813 (US)
  • PAYS-VOLARD, David
    St. Petersburg, FL 33703 (US)
  • JOHNSON, Chris
    St. Petersburg, FL 33709 (US)
  • JOHNSON, David
    Cleveland, GA 30528 (US)
  • WESTERMAN, Russelll
    Land O'Lakes, FL 34639 (US)
  • GRIVNA, Gordon, M.
    Mesa, AZ 85210 (US)

(74) Representative: Schmid, Wolfgang 
Lorenz & Kollegen Patentanwälte Partnerschaftsgesellschaft mbB Alte Ulmer Strasse 2
89522 Heidenheim
89522 Heidenheim (DE)

   


(54) METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER