TECHNOLOGICAL FIELD
[0001] Examples of the present disclosure relate to an apparatus and method for multilayer
barrier coating. Some examples, though without prejudice to the foregoing, relate
to a multilayer thin-film composite barrier coating for encapsulation of an object,
not least for example a flexible substrate such as an organic light-emitting display
(OLED) or photovoltaic cell.
BACKGROUND
[0002] Conventional barrier coatings are not always optimal. Previous coatings may not provide
adequate barrier properties in thin-film form and/or may be too bulky and brittle
for long term flexible use as a barrier coating for a flexible substrate, such as
flexible OLEDs and flexible active-matrix OLEDs (AMOLEDs) which require a high degree
of protection from moisture and oxygen penetration as well as maintaining such protection
during long-term flexible use.
[0003] The listing or discussion of any prior-published document or any background in this
specification should not necessarily be taken as an acknowledgement that the document
or background is part of the state of the art or is common general knowledge. One
or more aspects/examples of the present disclosure may or may not address one or more
of the background issues.
BRIEF SUMMARY
[0004] The present invention is as set out in the independent claims.
[0005] According to at least some but not necessarily all examples of the disclosure there
is provided an apparatus configured to provide a multilayer barrier coating for a
surface, the apparatus comprising: at least a first layer and a third layer formed
via a first process; and at least a second layer, between the first and third layers,
formed via a second process different to the first process; wherein the first process
is a Sol-Gel process.
[0006] According to at least some but not necessarily all examples of the disclosure there
is provided a method comprising causing, at least in part, actions that result in:
forming a first layer of a multilayer barrier coating on a substrate via a first process;
forming a second layer of the multilayer barrier coating via a second process different
to the first process; forming a third layer of the multilayer barrier coating via
the first process, such that the second layer interposes the first and third layers;
and wherein the first process is a Sol-Gel process.
[0007] According to at least some but not necessarily all examples of the disclosure there
is provided a multilayer barrier coating fabricated by the above method.
[0008] According to at least some but not necessarily all examples of the disclosure there
is provided a substrate, device or object (such as, for example, an Organic Light
Emitting Diode or a Photovoltaic cell) at least partially encapsulated by the above
multilayer barrier coating.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] For a better understanding of various examples of the present disclosure that are
useful for understanding the detailed description and certain embodiments of the invention,
reference will now be made by way of example only to the accompanying drawings in
which:
Figure 1 schematically illustrates an example of a multilayer barrier coating;
Figure 2 schematically illustrates a further example of a multilayer barrier coating;
Figure 3 schematically illustrates a yet further example of a multilayer barrier coating;
Figure 4 schematically illustrates an object encapsulated by a multilayer barrier
coating; and
Figure 5 schematically illustrates an example of a method.
DETAILED DESCRIPTION
[0010] The Figures schematically illustrate an apparatus 100 configured to provide a multilayer
barrier coating for a surface 201'. The apparatus 100 comprises:
at least a first layer 101 and a third layer 103 formed via a first process; and
at least a second layer 102, between the first and third layers, formed via a second
process different to the first process;
wherein the first process is a sol-gel process.
[0011] Without limiting the scope of the claims, an advantage of certain examples of the
present disclosure may be to provide a multilayer thin-film composite structure for
providing a barrier coating and encapsulation of an object such as, not least for
example: an organic light emitting diode (OLED), photovoltaic (PV) cell, packaging
(such as food packaging), a membrane or filter (such as a water treatment filter membrane).
Examples may also be to provide a barrier coating for a flexible surface such as a:
flexible substrate, laminate film, sheet or roll. Examples may also be used for encapsulating
objects/articles that require a high degree of protection against contamination or
for hygiene purposes, such as, not least for examples in the food industry or medical
industry.
[0012] An advantage of certain examples of the present disclosure is that the first layer
formed via the sol-gel process provides a hydrophilic primer layer for a subsequently
deposited layer (which is formed by a process other than the sol-gel process). Such
a hydrophilic primer layer aids the binding/attachment of the subsequently deposited
layer, thereby enhancing the robustness of the subsequent layer. Moreover, the first
layer provides a planarised/smooth surface onto which the subsequent layer may be
deposited. Such a planarising/smoothing layer reduces surface roughness of the underlying
surface by encapsulating surface defects so as to provide a smooth planarised surface
better suited for forming a subsequent layer which enhances the robustness of the
subsequent layer.
