ISOSTATIC PRESS CAPABLE OF PERFORMING HEATING AND COOLING AND METHOD FOR MANUFACTURING CHIP COMPONENT USING SAME

Abstract

 Disclosed is an isostatic press capable of carrying out compression molding using a fluid or a gas filled in a pressure vessel. The isostatic press having the pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, includes a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber. Accordingly, the isostatic press can heat or cool the workpiece in a short time, thereby obtaining the workpiece having a dense structure and minimizing a fraction defective of the workpiece.

Description

[Technical Field]

[0001] The present invention relates to an isostatic press which carries out isostatic pressing by means of a pressure medium which is filled in a pressure vessel, and a method of fabricating a chip component using the same.

[Background Art]

[0002] In general, an isostatic press is a device which introduces gas or fluid into a pressure vessel in a state in which a workpiece is accommodated in the pressure vessel, in order to carry out compression molding using gas pressure or fluid pressure. Recently, such an isostatic press is widely used for the purpose of fabricating a chip component.

[0003] An isostatic press of the related art is disclosed in Korean Patent Laid-Open No. 10-2007-0112718, entitled "Isostatic Press".

[0004] As illustrated in Fig. 1, the isostatic press of the related art includes a heat insulator 3 that forms a treatment chamber R which contains a workpiece W, a pressure vessel 2 that covers the heat insulator 3, a heating unit 25 that heats the pressure vessel 2, and a pressure medium supplying device 5 that can supply a pressure medium into the pressure vessel 2. A pressure medium introducing space S for introducing the pressure medium into the pressure vessel 2 is provided between the heat insulator 3 and the pressure vessel 2, and the pressure medium introducing space S is connected to the treatment chamber R through a communication hole formed in an upper portion of the heat insulator 3. The pressure medium supplying device 5 is connected to the pressure medium introducing space S through a pressure medium inlet port 18 formed on a lower portion of the pressure vessel.

[0005] Since the heating unit 25 heats the pressure vessel 2 to heat the pressure medium, the isostatic press configured as described above can carry out the compression molding in the state in which the workpiece W is heated.

[0006] However, the isostatic press of the related art has some problems in that since the pressure vessel 2 should be heated to heat the workpiece W, it will waste a lot of times to heat the workpiece W, and it is difficult to heat the workpiece at uniform temperature, as well as heat loss.

[0007] Also, there is another problem in that since the pressure vessel 2 is heated, a packing installed to a cover for closing the pressure vessel 2 may be damaged due to the influence of high temperature and pressure.

[0008] In addition, since the isostatic press of the related art is configured only to heat the pressure medium, but cannot cool the pressure medium, it is not possible to process the workpiece W to have a dense structure through sintering and hardening processes.

[Disclosure]

[Technical Problem]

[0009] Accordingly, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an isostatic press that can directly heat or cool a workpiece in a short time through a pressure medium which presses the workpiece, to decrease a time required for compression molding and to heat or cool the workpiece at uniform temperature, as well as lowering heat loss.

[0010] Also, another object of the present invention is to provide an isostatic press that can carry out compression molding on a workpiece through heating and cooling processes, to enable the workpiece to have a dense structure, can minimize a fraction defective of the workpiece, and can prevent a packing from being broken to lower pressure loss and improve air tightness.

[0011] In addition, the other object of the present invention is to provide a method of fabricating a chip component by carrying out compression molding on the chip component in a short time by heating and cooling a pressure medium to make its structure compactly and lower a fraction defective.

[Technical Solution]

[0012] To accomplish the above-mentioned object, according to the first aspect of the present invention, there is provided an isostatic press including a pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, the isostatic press including: a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber.

[0013] The heat exchange member may be heated or cooled by a heat medium supplied to the heat exchange member.

[0014] The heat exchange may include a heating part configured to heat the heat medium and a cooling part configured to cool the heat medium.

[0015] The heat exchanger may include a selective supply unit configured to selectively supply the heat medium which is heated or cooled by the heating part or the cooling part to the heat exchange member.

[0016] The heat exchanger may include a heat medium storing tank configured to store the heat medium.

[0017] The heat exchange member may be provided with an inlet port into which the heat medium cooling or heating the heat exchange member flows, an outlet port away from which the heat medium flowing into the inlet port flows, and a microchannel configured to connect the inlet port and the outlet port so that the heat medium flows in a zigzag pattern in the heat exchange member.

[0018] The heat medium may include water.

[0019] The heat exchange member may include a heater which is heated by electricity.

[0020] The heat exchange member may include a cooling unit which is cooled by a coolant.

[0021] The heat exchange member may be formed in any one of a plate shape, a cylindrical shape and a helical shape.

[0022] The heat exchange member may be provided with a plurality of through-holes penetrating the heat exchange member, or a plurality of protrusions protruding from an outer wall of the heat exchange member, in order to increase a contact area between the pressure medium and the heat exchange member.

