(19)
(11) EP 2 985 581 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
23.03.2016 Bulletin 2016/12

(88) Date of publication A3:
17.02.2016 Bulletin 2016/07

(43) Date of publication:
17.02.2016 Bulletin 2016/07

(21) Application number: 15176872.8

(22) Date of filing: 15.07.2015
(51) International Patent Classification (IPC): 
G01L 19/00(2006.01)
H01R 13/24(2006.01)
G01R 1/067(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 05.08.2014 US 201414451926

(71) Applicant: Sensata Technologies, Inc.
Attleboro, MA 02703 (US)

(72) Inventors:
  • BOUSQUET, Cory Z.
    Cranston, RI Rhode Island 02910 (US)
  • PARK, June
    Providence, RI Rhode Island 02906 (US)

(74) Representative: Legg, Cyrus James Grahame et al
Abel & Imray 20 Red Lion Street
London WC1R 4PQ
London WC1R 4PQ (GB)

   


(54) SMALL FORM FACTOR PRESSURE SENSOR


(57) A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.