[0013] The subsequent (second) layer, formed via a non-sol-gel process, may be selected
so as to provide a barrier layer which increases a permeate path length of the overall
multilayer barrier coating. The barrier material and deposition process may be selected
so as to provide a barrier against gas permeation, e.g. oxygen and water vapour. The
third layer, which is formed via the sol-gel process, may provide both mechanical
protection to the underlying second layer as well as may prevent leaching of the underlying
second layer so as to provide a protective top coating, thereby providing a more robust
second layer.
[0014] Advantageously, the interleaving of a non-sol-gel based layer between two sol-gel
based layers provides a more robust non-sol-gel based layer which is better able to
withstand repeated flexing. Moreover, each of the sol-gel layers themselves acts to
increase a permeate path length of the overall multilayer barrier coating. Thus certain
examples provide an improved barrier coating with enhanced barrier/penetration/permeation
properties and resilience to flexing.
[0015] An example of an apparatus configured to provide a multilayer barrier coating for
a surface will now be described with reference to the Figures. Similar reference numerals
are used in the Figures to designate similar features. For clarity, all reference
numerals are not necessarily displayed in all figures.
[0016] Figure 1 schematically illustrates an apparatus 100 according to an example of the
present disclosure. The apparatus 100 comprises a stack of at least a first layer
101, a second layer 102 and a third layer 103. The first and third layers are formed
via a sol-gel process, whereas the second layer is formed via a process different
from the sol-gel process.
[0017] The first layer 101 is formed of a material which is deposited via a sol-gel process.
The first layer may be provided on a surface (not shown in figure 1) of a substrate
thereby acting as a primer layer which may provide both a smooth and a hydrophilic
primer layer to the subsequently deposited second layer. The second layer is formed
of a material which is deposited via a process different from that of the sol-gel
process. The second layer may comprise a conformal coating which may be provided,
for example, via Atomic Layer Deposition (ALD) or could alternatively be provided
by other coating techniques such as Chemical Vapour Deposition (CVD). The second layer
may provide a thin film barrier against permeation of, for example, oxygen, water
vapour as well as other permeates and contaminants. The third layer 103 is formed
of a material which is deposited via a sol-gel process. The third layer may provide
both mechanical protection to the underlying second layer as well may prevent leaching
of the second layer thereby forming a protective top coating. Each of the sol-gel
layers also acts to increase a permeate path length of the overall multilayer barrier
coating and enables barrier performance of the multilayer coating to be maintained
even if a defect occurs in the second barrier layer. In certain examples, each layer
formed via the sol-gel process may have a thickness of: 10nm-5µm, or preferably 100nm-1000nm,
or yet further preferably 300nm-900nm and yet further preferably 600nm-650nm. The
apparatus may comprise a plurality of stacked layers alternatively formed of a sol-gel
derived material and a material derived/deposited via a process different from that
of the sol-gel process. Such "non-sol-gel layers" may have a thickness of: 1nm-100nm,
preferably 5nm-20nm, yet further preferably 10nm-15nm.
[0018] Figure 2 shows an example of a further apparatus 200 comprising a multilayer barrier
covering a substrate 201. The multilayer barrier comprises the basic unit structure
100 as per figure 1 (namely the three stacked layers 101, 102 and 103 disposed on
top of one another, wherein the two sol-gel derived layers 101 and 103 are interposed/interleaved
by a non-sol-gel derived layer 102) and additionally comprises a fourth layer 204
and a fifth layer 205. The fourth layer 204 is formed via a process other than a sol-gel
process whereas the fifth layer 205 is formed via a sol-gel process. For example,
the fourth layer 204 may be formed via the same process as used for the second layer
102. The multilayer barrier coating may be provided to a substrate 201 so as to provide
a multilayer barrier coating to a surface 201' of the substrate 201.
[0019] The first layer 101 is applied to a surface 201' of the substrate 201. The substrate
may be a flexible substrate (such as not least polyethylene naphthalate (PEN), Polyethylene
terephthalate (PET) and polyimide based substrates) and/or a substrate onto which
an object to be encapsulated is fabricated, such an object may comprise organic electronics
such as an OLED or PV. The first layer helps reduce/avoid irregular peaks in the PEN
substrate and provide a smooth primer layer for the subsequent second layer.