[0023] The isostatic press may further include a heat insulator which is provided on an inner surface of the accommodation chamber to prevent the heat of the heat exchange member from transferring to an outside of the accommodation chamber.

[0024] The insulator may include any one of resin or ceramic.

[0025] The pressure vessel may further include an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and a heater may be installed to at least one of the upper cap and the lower cap to heat the pressure medium.

[0026] The pressure vessel may further include an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and a shelf which is connected to any one of the upper cap and the lower cap on which the workpiece is seated.

[0027] According to the second aspect of the present invention, there is provided a method of fabricating a chip component using an isostatic press including a pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, and a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber, the method including: loading the chip component in the accommodation chamber; supplying a pressure medium into the accommodation chamber to carry out isostatic pressing on the chip component; heating the heat exchange member which transfers heat between the pressure medium and the heat exchange member, to heat the chip component in a state in which pressure is maintained by the pressure medium; discharging the pressure medium from the accommodation chamber; and unloading the chip component from the accommodation chamber.

[0028] Before or after the step of heating the heat exchange member which transfers the heat between the pressure medium and the heat exchange member, the method may further include cooling the heat exchange member which transfers heat between the pressure medium and the heat exchange member, to cool the chip component in a state in which the pressure is maintained by the pressure medium.

[Advantageous Effects]

[0029] With the above configuration, the isostatic press capable of heating and cooling the workpiece can directly heat or cool the workpiece in the short time through the pressure medium, to decrease a time required for the compression molding and minimize the heat loss.

[0030] Also, since the sintered workpiece is cured at once in the state in which the pressure is maintained, it is possible to obtain the workpiece having the dense structure, and to minimize a fraction defective.

[0031] Furthermore, since the heat insulator is installed to the inside of the pressure vessel, it is possible to prevent the heat from transferring from the inside to the pressure vessel 110, thereby preventing the packing from being broken to decrease the pressure loss and improve the air tightness.

[0032] Furthermore, since the workpiece is directly heated or cooled by the pressure medium, it is possible to heat or cool the workpiece at the uniform temperature.

[0033] According to the method of fabricating the chip component using the isostatic press according to the present invention, since the chip component is directly heated and cooled by the pressure medium, it is possible to fabricate the chip component having the dense structure by heating or cooling the chip component in the short time, thereby minimizing the fraction defective of the chip component.

[0034] Also, since a sintering process or a curing process to fabricate the chip component can be omitted, it is possible to remarkably reduce an equipment cost and a fabrication time.

[Description of Drawings]

[0035] 

Fig. 1 is a cross-sectional view illustrating an isostatic press of the related art.

Fig. 2 is a view schematically illustrating configuration of an isostatic press according an embodiment of the present invention.

Fig. 3 is a view schematically illustrating the isostatic press according the embodiment of the present invention, in which an accommodation chamber is opened.

Fig. 4 is a view schematically illustrating a heat exchanger of the isostatic press according the embodiment of the present invention.

Fig. 5 is a perspective view illustrating a heat exchange member of the heat exchanger in the isostatic press according the embodiment of the present invention.

Fig. 6 is a cross-sectional view of Fig. 5.

Fig. 7 is a view schematically illustrating a heat exchanger of an isostatic press according a modified embodiment of the present invention, in which a heat exchange member is formed in a cylindrical shape.

Fig. 8 is a view schematically illustrating a heat exchanger of an isostatic press according another modified embodiment of the present invention, in which a heat exchange member is formed in a helical shape.

Fig. 9 is a flow chart schematically illustrating a method of fabricating a chip component using the isostatic press according to the embodiment of the present invention.

Brief Description of Reference Numerals

[0036] 

100:

Isostatic Press

110:

Pressure Vessel

111:

Accommodation Chamber

113:

Upper Cap

114:

Shelve

115:

Lower Cap

130:

Pressure Medium Supply Unit

131:

Pressure Medium Storage Unit

133:

Booster Pump

200:

Heat Exchanger

210:

Heat Exchange member

211:

Inlet Port

212:

Outlet Port

213:

Microchannel

214:

Through-hole

215:

Temperature Sensor

220:

Heating Part

221:

Heater

230:

Cooling part

231:

Cooling Unit

240:

Selective Supply Unit

250:

Supply Pump

260:

Heat Medium Supply Pipe

270:

Heat Medium Discharge Pipe

280:

Heat Medium Storing tank

300:

Heat Insulator

[Mode for Invention]

[0037] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0038] First, an isostatic press 100 of the present invention can be used when a workpiece, for example, a chip component made of ceramic, including a chip capacitor, a chip varistor, a resistor, a chip inductor, a chip antenna, a chip EMI filter, or the like, and a substrate, for example, an FPCB or a PCB, is fabricated, or when a powder material is compression-molded.

[0039] As illustrated in Figs. 2 and 3, the isostatic press 100 of the present invention may include a pressure vessel 110. The pressure vessel 110 has a cylindrical hollow body to accommodate a workpiece which is molded by isostatic pressing.

