ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRIS..MTNORSMESM..................JJDIM360 Ver 1.28 (29 Oct 2014) - 1999001/03070185CORRECTED EUROPEAN PATENT APPLICATIONpublished in accordance with Art. 153(4) EPCA8A120161130W171deBibliographieenBibliographyfrBibliographieEP14879928.12014111820160504jaenen201401213220140127JP201611302016482016092120163820161130201648C23C 18/38 20060101AFI20150806BHEP C23C 18/16 20060101ALI20150806BHEP C23C 18/40 20060101ALI20150806BHEP deBAD ZUR BILDUNG EINES LEITFÄHIGEN FILMSenCONDUCTIVE FILM-FORMING BATHfrBAIN FORMANT UN FILM CONDUCTEUROKUNO CHEMICAL INDUSTRIES CO., LTD.101387184O 1604EU - eh7-10, Doshomachi 4 chome Chuo-kuOsaka-shi Osaka 541-0045JPTAKEUCHI, Yukiyac/o General Head Research of OKUNO CHEMICAL INDUSTRIES CO., LTD. 1-10-25 Hanaten-higashi Tsurumi-kuOsaka-shi Osaka 538-0044JPYOSHIKAWA, Junjic/o General Head Research of OKUNO CHEMICAL INDUSTRIES CO., LTD. 1-10-25 Hanaten-higashi Tsurumi-kuOsaka-shi Osaka 538-0044JPKITA, Kojic/o General Head Research of OKUNO CHEMICAL INDUSTRIES CO., LTD. 1-10-25 Hanaten-higashi Tsurumi-kuOsaka-shi Osaka 538-0044JPMüller-Boré & Partner Patentanwälte PartG mbB100060440Friedenheimer Brücke 2180639 MünchenDEALATBEBGCHCYCZDEDKEEESFIFRGBGRHRHUIEISITLILTLULVMCMKMTNLNOPLPTRORSSESISKSMTRBAMEJP201408052720141118jaWO201511129120150730201530

An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.