[0020] In the apparatus of figure 2, a sequence of layers is provided, that alternate between
a layer formed via a sol-gel process and a layer formed via a different process, such
that, in effect, a layer formed via a different process, such as 102 or 204, is "sandwiched"
between two layers formed via the sol-gel process, e.g. 101 and 103, or 103 and 205.
Advantageously, a lower layer of the 'sandwich' unit structure provides an enhanced
surface onto which the interposed layer formed via a different process is deposited,
whereas the upper layer of the 'sandwich' unit structure provides protection to the
interposed non-sol-gel layer. Moreover, each of the sol-gel layers also improves the
overall impermeation properties of the overall multi-layered barrier structure.
[0021] The third layer, in addition to providing diffusion control/increasing the permeate
path length and providing a protective layer to the underlying second layer, also
provides a planarization/smoothing layer to reduce surface roughness, encapsulating
surface defects thereby providing a planarized surface better suited for forming the
fourth layer on. Also, the third sol-gel layer provides a hydrophilic layer conducive
for forming the fourth layer on.
[0022] Figure 3 shows an alternative structure of a multilayer barrier coating to provide
a coating for a surface 201' of a substrate 201. In the apparatus 300, instead of
providing a stack of alternating layers formed of a sol-gel derived material and a
non-sol-gel derived material, a basic unit structure 100 (comprising the first, second
and third layers 101, 102, 103) is formed and a further basic unit structure 100 is
formed on top of the first basic unit structure 100. It will be appreciated that additional
basic unit structures could also be provided.
[0023] In particular, in the apparatus 300 of figure 3, a first basic unit structure 100
is provided on the substrate 201 by forming first, second and third layers 101, 102,
103 as per the example of figure 1. Furthermore an additional fourth layer 304, formed
via a sol-gel process, is provided on top of the third layer 103, which itself has
been formed via a sol-gel process. Once the fourth layer has been formed, a fifth
layer 305 is provided via a process other than that of the sol-gel process. Finally,
a top coating sixth layer 306 is provided which is formed via a sol-gel process. The
fourth fifth and six layers define a further unit structure 100.
[0024] Advantageously, the multilayer basic unit structure of first to third layers 101-103
is reproducible on itself such that one can stack/repeat such a unit structure on
top of one another. This can enable an easy and cost effective multilayer barrier
to be fabricated with enhanced permeability/impenetrability properties or even having
particular desired permeability/impenetrability properties by repeating the formation/application
of the three layers.
[0025] It will be appreciated that for each of the apparatus 200 and the apparatus 300,
yet further additional layers may be provided. For example yet further layers formed
via a sol-gel process and via a non-sol-gel process. Since each sol-gel layer and
each non sol-gel layer increases permeate path length of the multilayer structure,
the addition of yet further sol-gel and non-sol-gel layers provides yet further diffusion
control and yet further increase the permeate path length of the overall multilayer
structure. Accordingly, additional sol-gel layers and additional non sol-gel layers
may be provided so as to provide a requisite degree of diffusion control/permeate
path lengths.
[0026] It is envisaged that examples of the present disclosure may enable the provision
of low cost encapsulation especially when the multilayer structure is produced via
a roll to roll process wherein additional layers of the multilayer structure can be
stacked on top of one another by repeating the roll to roll process, or incorporating
additional deposition steps in one continuous roll to roll process.
[0027] Figure 4 schematically shows a yet further example of an apparatus 400 in which an
object 401, such as a substrate, electronics or organic electronics, packaging, filter...
etc. may be at least partially encapsulated by a multilayer barrier coating 402. The
multilayer barrier coating 402 comprises alternating layers of sol-gel derived material
and non-sol-gel derived material. The at least partial encapsulation may comprise
encapsulating at least part or substantially all of one or more sides of the object.
Figures 2 and 3 show only a single side of the substrate 201 being encapsulated. However,
it is to be appreciated that one or more additional sides may be encapsulated by the
multilayer barrier. Indeed the substrate may be totally encapsulated such that it
is completely coated on all sides in the multilayer barrier.