[0040] An accommodation chamber 111 of the pressure vessel 110 can be filled with a pressure medium to apply isostatic pressure to the workpiece. Opened upper and lower portions of the pressure vessel 110 are equipped with an upper cap 113 and a lower cap 115 to close the pressure vessel 110.

[0041] Pressure of the pressure medium filled in the accommodation chamber 111 is in the range of about tens to thousands bars, and the isostatic pressing is carried out by the pressure of the pressure medium.

[0042] A structure of engaging the upper cap 113 and the lower cap 115 with the pressure vessel 110 includes a threadedly engaging structure of which the upper cap 113 for closing the upper portion of the pressure vessel 110 and the lower cap 115 for closing the lower portion of the pressure vessel 110 are provided with threaded portions so that the caps are threadedly engaged to the pressure vessel 110, a joint structure using bolts, a structure with pins penetrating through the caps and the pressure vessel, a joint structure using jigs, and a frame structure of which the upper cap 113 and the lower cap 115 are fixed by a frame so as not to be released from the pressure vessel 110, for example.

[0043] The structure of engaging the upper cap 113 and the lower cap 115 with the pressure vessel 110 may employ one of various methods widely known in the art, and the present invention is not limited thereto.

[0044] Any one of the upper cap 113 and the lower cap 115 may be provided with a pressure inlet port through which the pressure medium is fed into the accommodation chamber 111, and the other may be provided with a medium outlet port through which the fed pressure medium is discharged outwardly from the accommodation chamber. Both the medium inlet port and the medium outlet port may be formed on any one of the upper cap 113 and the lower cap 115.

[0045] Also, any one of the upper cap 113 and the lower cap 115 may be provided with a shelf 114 on which an object to be accommodated is seated. The shelf 114 can be connected to the upper cap 113 or the lower cap 115 which opens the pressure vessel, so that when the upper cap 113 or the lower cap 115 opens, the shelf can be exposed outwardly from the pressure vessel 110.

[0046] The isostatic press according to the embodiment of the present invention may include a pressure medium supply unit 130.

[0047] The pressure medium supply unit 130 can supply the pressure medium which applies pressure to the workpiece to the accommodation chamber 111 of the pressure vessel 110.

[0048] The pressure medium supply unit 130 can supply the pressure medium stored in a pressure medium storing tank 131 into the accommodation chamber 111 through the medium inlet port formed on the upper cap 113 or the lower cap 115. The pressure medium supply unit 130 may have a booster pump 133.

[0049] The booster pump 133 can apply high pressure to the pressure medium to feed the pressure medium into the accommodation chamber 111.

[0050] In this embodiment, the pressure medium may be a fluid, such as water or oil, or a gas, and the water which is the most common is preferable. However, the water may contain some additives so as to quickly heat or cool the water or increase the pressure.

[0051] The pressure medium supply unit 130 may have a medium feed line 135, as well as the booster pump 133.

[0052] The booster pump 133 can raise the pressure of the pressure medium to supply it, and the pressure medium pressurized by the booster pump 133 can be fed to the accommodation chamber 111 through the medium feed line 135.

[0053] In this embodiment, the medium feed line 135 is installed to the lower cap 115 to feed the pressure medium into the accommodation chamber 111 in the state in which the lower cap 115 closes the accommodation chamber 111. Alternatively, the medium feed line 135 may be connected to the pressure vessel 110 or the upper cap 113 to feed the pressure medium into the accommodation chamber 111.

[0054] The medium feed line 135 may be equipped with a check valve, and the check valve can supply the pressure medium into the accommodation chamber 111 or interrupt the supply of the pressure medium.

[0055] The isostatic press 100 according to the embodiment of the present invention may include a driving unit (not illustrated).

[0056] The driving unit can move the upper cap 113 or the lower cap 115 to the upper portion or the lower portion of the pressure vessel 110 to open or close the pressure vessel 110, thereby introducing the workpiece into the pressure vessel 110 or carrying out the molded workpiece.

[0057] The driving unit may be configured to move the pressure vessel 110 in left and right directions or upward and downward directions in the state in which the upper cap 113 and the lower cap 115 open the accommodation chamber 111, in order to easily load or unload the workpiece.

[0058] The driving unit may be realized by a hydraulic cylinder or a pneumatic cylinder.

[0059] As illustrated in Figs. 5 and 6, the isostatic press according to the embodiment of the present invention may include a heat exchanger 200.

[0060] The heat exchanger 200 can heat or cool the pressure medium to be filled in the accommodation chamber 111, and may have a heat exchange member 210.

[0061] The heat exchange member 210 is positioned in the accommodation chamber 111 to directly heat or cool the pressure medium filled in the accommodation chamber 111, and a plurality of heat exchange members 210 may be installed in the accommodation chamber 111.

[0062] The heat exchange member 210 may have a cooling member and a heating member.

