BACKGROUND
Cross-reference to related applications
Field of Inventions
[0002] The inventions relate to cleaning deposition pins, and, more specifically, cleaning
deposition pins while minimizing cross-contamination between the pins and minimizing
the volume of cleaning fluid required.
Description of Related Art
[0003] Systems and method are known for cleaning implements used for the deposition of fluid,
semi-fluid or solid samples of biological or chemical materials, for example in microarray
spotting, plate-to-plate transfer, or colony picking equipment. Examples of such implements
are solid pins, quill-type pins, capillary tubes, or ink-jet tubes. For simplicity,
all of these implements will be referred to as pins.
[0004] Washing of deposition pins can be achieved through several mechanisms. All pins being
used could be lowered into a bath of cleaning solution and agitated, either by agitation
of the fluid or by motion of the pins themselves. Agitation could be implemented by
creating a moving fluid flow, a re-circulating fluid flow, or sonication.
[0005] In a single common bath, material removed from one pin could be re-deposited on and
contaminate adjacent pins. This contamination can be mitigated by using large bath
volumes or by incorporating a fluid flow away from the pin surfaces to be cleaned.
However, in such a system, the volume of cleaning fluid needed to maintain a supply
of uncontaminated fluid at the cleaning surfaces can be excessive, with the added
complications of storage or transportation of fresh fluid or waste fluid in the system.
[0006] High frequency coupling of energy (sonication, ultrasonics, megasonics, etc.) to
aid the cleaning process can be implemented, but adds cost and complexity to implement
the drive elements and proper mechanical design to couple the energy on all of the
targeted surfaces to be cleaned.
SUMMARY OF THE INVENTION
[0007] The invention provided methods of and systems for cleaning deposition pins.
[0008] Under an aspect of the invention, a pin wash station includes a lower chamber, a
drain basin, a plurality of cleaning tubes, and a vent tube. Each cleaning tube has
an inlet end and an outlet end. Each tube inlet end is in fluid communication with
the lower chamber. The terminus of all tube inlet ends are below a substantially horizontal
reference plane. Each tube outlet end is in fluid communication with the drain basin
such that fluid that exits the outlet end of the tube passes into the drain basin.
Each tube outlet end is adapted to receive at least a portion of a deposition pin.
The vent tube has an inlet end and an outlet end. The inlet end is in fluid communication
with the lower chamber. The terminus of the vent tube inlet end is above the level
of the cleaning tube inlet ends relative to the substantially horizontal reference
plane. The outlet end is in fluid communication with the drain basin.
[0009] Under another aspect of the invention, a system includes a plurality of pins adapted
to deposit an array of material dots on a receiving surface and a pin wash station.
The pin wash station includes a lower chamber, a drain basin, a plurality of cleaning
tubes, and a vent tube. Each cleaning tube has an inlet end and an outlet end. Each
tube inlet end is in fluid communication with the lower chamber. The terminus of all
tube inlet ends is below a substantially horizontal reference plane. Each tube outlet
end is in fluid communication with the drain basin. Each tube outlet end is adapted
to receive one of the plurality of pins. The vent tube has an inlet end and an outlet
end. The inlet end is in fluid communication with the lower chamber. The terminus
of the vent tube inlet end is above the level of the cleaning tube inlet ends relative
to the substantially horizontal reference plane. The outlet end is in fluid communication
with the drain basin.
[0010] Under a further aspect of the invention, a method of cleaning a plurality of deposition
pins in a cleaning system is provided. The cleaning system includes a lower chamber,
a drain basin, and a plurality of cleaning tubes. Each cleaning tube has an inlet
end and an outlet end. Each tube inlet end is in fluid communication with the lower
chamber. Each tube outlet end is in fluid communication with the drain basin. Each
tube outlet end is adapted to receive at least a portion of one of the deposition
pins. The method includes providing a cleaning fluid into the lower chamber to a level
above the outlet ends of each cleaning tube so that vapor within the lower chamber
is displaced by the cleaning fluid. Cleaning fluid is provided past this point so
that vapor remaining in the lower chamber is compressed and the cleaning fluid flows
upward through the cleaning tubes. The method also includes disposing at least a portion
of a single one of the deposition pins in the tube outlet end of one of the cleaning
tubes while the cleaning fluid flows through the cleaning tubes so that the pin is
washed within the tube.
[0011] Under yet another aspect of the invention, the tube outlet ends are arranged in rows
and the method further includes disposing a first row of deposition pins in a row
of tube outlet ends; each tube outlet end of the row receiving no more than one deposition
pin of the first row of deposition pins. The method also includes removing the first
row of deposition pins from the row of tube outlet ends and, subsequent to removing
the first row of deposition pins from the row of tube outlet ends, disposing a second
row of deposition pins in the row of tube outlet ends. Each tube outlet end of the
row receives no more than one deposition pin of the second row of deposition pins.
