(19)
(11) EP 3 037 211 A1

(12) EUROPEAN PATENT APPLICATION

(43) Date of publication:
29.06.2016 Bulletin 2016/26

(21) Application number: 15202351.1

(22) Date of filing: 23.12.2015
(51) International Patent Classification (IPC): 
B25B 11/00(2006.01)
B29C 65/48(2006.01)
F16B 11/00(2006.01)
B29C 65/78(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 26.12.2014 CN 201410832172

(71) Applicant: Xiaomi Inc.
Beijing 100085 (CN)

(72) Inventors:
  • HAN, Gaocai
    100085 BEIJING (CN)
  • GAO, Yuan
    100085 BEIJING (CN)
  • XU, Duo
    100085 BEIJING (CN)
  • SUN, Xinhua
    100085 BEIJING (CN)

(74) Representative: Underwood, Nicolas Patrick et al
Cabinet Beau de Loménie 158, rue de l'Université
75340 Paris Cedex 07
75340 Paris Cedex 07 (FR)

   


(54) BONDING JIG


(57) Bonding jig including a jig body (1) defining a positioning chamber which has an opening and is configured to position a first adhesive surface (20) of a first object (2), the first adhesive surface being a surface of the first object to be adhered to a second adhesive surface (40) of a second object (4). An anti-sticking layer (5) is provided on each of an upper surface (32) of a periphery of the opening facing the second adhesive surface and an inner circumferential wall (31) surface of the opening.




Description

FIELD



[0001] The present invention relates to a technical field of jigs, and more particularly, to a bonding jig.

BACKGROUND



[0002] Currently, in order to bond two objects, a bonding jig is usually used to position an object thereof, to facilitate the bonding of the object with another object. The ideal effect of bonding is neat and beautiful, but in the bonding process using conventional bonding jigs, the adhesive might spill, which can be hardly controlled. Also, the spilled adhesive may stick on the bonding jig and be bonded therewith, and it is difficult to separate them.

SUMMARY



[0003] In order to solve the problems existing in the related art, the embodiments of the present invention provide a bonding jig to prevent the adhesive from spilling.

[0004] According to a first aspect of embodiments of the present invention, there is provided a bonding jig. The bonding jig includes a jig body defining a positioning chamber which has an opening and is configured to position a first adhesive surface of a first object, the first adhesive surface being a surface of the first object to be adhered to a second adhesive surface of a second object. An anti-sticking layer is provided on each of an upper surface of a periphery of the opening, the upper surface facing the second adhesive surface, and an inner circumferential wall surface of the opening.

[0005] In an embodiment, a plane in which the opening is located is parallel to the first and second adhesive surfaces.

[0006] In an embodiment, a first distance from the plane in which the opening is located to the second adhesive surface is equal to or smaller than a predetermined value, and an adhesive between the first adhesive surface and the second adhesive surface has a predetermined thickness.

[0007] In an embodiment, the plane in which the opening is located is higher than the first adhesive surface by a second distance; the second distance is equal to a difference value between the predetermined thickness and the first distance.

[0008] In an embodiment, the predetermined value is equal to or smaller than 0.5mm.

[0009] In an embodiment, the predetermined value is equal to 0.2mm, 0.15mm or 0.1mm.

[0010] In an embodiment, the anti-sticking layer comprises an anti-sticking coating layer or an anti-sticking plating layer.

[0011] The present invention also provides an assembly comprising the bonding jig as defined above, a first object, and a second object,

[0012] the first adhesive surface being a surface of the first object to be adhered to a second adhesive surface of the second object.

[0013] The present invention also provides a method comprising using the bonding jig as defined above to bond a first object to a second object.

[0014] This method can use all the embodiments of the dispensing jig as defined above.

[0015] According to embodiments of the present invention, the technical solution has the following effects.

[0016] The bonding jig according to the embodiments of the present invention is provided with the anti-sticking layer at a position where the spilled adhesive is in contact with the bonding jig, to avoid the bonding between the spilled adhesive and the bonding jig, such that it is easy to separate the spilled adhesive from the bonding jig, and more convenient for the users.

[0017] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS



[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

Fig. 1 is a schematic view of a bonding jig according to an exemplary embodiment.

Fig. 2 is a schematic view of a bonding jig according to an exemplary embodiment.

Fig. 3 is a schematic view of another bonding jig according to an exemplary embodiment.


DETAILED DESCRIPTION



[0019] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise represented. The implementations set forth in the following description of exemplary embodiments do not represent all implementations consistent with the invention. Instead, they are merely examples of apparatuses and methods consistent with aspects related to the invention as recited in the appended claims.

[0020] The embodiments of the present invention provide a bonding jig. As shown in Fig. 1, the bonding jig includes a jig body 1 defining a positioning chamber 3 which has an opening and is configured to position a first adhesive surface 20 of a first object 2, the first adhesive surface 20 being a surface of the first object 2 to be adhered to a second adhesive surface 40 of a second object 4, in which an anti-sticking layer 5 is provided on each of an upper surface 32 of a periphery of the opening, the upper surface facing the second adhesive surface 40, and an inner circumferential wall surface 31 of the opening.

[0021] In an embodiment, the anti-sticking layer can be embodied as an anti-sticking coating layer or an anti-sticking plating layer, in which a gap of 0.5mm may be reduced to 0.2mm, 0.15mm or 0.1mm. If there is no anti-sticking coating layer, the gap needs to be wide enough to prevent the jig from being bonded with the adhesive; but if the gap is too wide, the adhesive will spill and become irregular. If the jig is provided with the anti-sticking coating layer, the gap may be very small, such that the jig can position and limit the adhesive to make the spilled adhesive well-distributed. If the spilled adhesive needs to surround a bonded object evenly, the jig can be employed in this manner. Referring to Fig. 2, the working principle of the bonding jig is presented as follows.