[0063] In other words, the heat exchange member 210 is divided into the cooling member and the heating member. The cooling member is configured to cool the pressure medium filled in the accommodation chamber 111, while the heating member is configured to heat the pressure medium filled in the accommodation chamber 111.

[0064] A heater which is heated by electricity may be used as the heating member, and a cooling sink or an evaporator which absorbs heat may be used as the cooling member.

[0065] Also, the heat exchange member 210 may include a Peltier element of which one side gets cooler while the other gets hotter when electricity flows through the element.

[0066] As described in this embodiment, the heat exchange member 210 may be configured to cool or heat the pressure medium by means of a heat medium, like a fluid or a gas, which circulates the heat exchange member 210.

[0067] The heat exchange member 210 is provided with an inlet port 211 into which the heat medium flows, and an outlet port away from which the heat medium flows. The inlet port 211 and the outlet port 212 communicate with each other via a microchannel 213 which is formed in a zigzag pattern in the heat exchange member 210, so that the heat medium fed into the inlet port 211 circulates the entire heat exchange member 210 through the microchannel 213, and then discharges from the outlet port 212.

[0068] The heat exchange member 210 may be configured by adhering two sheets against each other, each having the microchannel 213, the inlet port 211, and the outlet port on one surface thereof. The microchannel 213 may be formed to have various depth and shapes depending upon the thickness of the sheet so that the microchannel is not deformed when the isostatic pressing is performed by the compressed fluid.

[0069] Alternatively, the heat exchange member 210 may be formed in the shape of a plate to minimize a volume occupying the accommodation channel 111, or, as illustrated in Fig. 7, may be formed in the shape of a cylinder. In the case of being formed in the cylindrical shape, the microchannel 213 may be formed in a spiral shape in the heat exchange member.

[0070] Also, as illustrated in Fig. 8, the heat exchange member 210 may be formed in the shape of a spirally wound tube.

[0071] In order to allow the pressure medium stored in the accommodation chamber 111 to freely move through the heat exchange member 210, and to increase a contact area, the heat exchange member 210 may be provided with a plurality of through-holes 214, or, although being not illustrated in the drawings, may be provided with a plurality of protrusions.

[0072] The heat exchange member 210 may be equipped with a temperature sensor 215 to measure temperature of the pressure medium.

[0073] The heat exchange member 210 may be installed to the upper cap 113 and/or the lower cap 115, and the heat exchange member 210 installed to the upper cap 113 or the lower cap 115 is preferably a heater which is heated by electricity.

[0074] The heat exchanger 200 may have a heat medium storing tank 280. The heat medium storing tank 280 can accommodate the pressure medium and the heat transfer medium through the heat exchange member 210.

[0075] The heat exchanger 200 may have a heating part 220 and a cooling part 230. The heating part 220 and the cooling part 230 are supplied by the heat medium stored in the heat medium storing tank 280 to heat or cool the heat medium.

[0076] In other words, the heating part 220 heats the heat medium stored in the heat medium storing tank 280, and the cooling part 230 cools the heat medium stored in the heat medium storing tank 280.

[0077] The heating part 220 may have a heater 221 which is heated by the electricity or a hot medium, and the cooling part 230 may have a cooling unit 231 which is cooled by a coolant. In this instance, the cooling unit 231 includes an evaporator and a cooling sink, and the cooling part 230 includes a chiller which is cooled by circulation of a common coolant.

[0078] In the case where the heat exchange member 210 is divided into two parts, that is, the cooling member and the heating member, the heating part 220 is connected with the heating member, and the cooling part 230 is connected with the cooling member, so that the heat medium cooled by the cooling part 230 cools the pressure medium through the cooling member, while the heat medium heated by the heating part 220 heats the pressure medium through the heating member.

[0079] Also, the heat exchanger 200 may have a selective supply unit 240.

[0080] The selective supply unit 240 is configured to selectively supply the heat medium stored in the heat medium storing tank 280 to the heat exchange member 210 through the cooling part 230 or the heating part 220.

[0081] The selective supply unit 240 includes an electromagnetic valve configured to supply the heat medium from the cooling part 230 or the heating part 220 to the heat exchange member 210 or interrupt the supply.

[0082] The selective supply unit 240 may have a supply pump 250. The supply pump 250 supplies the heat medium stored in the heat medium storing tank 280 to the heat exchange member 210 through the cooling part 230 or the heating part 220, and again circulates the heat medium to store the heat medium supplied to the heat exchange member 210 in the heat medium storing tank 280.

[0083] In this embodiment, the heat medium may be a fluid, such as water or oil, or a gas, and the water is preferable. In the case where the fluid is water, the water may contain some additives so as to perform quick heat transfer.

[0084] With the configuration of the heat exchanger 200, in the case where the heat medium stored in the accommodation chamber 111 is heated, the selective supply unit 240 supplies the heat medium stored in the heat medium storing tank 280 to the heating part 220 to heat the heat medium, and supplies the hot heat medium to the heat exchange member 210. On the other hand, in the case where the heat medium stored in the accommodation chamber 111 is cooled, the selective supply unit 240 supplies the heat medium stored in the heat medium storing tank 280 to the cooling part 230 to cool the heat medium, and supplies the cold heat medium to the heat exchange member 210, thereby cooling or heating the pressure medium in a short time.