[0028] The object to be encapsulated and the multilayer barrier coating itself may be flexible
as indicated by the arrow in figure 4.
[0029] The object to be encapsulated may comprise an organic electronic circuit or device
such as an organic light emitting diode. The object to be encapsulated may further
or alternatively comprise a transistor-based circuit or a transistor array such as
a metal-oxide transistor array. Furthermore, the apparatus may be included in a device
such as an electronic device or a handheld supportable electronic device such that
one or more components of the device or the entire device itself might be encapsulated
by the multilayer barrier coating.
[0030] It is to be appreciated that Figure 4 is merely a schematic diagram and is not to
scale. Indeed, certain examples of the multilayer barrier coating would have an overall
thickness of the order of µm whereas the object to be encapsulated may have dimensions
(such as length and width) of the order of mm, cm or meters).
[0031] In certain examples, the apparatus may be embodied in a hand held portable electronic
device, such as, mobile telephone, tablet, wearable computing device, a mobile terminal
portable digital assistant (PDA), a pager, a mobile computer, a desktop computer,
a television, a gaming device, a laptop computer, a camera, a video recorder, GPS
device and in other types of electronic systems, which may readily employ examples
of the present disclosure. Furthermore, devices may readily employ examples of the
present disclosure regardless of their intent to provide mobility. Such electronic
devices may additionally provide one or more audio/text/video communication functions
(e.g. tele-communication, video-communication, and/or text transmission (Short Message
Service (SMS)/ Multimedia Message Service (MMS)/emailing functions), interactive/non-interactive
viewing functions (e.g. web-browsing, navigation, TV/program viewing functions), music
recording/playing functions (e.g. Moving Picture Experts Group-1 Audio Layer 3 (MP3)
or other format and/or (frequency modulation/amplitude modulation) radio broadcast
recording/playing), downloading/sending of data functions, image capture function
(e.g. using a (e.g. in-built) digital camera), and gaming functions.
[0032] The apparatus may be provided in a module. As used here 'module' refers to a unit
or apparatus that excludes certain parts/components that would be added by an end
manufacturer or a user. For example, the module may relate to a display module which
is added to an electronic device.
[0033] Figure 5 semantically illustrates a flowchart of a method 500 for fabricating a multilayer
barrier coating for a surface. In block 501, a first layer is formed on a substrate
wherein the first layer is formed via a sol-gel process. In block 502, a second layer
is formed on the first layer via a different process to that of the sol-gel process,
for example the second layer may be deposited via Atomic Layer Deposition. In block
503, a third layer is formed on top of the second layer via the sol-gel process.
[0034] Optionally, further layers may be applied to the first, second and third layers.
The "A" branch of the method relates to forming a multi-layered structure having alternating
layers of sol-gel derived material and non-sol-gel derived material. In block 504A,
a fourth layer is applied over the third layer via a process other than the sol-gel
process. Such a process may correspond to the same process that is used to form the
second layer in block 502. In block 505A, a fifth layer is applied over the fourth
layer via the sol-gel process. It will be appreciated that further additional layers,
i.e. sixth, seventh and so on, may also be formed.
[0035] The "B" branch of the method 500 relates to forming a multi-layered structure having
a stack/repetition of the basic unit structure of two layers of sol-gel derived material
sandwiching a layer of a non-sol-gel derived material. In block 504B a fourth layer
is applied via the sol-gel process followed by block 505B in which a fifth layer is
applied which is formed via a differing process and in block 506B, a sixth layer is
then provided formed via the sol-gel process. It will be appreciated that further
additional basic unit structures may also be formed.
[0036] The flowchart of Figure 5 represents one possible scenario among others. The order
of the blocks shown is not absolutely required, so in principle, the various blocks
can be performed out of order. Not all the blocks are essential. In certain examples
one or more blocks may be performed in a different order or overlapping in time, in
series or in parallel one or more blocks may be omitted or added or changed in some
combination of ways.
COATING TRIAL MEASUREMENTS
[0037] The following tables provide results from coating trials which have been conducted
by coating a PEN substrate with various differing coatings. Table 1 provides measured
values of water vapour transmission rates (WVTR), whereas table 2 sets out measured
values of oxygen transmission rates (OTR).
