(19)
(11) EP 3 114 608 A1

(12)

(43) Date of publication:
11.01.2017 Bulletin 2017/02

(21) Application number: 15711007.3

(22) Date of filing: 05.03.2015
(51) International Patent Classification (IPC): 
G06K 9/00(2006.01)
(86) International application number:
PCT/US2015/019069
(87) International publication number:
WO 2015/134816 (11.09.2015 Gazette 2015/36)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 06.03.2014 US 201461948778 P
04.03.2015 US 201514639116

(71) Applicant: Qualcomm Incorporated
San Diego, CA 92121-1714 (US)

(72) Inventors:
  • KITCHENS, Jack Conway
    San Diego, California 92121-1714 (US)
  • SCHNEIDER, John Keith
    San Diego, California 92121-1714 (US)
  • HINGER, Ashish
    San Diego, California 92121-1714 (US)
  • RANGANATHAN, Ranjith
    San Diego, California 92121-1714 (US)
  • KUO, Nai-Kuei
    San Diego, California 92121-1714 (US)
  • DJORDJEV, Kostadin D.
    San Diego, California 92121-1714 (US)
  • GOJEVIC, Stephen M.
    San Diego, California 92121-1714 (US)
  • BURNS, David William
    San Diego, California 92121-1714 (US)
  • CHUEI, Nao Sugawara
    San Diego, California 92121-1714 (US)
  • DU, Eliza Yingzi
    San Diego, California 92121-1714 (US)
  • CHEN, Ming Yu
    San Diego, California 92121-1714 (US)
  • CHAN, Kwokleung
    San Diego, California 92121-1714 (US)
  • GU, Jin
    San Diego, California 92121-1714 (US)
  • VURAL, Esra
    San Diego, California 92121-1714 (US)

(74) Representative: Tomkins & Co 
5 Dartmouth Road
Dublin 6
Dublin 6 (IE)

   


(54) MULTI-SPECTRAL ULTRASONIC IMAGING