[0085] The isostatic press according to the embodiment of the present invention may include a heat insulator 300. The heat insulator 300 is provided on an inner surface of the accommodation chamber 111 to prevent the heat of the heat exchange member 210 from transferring to the pressure vessel 110.

[0086] In other words, the heat exchange member 210 insulates the heat exchange member 210 to transfer only the heat between the heat exchange member 210 and the pressure medium stored in the accommodation chamber 111, thereby minimizing the heat loss from the accommodation chamber 111.

[0087] The heat insulator 300 may be installed to the upper cap 113 and the lower cap 115 which close the accommodation chamber 111, as well as the inside of the pressure vessel 110.

[0088] The heat insulator 300 may be made of a material containing any one of a resin, such as polyimide or Teflon which has high hardness and heat resistance to withstand the high pressure of the pressure medium, and a ceramic, or may be made of only one of the resin and the ceramic.

[0089] The operation and effects of the above-described components will be described.

[0090] With the isostatic press 100 according to the embodiment of the present invention, the heat exchanger member 210 is installed to the accommodation chamber 111 of the pressure vessel 110, and the heat insulator 300 is installed to the inside of the accommodation chamber 111, thereby prevent the heat of the heat exchange member 210 from transferring to the outside of the pressure vessel 110.

[0091] The inlet port 211 of the heat exchange member 210 is connected with the cooling part 230 and the heating part 220 which are positioned at the outside of the pressure vessel 110, through a heat medium supply pipe 260 to heat supply the heat medium heated or cooled by the heating part 220 or the cooling part 230.

[0092] Although the drawings illustrate that the heat exchange member 210 is connected with the cooling part and the heating part via the upper cap 113 to supply the heat medium, the heat exchange medium 210 may be supplied by the heat medium through the lower cap 113 or the side of the pressure vessel 110.

[0093] The outlet port 212 of the heat exchange member 210 is connected with the heat medium storing tank 280 via a heat medium discharge pipe 270 so that the heat medium circulating the microchannel 213 of the heat exchange member 210 is discharged to the heat medium storing tank 280.

[0094] The heating part 220 and the cooling part 230 are equipped with the selective supply unit 240 to selectively supply the heat medium which is heated by the heating part 220 or the heat medium which is cooled by the cooling part 230 to the heat exchange member 210.

[0095] The pressure vessel 110 is inserted and installed into an opening of the frame, and the frame or the pressure vessel 110 is equipped with the driving unit so that the upper cap 113 or the lower cap 115 is moved by the driving unit to open or close the accommodation chamber 111 of the pressure vessel 110.

[0096] The lower cap 115 of the pressure vessel 110 is connected with the pressure medium supply unit 130 to supply the pressure medium into the accommodation chamber 111 when the accommodation chamber 111 is closed.

[0097] In order to carry out the isostatic pressing, the isostatic press 100 configured as described above opens the pressure vessel 110 by moving the upper cap 113 or the lower cap 115 with the driving unit, thereby introducing the workpiece into the accommodation chamber 111.

[0098] When the workpiece is introduced into the opened accommodation chamber 111, if the upper cap 113 or the lower cap 115 is provided with the shelf 114, the upper cap 113 or the lower cap 115 is moved by the driving unit to close the accommodation chamber 111 in the state in which the workpiece is seated on the shelf 114, and then the pressure medium supply unit 130 supplies the pressure medium into the accommodation chamber 111 to perform the isostatic pressing.

[0099] When it is necessary to heat the workpiece above a desired temperature while carrying out the isostatic pressing, for example, when the workpiece is sintered while maintaining the pressing force, the heat medium stored in the heat medium storing tank 280 is heated by the heating part 220, and is supplied to the heat exchange member 210 to transfer the heat between the heat exchange member 210 and the pressure medium and thus heat the workpiece at a desired temperature.

[0100] In this instance, since the pressure of the accommodation chamber 111 is high even though the heat medium is water, a boiling point of the3 water is increased, and thus the pressure medium can be heated above 100°C. The temperature of the pressure medium is measured by the temperature sensor 215, so that the temperature can be maintained evenly.

[0101] Also, when it is necessary to cool the workpiece below a desired temperature while carrying out the isostatic pressing, for example, when the workpiece is cured while maintaining the pressing force, the heat medium stored in the heat medium storing tank 280 is cooled by the cooling part 230, and is supplied to the heat exchange member 210 to transfer the heat between the heat exchange member 210 and the pressure medium and thus cool the workpiece below a desired temperature.

[0102] In this instance, the temperature of the pressure medium to be cooled is measured by the temperature sensor 215, so that the temperature can be maintained evenly so as to be cooled below the desired temperature.