[0038] As will be apparent from these tables, coatings of examples of the present disclosure
are highlighted which include the basic unit structure of the sandwiching of "non-sol-gel"
layers between two sol-gel layers (e.g. Sol-Gel/ALD1 /Sol-Gel and Sol-Gel/ALD2/Sol-Gel)
provides improved vapour and oxygen transmission rates.
Table 1:
Water Vapour Transmission Rate
| Coating |
Sample #1 |
Sample #2 |
| (Uncoated PEN) |
1.4 g/m2/day |
1.5 g/m2/day |
| ALD1 |
0.6 g/m2/day |
0.3 g/m2/day |
| ALD2 |
0.1 g/m2/day |
0.1 g/m2/day |
| Sol-Gel/ALD1 |
0.05 g/m2/day |
0.04 g/m2/day |
| Sol-Gel/ALD1/Sol-Gel |
0.03 g/m2/day |
0.03 g/m2/day |
| Sol-Gel/ALD2 |
0.005 g/m2/day |
0.005 g/m2/day |
| Sol-Gel/ALD2/Sol-Gel |
0.003 g/m2/day |
0.001 g/m2/day |
WVTR measurements conducted at 38°C and 95% Relative Humidity
ALD1=Al2O3 ALD 130 cycles
ALD2=Al2O3 ALD 190 cycles
Sol-Gel=Sol-Gel coating composition using TEOS and MEMO precursor (see SOL-GEL PROCESS
below) |
Table 2: Oxygen Transmission Rate
| Coating |
Sample #1 |
Sample #2 |
| (Uncoated PEN) |
1.5 cc/m2/day |
1.4 cc/m2/day |
| ALD1 |
0.05 cc/m2/day |
<0.01 cc/m2/day |
| ALD2 |
<0.01 cc/m2/day |
<0.01 cc/m2/day |
| Sol-Gel/ALD1 |
<0.01 cc/m2/day |
<0.01 cc/m2/day |
| Sol-Gel/ALD1/Sol-Gel |
0.1 cc/m2/day* |
0.1 cc/m2/day* |
| Sol-Gel/ALD2 |
0.1 cc/m2/day |
0.2 cc/m2/day |
| Sol-Gel/ALD2/Sol-Gel |
<0.01 cc/m2/day |
<0.01 cc/m2/day |
OTR measurements conducted at 23°C and 88% Relative Humidity
ALD1=Al2O3 ALD 130 cycles
ALD2=Al2O3 ALD 190 cycles
Sol-Gel=Sol-Gel coating composition using TEOS and MEMO precursor (see SOL-GEL PROCESS
below)
* it is noted that the measured values are near the detection limit of the measurement
device used in the trial, which may cause some uncertainties in the measurements.
Also, these values could be explained by some possible damage to the ALD1 layer during
the Sol-Gel process. The thicker ALD2 layer may be more durable in this regard as
the values for Sol-Gel/ALD2/Sol-Gel were more consistent. In general, the Sol-Gel coating should further enhance
the WVTR and OTR barrier. |
SOL-GEL PROCESS
[0039] The following is a discussion/overview of the sol-gel process.
[0040] The sol-gel process may involve the evolution of inorganic networks in a continuous
liquid phase through the formation of colloidal suspension and following gelation
of the sol. The sol-gel process can be used to manufacture various materials, including
coatings, powders, monoliths, capsules, fibres or aerogels. Advantages of sol-gel
thin films include the homogeneity and purity of the end-products formed at relatively
low temperatures.
[0041] Metal or non-metal alkoxides may be used as monomers in a typical sol-gel synthesis
for coatings. The sol-gel synthesis can be based on controlled hydrolysis and condensation
reactions. Reaction 1 below represents the hydrolysis, where M may be a metal e.g.:
silicon, zirconium or titanium and n is a number, e.g. four. Hydrolysis acts as a
rapid initial reaction of sol-gel processes, where reactive alkoxide groups (-OR,
where R is e.g. CH
3, CH
3CH
2, CH
3(CH
2)
2) react with water molecules to form hydroxyl groups (-OH). After the initiation of
the reaction, the hydrolysed alkoxides may easily react with each other, forming dimers
through the condensation reaction. Water or alcohol may be obtained as a by-product,
depending on the reaction mechanism. The condensation reactions are described with
Reactions 2 and 3.
