(19)
(11) EP 2 973 689 A1

(12)

(43) Date of publication:
20.01.2016 Bulletin 2016/03

(21) Application number: 14774761.2

(22) Date of filing: 19.02.2014
(51) International Patent Classification (IPC): 
H01L 23/473(2006.01)
(86) International application number:
PCT/US2014/017184
(87) International publication number:
WO 2014/158481 (02.10.2014 Gazette 2014/40)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 14.03.2013 US 201361786300 P

(71) Applicant: Tactus Technology, Inc.
Fremont, CA 94555 (US)

(72) Inventors:
  • YAIRI, Micah
    Fremont, CA 94555 (US)
  • CIESLA, Craig
    Fremont, CA 94555 (US)
  • CONSTANTINE, Perry, George
    Fremont, CA 94555 (US)
  • WEIGAND, Dave, Lind
    Fremont, CA 94555 (US)

(74) Representative: Stanners, David Ralph 
Urquhart-Dykes & Lord LLP The Podium 1 Eversholt Street
London NW1 2DN
London NW1 2DN (GB)

   


(54) SYSTEM FOR COOLING AN INTEGRATED CIRCUIT WITHIN A COMPUTING DEVICE