(19)
(11) EP 3 164 888 A1

(12)

(43) Date of publication:
10.05.2017 Bulletin 2017/19

(21) Application number: 15738228.4

(22) Date of filing: 01.07.2015
(51) International Patent Classification (IPC): 
H01L 23/64(2006.01)
H05K 1/16(2006.01)
H01L 23/522(2006.01)
H01F 17/00(2006.01)
(86) International application number:
PCT/US2015/038895
(87) International publication number:
WO 2016/004245 (07.01.2016 Gazette 2016/01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 03.07.2014 US 201414323907

(71) Applicant: Qualcomm Incorporated
San Diego, CA 92121-1714 (US)

(72) Inventors:
  • LEE, Jong-Hoon
    San Diego, California 92121-1714 (US)
  • SONG, Young Kyu
    San Diego, California 92121-1714 (US)
  • YOON, Jung Ho
    San Diego, California 92121-1714 (US)
  • JOW, Uei Ming
    San Diego, California 92121-1714 (US)
  • ZHANG, Xiaonan
    San Diego, California 92121-1714 (US)
  • LANE, Ryan David
    San Diego, California 92121-1714 (US)

(74) Representative: Howe, Steven 
Reddie & Grose LLP 16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WLP) INTEGRATED DEVICE