M(OR)n + H2O -> M(OH)(OR)n-1+ROH (Reaction1)
M(OH)(OR)n-1 + M(OR)n -> (OR)n-1MOM(OR)n-1 + ROH (Reaction 2)
2M(OH)(OR)n-1 -> (OR)n-1MOM(OR)n-1 + H2O (Reaction 3)
[0042] The alkoxide monomers may have a different reactivity, which can be related to the
partial charge of the metal or the non-metal alkoxide. The reactivity of the monomers
in hydrolysis and condensation reactions can be accelerated or hindered by using catalysts
or by increasing or decreasing the reaction temperature.
[0043] The sol-gel hybrid coating composition may typically be formed using components that
are capable of producing cross-linked networks. These compositions include at least
one curable component, i.e. a precursor, preferably selected from UV or thermally
curable components. Particularly, such precursors may be selected from unsaturated
organic compounds, metal alkoxides, metal salts, epoxy monomers and acid monomers,
for example vinyl, acrylates, methacrylates, silanes and silicates, as well as their
derivatives. Most suitably, the precursors may be selected from vinyl, acrylates,
methacrylates and silicates, or their derivatives. Preferred derivatives are alkyl
and alkoxyl derivatives.
[0044] To provide a coating that strongly attaches to a substrate, preferably by covalent
attachment or by strong physical interaction, one can use coating components that
have reactive covalent-bond-forming end-groups (in addition to the cross-linking groups),
such as alkoxide groups, or end-groups that bind to the functional groups of the substrate
surface using hydrogen bonds or van der Waals forces, such as silane end-groups or
double or triple bonds, preferred ones may be silane groups. These may bind particularly
to hydroxyl groups on the substrate surface.
[0046] The sol-gel coating composition may be applied onto a substrate's surface in the
form of a sol-gel, which may be formed, for example, by dispersing the precursors
of the coating composition in any common solvent, such as water or an organic solvent,
preferably water or an alcohol or a mixture thereof, most suitably a mixture of water
and an alcohol. Such a mixture (sol-gel liquid) is typically prepared by mixing the
solvents into a water content of ≤50 vol%. The optional alcohol is particularly selected
from lower alcohols, including methanol, ethanol, n-propanol and isopropanol.
[0047] When using a solvent in forming the sol-gel, the obtained sol-gel can have any solids
content between 5-95 percent by weight w-%, preferably between 20-50 w-%. However,
it is possible to use also particularly high solids contents, such as contents of
50-95 w-%, or even 75-95 w-%, since the curing step or the optional separate drying
step(s) will cause evaporation of any excess solvent.
[0048] The application of the coating composition on the substrate may be carried out using
any appropriate technique, for example using spray or spin coating, more preferably
with the coating composition in a sol-gel form. The sol-gel may be formed, for example,
as described above.
[0049] The curing may be, in turn, carried out using thermal or UV curing. Further, it can
be operated at atmospheric temperature and pressure. The curing causes the precursor
component(s) of the coating composition to react and solidify, but causes also drying
of the coating composition.
[0050] However, it is preferred to carry out at least one drying step, particularly two
or more drying steps, prior to the curing. Suitable alternatives for the drying step
are any drying procedures based on evaporation, such as air drying and drying by IR
or UV radiation. Most suitably, at least two separate drying steps (in addition to
the curing step) are carried out, which generally utilize two or more different techniques,
such as air drying and IR drying. The drying temperature depends on the applied technique.
Preferably, a low temperature (i.e. close to room temperature) is selected, such as
a temperature within the range of 25-100 °C.
[0051] The thickness of the thus obtained final cured coating derived via the sol-gel process
is adjustable, but is preferably within the range of 100 nm to 5 µm. The previously
described advantages of a sol-gel derived layer can be obtained even with thin coatings,
the thicknesses are particularly adjusted to be within the range of 100 to 1000 nm,
most suitably 300 to 900 nm.
[0052] The examples of the present disclosure and the accompanying claims may be suitably
combined in any manner apparent to one of ordinary skill in the art.
[0053] Features described in the preceding description may be used in combinations other
than the combinations explicitly described.
[0054] Although functions have been described with reference to certain features, those
functions may be performable by other features whether described or not.