[0022] The first object 2 is placed in the positioning chamber 3 whose spatial shape corresponds to the one of the first object 2, so as to retain the position of the first object 2 to fix the position of the first adhesive surface 20 of the first object 2.

[0023] An adhesive 6 is applied onto the first adhesive surface 20 of the first object 2.

[0024] The second adhesive surface 40 of the second object 4 is overlaid onto the first adhesive surface 20 coated with the adhesive 6. The first adhesive surface 20 is bonded with the second adhesive surface 40 by proper pressing, and meanwhile, part of the adhesive will spill onto the upper surface 32 and the inner circumferential wall surface 31. Since the upper surface 32 and the inner circumferential wall surface 31 are provided with the anti-sticking layers, the spilled adhesive will not be bonded with the bonding jig, and it is easy to separate the adhesive from the bonding jig. Consequently, as for the bonding jig according to the embodiments of the present invention, the anti-sticking layers are arranged at the position where the spilled adhesive is in contact with the bonding jig, to avoid the bonding between the spilled adhesive and the bonding jig, and to facilitate separation of the spilled adhesive from the bonding jig for the users' convenience.

[0025] In an embodiment, as shown in Fig. 2, the plane 33 in which the opening of the positioning chamber 3 is located is parallel to the first adhesive surface 20 and the second adhesive surface 40, such that the spilled adhesives on both sides are equivalent, and the anti-sticking layers can still avoid the bonding between the spilled adhesive and the bonding jig. Moreover, for some applications, if the first adhesive surface 20 needs to be bonded with the second adhesive surface 40 in a nonparallel manner, i.e. the plane 33 in which the opening of the positioning chamber 3 is located in parallel to the first adhesive surface 20 and nonparallel to the second adhesive surface 40, as shown in Fig. 3, the bonding jig can still prevent the spilled adhesive at both sides from bonding with the bonding jig.

[0026] In an embodiment, a first distance D1 from the plane 33 in which the opening of the positioning chamber 3 is located to the second adhesive surface 40 is equal to or smaller than a predetermined value, and an adhesive 6 between the first adhesive surface 20 and the second adhesive surface 40 has a predetermined thickness H. The first distance D1 actually refers to the thickness of the spilled adhesive, i.e. controlling the thickness of the spilled adhesive within the predetermined value, and the predetermined value can be set according to the practical requirements. In practice, the height of the positioning chamber in the bonding jig can be designed based on the predetermined thickness and the height of the first object, such that the thickness of the spilled adhesive is equal to or smaller than the predetermined value to avoid overspill of the adhesive, which may degrade the esthetic effect.

[0027] In an embodiment, as shown in Fig. 2, the plane 33 in which the opening of the positioning chamber 3 is located is higher than the first adhesive surface 20 by a second distance D2; the second distance D2 is equal to a difference value between the predetermined thickness H and the first distance D1, such that part of the adhesive is contained within the positioning chamber to control the thickness of the spilled adhesive to be equal to or smaller than the predetermined value for the users' convenience.

[0028] In an embodiment, the predetermined value is equal to or smaller than 0.5mm. For example, the predetermined value is equal to 0.2mm, 0.15mm, 0.1mm, or other values within 0.2mm, so as to guarantee the bonding effect and to reduce the spilled adhesive for aesthetic effect.

[0029] Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed here. This application is intended to cover any variations, uses, or adaptations of the invention following the general principles thereof and including such departures from the present invention as come within known or customary practice in the art.


Claims

1. A bonding jig, comprising a jig body (1) defining a positioning chamber (3) which has an opening and is configured to position a first adhesive surface (20) of a first object (2), the first adhesive surface being a surface of the first object to be adhered to a second adhesive surface (40) of a second object (4),
wherein an anti-sticking layer (5) is provided on each of an upper surface (32) of a periphery of the opening, the upper surface facing the second adhesive surface, and an inner circumferential wall (31) surface of the opening.
 
2. The bonding jig according to claim 1, wherein a plane (33) in which the opening is located is parallel to the first and second adhesive surfaces (20, 40).
 
3. The bonding jig according to claim 2, wherein a first distance D1 from the plane (33) in which the opening is located to the second adhesive surface is equal to or smaller than a predetermined value, and an adhesive between the first adhesive surface (20) and the second adhesive surface (40) has a predetermined thickness.
 
4. The bonding jig according to claim 3, wherein the plane (33) in which the opening is located is higher than the first adhesive surface (20) by a second distance; the second distance is equal to a difference value between the predetermined thickness and the first distance.
 
5. The bonding jig according to claim 3 or 4, wherein the predetermined value is equal to or smaller than 0.5mm.
 
6. The bonding jig according to claim 5, wherein the predetermined value is equal to 0.2mm, 0.15mm or 0.1mm.
 
7. The bonding jig according to claim 1, wherein the anti-sticking layer comprises an anti-sticking coating layer or an anti-sticking plating layer.
 
8. Assembly comprising the bonding jig according to any one of claims 1 to 7, a first object, and a second object,
the first adhesive surface being a surface of the first object to be adhered to a second adhesive surface of the second object.
 
9. Method comprising using the bonding jig according to any one of claims 1 to 7 to bond a first object to a second object.
 




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