[0012] Under still another aspect of the invention, a plurality of pins are disposed in
a plurality of tubes on a one-for-one basis. The tube outlet ends are above a level
of cleaning fluid such that each of the plurality of pins is washed within a respective
cleaning tube. The cleaning fluid passes each tube and exits at outlet ends such that
the fluid that cleans a first pin is drained and does not come into fluid contact
with a second pin.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0013] For a more complete understanding of various embodiments of the present inventions,
reference is now made to the following descriptions taken in connection with the accompanying
drawings in which:
Fig. 1 is a top view and a cross-sectional side view of a multi-chambered wash station.
Fig. 2 is a top view and a cross-sectional side view of a multi-chambered wash station
with cleaning fluid in the lower chamber.
Fig. 3 is a cross-sectional side view of a single cleaning tube and a single printing
pin.
Fig. 4 is a side view of a drain end of a single cleaning tube.
Fig. 5 is a cross-sectional side view of a cleaning tube with a flow restriction feature
in the fluid exit end of the tube.
Fig. 6 is a cross-sectional side view of a multi-chambered wash station with a vent
tube.
Fig. 7 is a cross-sectional side view of a multi-chambered wash station with a curved
vent tube.
Fig. 8 is a cross-sectional side view of a multi-chambered wash station with a capped
vent tube.
Fig. 9 is a top view of a multiple wash fluid cleaning system employing one or more
multi-chambered wash stations.
Fig. 10, which includes Figs. 10a-10c, is a side view of an arrangement of cleaning
tubes for an interlaced cleaning system.
Fig. 11 is an overview of a pin washing system.
DETAILED DESCRIPTION
[0014] Embodiments of the inventions include methods of and systems for cleaning deposition
pins. Deposition pins are used to deposit small quantities of fluid, semi-fluid, or
solid samples of biological or chemical materials. They are usually arranged in an
array. Typically, it is a regular two-dimensional rectangular array (
e.g., a 48 pin array is typically a 4 x 12 arrangement of pins), but an array could be
one-dimensional, have an irregular pattern, or be a single pin. Deposition pins are
relatively small, and can be approximately 43 - 50 mm in overall length, have an extraction
depth of 10 - 16 mm, a diameter ranging between 3.2 - 1.9 mm along the length of the
pin, and a tip diameter between 85 - 355 µm. However, deposition pins can have dimensions
that are larger or smaller than these dimensions and still be used with embodiments
of the inventions. Embodiments of the inventions can be used with automated microarray
printing systems, such as the one disclosed in
U.S. Patent Application No. 10/972,792, entitled "Apparatus and Method For Dispensing Fluid, SemiSolid and Solid Samples",
filed October 25, 2004, incorporated by reference herein. This application describes
a printing system that uses a printing head with multiple pins. However, as stated
above, embodiments of the inventions can also be used to clean a single pin.
[0015] Fig. 11 is an overview of a pin washing system 1000. The washing system 1000 has
a deposition pin array 1005 mounted on a pin array conveyor 1010. The pin array conveyor
1010 moves the pin array 1005 in the vertical direction. The washing system 1000 also
includes a multi-chambered wash station 1015 mounted on a wash station conveyor 1020.
The wash station 1015 is connected to a cleaning fluid reservoir 1025 via a fluid
pump 1030 and to a drain by flow control valve 1035. The fluid pump 1030 and valve
1035 are controlled by a controller 1040. Likewise, the controller 1040 controls the
position of the pin array 1005 on the pin array conveyor 1010 and the position of
the wash station 1015 on the wash station conveyor 1020.
[0016] In some embodiments, the wash station conveyor 1020 moves the wash station 1015 in
the horizontal plane to a position beneath the pin array 1005 that is to be washed.
In other embodiments, the wash station 1015 remains in a fixed position. The pin array
1005 is lowered via the pin array conveyor 1010 such that the tips of the pins are
washed in the wash station 1015, as described in greater detail below. Alternatively,
the wash station 1015 can be connected to other conveyors to allow the pin array 1005
to remain motionless, while the wash station 1015 is moved as required to wash the
pins of the pin array 1005. Likewise, the pin array 1005 can be connected to other
conveyors to allow the wash station 1015 to remain motionless, while the pin array
1005 is moved as required to wash the pins of the pin array 1005.
[0017] The controller 1040 controls the fluid pump 1030 and valve 1035 remains closed to
provide an appropriate flow of cleaning fluid to the wash station 1015. After one
or more wash cycles are complete, valve 1035 is opened to drain any remaining cleaning
fluid from the wash station 1015. The waste wash fluid exits the wash station 1015
through a drainage tube 1045. The drainage tube 1045 can convey used wash fluid to
a reservoir or into a waste water system. In addition, the cleaning fluid reservoir
1025 can be an internal reservoir, an external reservoir, or can be connected to a
continuous source of cleaning fluid.