[0055] Although features have been described with reference to certain examples, those features
may also be present in other examples whether described or not.
[0056] Although various examples of the present disclosure have been described in the preceding
paragraphs with reference to various examples, it should be appreciated that modifications
to the examples given can be made without departing from the scope of the invention
as set out in the claims.
[0057] The term 'comprise' is used in this document with an inclusive not an exclusive meaning.
That is any reference to X comprising Y indicates that X may comprise only one Y or
may comprise more than one Y. If it is intended to use 'comprise' with an exclusive
meaning then it will be made clear in the context by referring to "comprising only
one ..." or by using "consisting".
[0058] In this description, reference has been made to forming first, second, third layers
and so on. It should be appreciated that each consecutive layer may be directly applied
to the previous layer. However in certain examples it should also be appreciated that
any number or combination of intervening layers could be provided and may exist between
the first, and second layer or the second and third layer and so on (including no
intervening layers).
[0059] In this description, reference has been made to various examples. The description
of features or functions in relation to an example indicates that those features or
functions are present in that example. The use of the term 'example' or 'for example'
or 'may' in the text denotes, whether explicitly stated or not, that such features
or functions are present in at least the described example, whether described as an
example or not, and that they can be, but are not necessarily, present in some or
all other examples. Thus 'example', 'for example' or 'may' refers to a particular
instance in a class of examples. A property of the instance can be a property of only
that instance or a property of the class or a property of a sub-class of the class
that includes some but not all of the instances in the class.
[0060] Whilst endeavouring in the foregoing specification to draw attention to those features
of examples of the present disclosure believed to be of particular importance it should
be understood that the applicant claims protection in respect of any patentable feature
or combination of features hereinbefore referred to and/or shown in the drawings whether
or not particular emphasis has been placed thereon.
1. An apparatus configured to provide a multilayer barrier coating for a surface, the
apparatus comprising:
at least a first layer and a third layer formed via a first process; and
at least a second layer, between the first and third layers, formed via a second process
different to the first process;
wherein the first process is a Sol-Gel process.
2. The apparatus of claim 1, further comprising:
at least a fifth layer formed via the first process; and
at least a fourth layer, between the third and fifth layers, formed via a process
different to the first process.
3. The apparatus of claim 1, further comprising:
at least a fourth and sixth layer formed via the first process; and
at least a fifth layer, between the fourth and sixth layers, formed via a process
different to the first process.
5. The apparatus of any one or more of the previous claims, wherein each of the layers
formed via the Sol-Gel process has a thickness of: 100nm - 5µm, preferably 100nm -
1,000nm, yet further preferably 300nm - 900nm, and yet further preferably 600nm -
650nm.
6. The apparatus of any one or more of the previous claims, wherein the apparatus comprises
a plurality of stacked layers alternatively formed of:
a material derived by the Sol-Gel process, and
a material not derived by the Sol-Gel process.
7. The apparatus of any one or more of the previous claims, wherein each of the layers
formed via the process different to the Sol-Gel process has a thickness of: 1 nm -
100 nm, preferably 5 nm -20 nm, yet further preferably 10 nm - 15 nm.
8. The apparatus of any one or more of the previous claims, wherein the process different
to the Sol-Gel process is an Atomic Layer Deposition process.
9. The apparatus of any one or more of the previous claims, further comprising a substrate
and preferably wherein the substrate is flexible.
10. The apparatus of claim 9, wherein the apparatus at least partially encapsulates at
least one side of the substrate.
11. An object at least partially protected or encapsulated by the apparatus of any one
or more of the previous claims.
12. An Organic Light Emitting Diode, a Photovoltaic cell, a transistor-based circuit or
a transistor array at least partially encapsulated by the apparatus as claimed in
any one or more of the previous claims.
13. A hand held electronic device comprising the apparatus as claimed in any one or more
of the previous claims.
14. A method comprising causing, at least in part, actions that result in:
forming a first layer of a multilayer barrier coating on a substrate via a first process;
forming a second layer of the multilayer barrier coating via a second process different
to the first process;
forming a third layer of the multilayer barrier coating via the first process, such
that the second layer interposes the first and third layers; and
wherein the first process is a Sol-Gel process.
15. A multilayer barrier coating fabricated by the method of claim 14.