(19)
(11) EP 3 031 080 A2

(12)

(88) Date of publication A3:
09.04.2015

(43) Date of publication:
15.06.2016 Bulletin 2016/24

(21) Application number: 14755269.9

(22) Date of filing: 07.08.2014
(51) International Patent Classification (IPC): 
H01L 23/538(2006.01)
H01L 25/10(2006.01)
H05K 1/18(2006.01)
H01L 21/56(2006.01)
(86) International application number:
PCT/US2014/050125
(87) International publication number:
WO 2015/021265 (12.02.2015 Gazette 2015/06)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 07.08.2013 US 201313961344

(71) Applicant: Invensas Corporation
San Jose, CA 95134 (US)

(72) Inventors:
  • MOHAMMED, Ilyas
    Santa Clara, CA 95050 (US)
  • HABA, Belgacem
    Saratoga, CA 95070 (US)

(74) Representative: Boyce, Conor et al
Hanna Moore + Curley Garryard House 25/26 Earlsfort Terrace
Dublin 2, D02 PX51
Dublin 2, D02 PX51 (IE)

   


(54) EMBEDDED PACKAGING WITH PREFORMED VIAS