| (19) |
 |
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(11) |
EP 3 070 185 A8 |
| (12) |
CORRECTED EUROPEAN PATENT APPLICATION |
|
published in accordance with Art. 153(4) EPC |
| (15) |
Correction information: |
|
Corrected version no 1 (W1 A1) |
| (48) |
Corrigendum issued on: |
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30.11.2016 Bulletin 2016/48 |
| (43) |
Date of publication: |
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21.09.2016 Bulletin 2016/38 |
| (22) |
Date of filing: 18.11.2014 |
|
| (51) |
International Patent Classification (IPC):
|
| (86) |
International application number: |
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PCT/JP2014/080527 |
| (87) |
International publication number: |
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WO 2015/111291 (30.07.2015 Gazette 2015/30) |
|
| (84) |
Designated Contracting States: |
|
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL
NO PL PT RO RS SE SI SK SM TR |
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Designated Extension States: |
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BA ME |
| (30) |
Priority: |
27.01.2014 JP 2014012132
|
| (71) |
Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD. |
|
Osaka-shi
Osaka 541-0045 (JP) |
|
| (72) |
Inventors: |
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- TAKEUCHI, Yukiya
Osaka-shi
Osaka 538-0044 (JP)
- YOSHIKAWA, Junji
Osaka-shi
Osaka 538-0044 (JP)
- KITA, Koji
Osaka-shi
Osaka 538-0044 (JP)
|
| (74) |
Representative: Müller-Boré & Partner
Patentanwälte PartG mbB |
|
Friedenheimer Brücke 21
80639 München
80639 München (DE) |
|
| |
|
| (54) |
CONDUCTIVE FILM-FORMING BATH |
(57) An object of the present invention is to provide a novel conductive film-forming
bath comprising an alkaline aqueous solution that can be used to form a film by electroplating
on a non-conductive plastic material, the conductive film-forming bath being capable
of forming a film by electroplating that has an excellent appearance and that does
not suffer from reduced adhesiveness with respect to a non-conductive plastic material.
The present invention relates to a conductive film-forming bath comprising an aqueous
solution containing a copper compound, a complexing agent, an alkali metal hydroxide,
and a water-soluble polymer having a polyoxyalkylene structure.