[0103] When the isostatic pressing process is finished, the upper cap 113 or the lower cap 115 of the pressure vessel 110 is opened by means of the driving unit to discharge the pressure medium filled in the accommodation chamber 111 or retrieve the pressure medium from the pressure medium supply unit 130, and then the workpiece seated on the shelf 114 of the upper cap 113 or the lower cap 115 is carried out.

[0104] Accordingly, the isostatic press 100 according to the embodiment of the present invention can directly heat or cool the workpiece in the short time through the pressure medium which applies the isostatic pressure to the workpiece, through the heat exchanger 200 to decrease a time required for the compression molding and the heat loss.

[0105] Also, since the workpiece is directly heated or cooled by the pressure medium, it is possible to heat or cool the workpiece at the uniform temperature.

[0106] In addition, since the workpiece is heated or cooled in the state in which the pressure is maintained, it is possible to enable the workpiece to have a dense structure, thereby minimizing a fraction defective of the workpiece.

[0107] Furthermore, since the heat insulator is installed to the inside of the pressure vessel 110, it is possible to prevent the heat from transferring from the inside to the pressure vessel 110, thereby preventing the packing from being broken to decrease the pressure loss and improve the air tightness.

[0108] Now, the method of fabricating the chip component using the above-described isostatic press 100 according to the embodiment of the present invention will be described.

[0109] Although the method of fabricating the chip component will be described by use of the above-described isostatic press 100 according to the embodiment of the present invention, it will be applied to any of various isostatic presses known in the art if the isostatic press is equipped with the above-described heat exchanger 200.

[0110] First, the chip will be subjected to a half-finished product molding step before it is loaded in the isostatic press 100 according to the embodiment of the present invention.

[0111] In the half-finished product molding step, a powder is mixed with a solvent, a binder, and the like to manufacture slurry of high moldability, and then the slurry is shaped in the shape of a sheet, which is layered on an electrode, or the slurry is shaped in any shape to form the electrode.

[0112] For example, a chip capacitor and a chip varistor are fabricated as a half-finished product by forming the slurry in the shape of the sheet, and then alternatively layering the sheet and the electrode. A chip inductor is fabricated as a half-finished product by forming the slurry in any shape, and then layering sheets with a magnetic pattern. Therefore, the half-finished products of the chip components are differently formed depending upon each chip component.

[0113] In the half-finished product molding step, the powder includes a ceramic powder and a metal powder. The ceramic powder or the metal powder may be mixed with a polymer resin, such as polyimide or epoxy, or the ceramic powder and the metal powder is mixed with the polymer resin to fabricate the slurry which does not need a binder.

[0114] In the case where the half-finished product is molded by use of the slurry containing the binder, a burn-out process of removing the binder should be carried out. However, in the case where the half-finished product is molded by use of the slurry containing the polymer resin which does not need the binder, it is not necessary to carry out the burn-out process. Accordingly, it is preferable in the present invention to mold the half-finished product by use of the slurry containing the polymer resin which does not need the burn-out process.

[0115] If the half-finished product to fabricate the chip component is molded, the compression molding is carried out by means of the isostatic press 100 according to the embodiment of the present invention, as mentioned below.

[0116] As illustrated in Fig. 9, the method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S10 of loading the workpiece, such as a chip component.

[0117] In the step S10 of loading the chip component, the chip component is loaded in the accommodation chamber 111 of the isostatic press 100 to compressively mold the half-finished product molded in the half-finished product molding step.

[0118] In this instance, in the state in which the upper cap 113 or the lower cap 115 of the pressure vessel 110 is opened to load the chip component in the accommodation chamber 111, the chip component can be loaded in the accommodation groove 111. In order to facilitate settlement and transport of the chip component in the accommodation chamber 111, the chip component can be loaded in the accommodation chamber 111 in the state in which the chip component is seated on the shelf mounted to the upper cap 113 or the lower cap 115.

[0119] If the chip component is introduced in the accommodation chamber 111, the pressure vessel 110 is closed by closing the upper cap 113 or the lower cap 115.

[0120] The method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S20 of performing isostatic pressing of the chip component.

[0121] In the step S20 of performing isostatic pressing of the chip component, the pressure medium is supplied into the accommodation chamber 111 by the pressure medium supply unit 130 to perform the isostatic pressing on the chip component loaded in the accommodation chamber 111.

[0122] In this instance, the pressure medium is supplied into the accommodation chamber 111 at a predetermined pressure, and the isostatic pressing is carried out during a predetermined time.

[0123] The method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S30 of heating the heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member.

[0124] In the step S30 of heating the heat exchange member 210 which transfers the heat to the pressure medium, the pressure medium is heated by heating the heat exchange member 210. In other words, the pressure medium is heated to sinter the chip component.

[0125] In the step S30 of heating the heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member, the pressure medium is supplied to the accommodation chamber 111, and then the pressure medium can be heated, with the pressing force of the pressure medium being maintained, after the isostatic pressing on the chip component is finished during the predetermined time, or while the isostatic pressing is proceeding.

[0126] The pressure medium can be heated in such a way that the heat medium heated by the heating part 220 of the heat exchanger 200 is supplied to the heat exchange member 210, and then the heat exchange member 210 heated by the heat medium transfers the heat to the pressure medium.

[0127] In this instance, the heating of the pressure medium can be carried out during the predetermined time in the state in which the temperature is maintained at the predetermined level by the temperature sensor 215 provided to the heat exchange member 210.

[0128] The method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S40 of cooling the heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member.

[0129] In the step S40 of cooling the heat exchange member 210 which transfers the heat to the pressure medium, the chip component is cooled by cooling the pressure medium to cure the chip component.

[0130] For example, if the hot chip component is cooled, the chip component is fabricated to have the dense structure. In this step, the curing can be carried out by cooling the sintered chip component by means of the pressure medium.

[0131] The step of cooling the heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member can be performed after the step of heating the heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member, or before the step of heating the heat exchange member 210 which transfers the heat between the heat medium and the heat exchange member.

[0132] The step of cooling heat exchange member 210 which transfers the heat between the pressure medium and the heat exchange member can be carried out during the predetermined time in the state in which the temperature is maintained at the predetermined level by the temperature sensor 215 provided to the heat exchange member 210.

[0133] The pressure medium can be cooled by cooling the heat medium by means of the cooling part 230 of the heat exchanger 200, supplying the cold heat medium to the heat exchange member 210, and transferring the heat between the heat exchange member 210 and the pressure member.

[0134] The method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S50 of discharging the pressure medium, which is supplied to the accommodation chamber 111, from the accommodation chamber 111.

[0135] The step S50 of discharging the pressure medium, which is supplied to the accommodation chamber 111, from the accommodation chamber 111 is to discharge the pressure medium filled in the accommodation chamber 111 outwardly from the pressure vessel 110 so as to carry out the chip component which is subjected to the isostatic pressing in the accommodation chamber 111.

[0136] In the step S50 of discharging the pressure medium, which is supplied to the accommodation chamber 111, from the accommodation chamber 111, the pressure medium can be discharged from the accommodation chamber 111 by moving the upper cap 113 or the lower cap 115 closing the pressure vessel 110 from the pressure vessel 110 by means of the driving unit, and the pressure medium can be recovered by the pressure medium supply unit 130.

[0137] The method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention may include a step S60 of discharging the chip component out from the accommodation chamber 111.

[0138] In the step S60 of discharging the chip component out from the accommodation chamber 111, the chip component which has been subjected to the isostatic pressing is carried out from the isostatic press 100 for the purpose of the nest process.

[0139] In order to unload the chip component from the accommodation chamber 111, the lower cap 115 or the upper cap closing the pressure vessel 110 is moved by the driving unit, so that the chip component is moved out in the state in which the accommodation chamber 111 is opened.

[0140] The chip component unloaded from the isostatic press 100 is cut to a wanted size, and then is polished so that the layered electrodes are not exposed to the outside, thereby forming an external electrode to be easily mounted on a printed circuit board.

[0141] In this instance, the external electrode can be made of tin or nickel-tin by an electroplating method, and the chip component can be fabricated by different processes after the chip component is unloaded from the isostatic press 100, according to the kind of the chip component.

[0142] Accordingly, the method of fabricating the chip component using the isostatic press 100 according to the embodiment of the present invention can make the chip component having the dense structure since the isostatic press 100 capable of performing the isostatic pressing carries out both the sintering and the curing of the chip component, thereby minimizing the fraction defective of the chip component.

[0143] Also, since other production equipment is not required to sinter and cure the chip component, it is possible to lower production costs of the chip component.

[0144] In addition, since the chip component can be directly heated or cooled by the pressure medium, it is possible to heat or cool the chip component in the short time, thereby shortening a time required for fabricating the chip component.

[0145] While the present invention has been described with reference to the particular illustrative embodiments, it is not to be restricted by the embodiments but only by the appended claims. It is to be appreciated that those skilled in the art can change or modify the embodiments without departing from the scope and spirit of the present invention.

Industrial Applicability

[0146] The present invention can be applied to various industry fields, such as semiconductor fabrication, ceramic processing, or compression molding.

Claims

1. An isostatic press including a pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, the isostatic press comprising:

a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber.

2. The isostatic press according to claim 1, wherein the heat exchange member is heated or cooled by a heat medium supplied to the heat exchange member.

3. The isostatic press according to claim 2, wherein the heat exchange includes a heating part configured to heat the heat medium and a cooling part configured to cool the heat medium.

4.  The isostatic press according to claim 3, wherein the heat exchanger includes a selective supply unit configured to selectively supply the heat medium which is heated or cooled by the heating part or the cooling part to the heat exchange member.

5. The isostatic press according to claim 2, wherein the heat exchanger includes a heat medium storing tank configured to store the heat medium.

6. The isostatic press according to claim 2, wherein the heat exchange member is provided with an inlet port into which the heat medium cooling or heating the heat exchange member flows, an outlet port away from which the heat medium flowing into the inlet port flows, and a microchannel configured to connect the inlet port and the outlet port so that the heat medium flows in a zigzag pattern in the heat exchange member.

7. The isostatic press according to claim 2, wherein the heat medium includes water.

8. The isostatic press according to claim 1, wherein the heat exchange member includes a heater which is heated by electricity.

9. The isostatic press according to claim 1, wherein the heat exchange member includes a cooling unit which is cooled by a coolant.

10. The isostatic press according to claim 1, wherein the heat exchange member is formed in any one of a plate shape, a cylindrical shape and a helical shape.

11. The isostatic press according to claim 1, wherein the heat exchange member is provided with a plurality of through-holes penetrating the heat exchange member, or a plurality of protrusions protruding from an outer wall of the heat exchange member, in order to increase a contact area between the pressure medium and the heat exchange member.

12.  The isostatic press according to claim 1, further comprising a heat insulator which is provided on an inner surface of the accommodation chamber to prevent the heat of the heat exchange member from transferring to an outside of the accommodation chamber.

13. The isostatic press according to claim 12, wherein the insulator includes any one of resin or ceramic.

14. The isostatic press according to claim 1, wherein the pressure vessel further includes an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and
a heater is installed to at least one of the upper cap and the lower cap to heat the pressure medium.

15. The isostatic press according to claim 1, wherein the pressure vessel further includes an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and
a shelf which is connected to any one of the upper cap and the lower cap on which the workpiece is seated.

16. A method of fabricating a chip component using an isostatic press including a pressure vessel having an accommodation chamber for receiving a workpiece therein, in which the accommodation chamber is filled with a pressure medium to apply isostatic gas pressure to the workpiece, and a heat exchanger including a heat exchange member which is installed to the accommodation vessel and transfers heat between the pressure medium and the heat exchange member to heat or cool the pressure medium supplied to the accommodation chamber, the method comprising:

loading the chip component in the accommodation chamber;

supplying a pressure medium into the accommodation chamber to carry out isostatic pressing on the chip component;

heating the heat exchange member which transfers heat between the pressure medium and the heat exchange member, to heat the chip component in a state in which pressure is maintained by the pressure medium;

discharging the pressure medium from the accommodation chamber; and

unloading the chip component from the accommodation chamber.

17. The method according to claim 16, further comprising, before or after the step of heating the heat exchange member which transfers the heat between the pressure medium and the heat exchange member, cooling the heat exchange member which transfers heat between the pressure medium and the heat exchange member, to cool the chip component in a state in which the pressure is maintained by the pressure medium.

18. The method according to claim 16, wherein the heat exchange member is heated or cooled by a heat medium supplied to the heat exchange member.

19. The method according to claim 18, wherein the heat exchange includes a heating part configured to heat the heat medium and a cooling part configured to cool the heat medium.

20. The method according to claim 18, wherein the heat exchanger includes a selective supply unit configured to selectively supply the heat medium which is heated or cooled by the heating part or the cooling part to the heat exchange member.

21.  The method according to claim 18, wherein the heat exchanger includes a heat medium storing tank configured to store the heat medium.

22. The method according to claim 18, wherein the heat exchange member is provided with an inlet port into which the heat medium cooling or heating the heat exchange member flows, an outlet port away from which the heat medium flowing into the inlet port flows, and a microchannel configured to connect the inlet port and the outlet port so that the heat medium flows in a zigzag pattern in the heat exchange member.

23. The method according to claim 18, wherein the heat medium includes water.

24. The method according to claim 16, wherein the heat exchange member includes a heater which is heated by electricity.

25.  The method according to claim 16, wherein the heat exchange member includes a cooling unit which is cooled by a coolant.

26. The method according to claim 16, wherein the heat exchange member is formed in any one of a plate shape, a cylindrical shape and a helical shape.

27. The method according to claim 16, wherein the heat exchange member is provided with a plurality of through-holes penetrating the heat exchange member, or a plurality of protrusions protruding from an outer wall of the heat exchange member, in order to increase a contact area between the pressure medium and the heat exchange member.

28. The method according to claim 16, wherein the isostatic press further includes a heat insulator which is provided on an inner surface of the accommodation chamber to prevent the heat of the heat exchange member from transferring to an outside of the accommodation chamber.

29.  The method according to claim 28, wherein the insulator includes any one of resin or ceramic.

30. The method according to claim 16, wherein the pressure vessel further includes an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and
a heater is installed to at least one of the upper cap and the lower cap to heat the pressure medium.

31. The method according to claim 16, wherein the pressure vessel further includes an upper cap and a lower cap which respectively close upper and lower portions of the pressure vessel, and
a shelf which is connected to any one of the upper cap and the lower cap on which the workpiece is seated.

Drawing