[0018] Fig. 1 is a top view and a cross-sectional side view of a multi-chambered wash station
100 for cleaning a two-dimensional array of deposition pins. While this embodiment
is described as useful for cleaning an array of multiple pins, this embodiment, and
others, may be used with a printing head having a single deposition pin. The multi-chambered
wash station 100 has a lower chamber 105 and an upper drain basin 110, which are connected
by one or more cleaning tubes 115. The cleaning tubes 115 are the primary fluid path
between the two chambers. As shown in a top view 120 of the multi-chambered wash station
100, tubes 115 are arranged in multiple aligned rows (e.g., four rows of twelve tubes)
to match a configuration of multiple pins in a printing array (not shown). As an alternative
to separate tubes 115, machined features can be provided in the upper and lower chambers.
[0019] The lower chamber 105 is sealed to the drain basin 110 by one or more of a variety
of known techniques around the mated surfaces of the lower chamber 105 and the drain
basin 110. The tubes are sealed in the drain basin 110 such that the only path for
air or liquid to pass from the lower chamber 105 to the drain basin 110 is through
the tubes 115.
[0020] Fig. 2 is a top view and a cross-sectional side view of the multi-chambered wash
station 100 of Fig. 1 with cleaning fluid 200 in the lower chamber 105. Cleaning fluid
200 is pumped into the lower chamber 105 through cleaning fluid inlet 205 so that
the fluid level rises and air 210 is displaced and pushed through the tubes 115. The
fluid level 200 rises until it covers the bottom opening of the highest tube, measured
relative to a reference plane that is parallel to the fluid level (e.g., the reference
plane can be the substantially horizontal level of the fluid). Once the fluid level
200 reaches the highest tube, the air 210 no longer has a path to the upper drain
basin 110. When this occurs, the rising fluid level 200 compresses the air 210 trapped
at the top of the lower chamber 105 and a counter pressure is applied to the surface
of the fluid 200 in the lower chamber 105. The pressure on the surface of the fluid
200 acts to push the fluid up each of the tubes 115.
[0021] The flow of cleaning fluid 200 from the lower chamber 105 up the tubes 115 and into
the drain basin 110 provides individual fountains for individual pins to be washed.
One pin sits in each fountain to implement the washing action. The waste fluid then
runs down the sides of the tubes 115 and ultimately drains from waste holes 215 in
the upper drain basin. Although the tubes 115 wash one pin at a time during a single
wash cycle, each tube 115 need not be occupied by a pin during a particular cycle.
Thus, the number of tubes 115 can exceed the number of pins in a particular printing
array to be washed. Likewise, a printing array may have more pins that the number
of tubes 115 of a particular wash station. In such a scenario, all pins of the array
can be cleaned by the wash station by cleaning different pins of the array in sequential
wash cycles, as described in greater detail below.
[0022] In one implementation of the multi-chambered wash station 100, all tubes 115 have
the same inner diameter. Because all tubes 115 share the same fluid reservoir,
i.e., the lower chamber 105, the fluid pressure per unit area is equal at the bottom of
each tube 115 and equal fluid flow is generated in all of the tubes 115. This is an
efficient and inexpensive means for creating a multiplicity of equal flow rates for
washing.
[0023] Fig. 3 is a cross-sectional side view of a single cleaning tube 300 and a single
printing pin 315. As shown in Fig. 3, a flow 305 of cleaning fluid,
i.e., wash fluid, up the tube 300 provides an individual fountain 310 for an individual
pin 315 to be washed. In this manner, each pin has an independent supply of uncontaminated
wash fluid. Because the geometry of the tubes can be made to closely match the needs
of the pins to be washed, the tubes can be designed to increase or maximize the delivery
of uncontaminated fluid while reducing or minimizing the quantity of fluid used. Flow
of uncontaminated material is delivered precisely to the surfaces to be cleaned, thus
reducing the amount of fluid otherwise needed.
[0024] In at least one implementation of the multi-chambered wash station 100 of Figs. 1
and 2, the placement of the tubes 115 (as best illustrated by the top view 120 of
Fig. 1) is such that there is sufficient spacing between the tubes 115 so that all
waste fluid runs down the sides of the tubes 115 without mixing with either the waste
fluids or wash fluids of adjacent tubes. In this manner, the possibility of tube-to-tube
cross contamination is reduced, allowing for lower fluid flow rates to be used than
would be possible without this drain path.
[0025] In some implementations, features are incorporated into the tubes 115 to aid waste
fluid flow away from the pins. Without these features, the cleaning fluid can form
a spherical droplet at the top of an otherwise unmodified tube because of the surface
tension of the cleaning fluid and the small size of the tubes 115. Fig. 4 is a side
view of a drain end 400 of the single cleaning tube 300 of Fig. 3 incorporating a
drain feature. Such features can be, but are not limited to, a notch 405 in an upper
lip 410 of the tube 300. In addition, the surface finish of the tube 300 can be manipulated
to work against the cleaning fluid's surface tension and enhance flow down the outside
of the tube. Examples of such treatments are bead blasting and grit blasting. Also,
chemical deposition can be applied to similarly enhance the hydrophilic properties
of the tubes 115. Likewise, a chemical deposition can be applied to enhance the hydrophobic
properties of the tubes 115, depending on the cleaning fluid employed. These treatments
need not be applied uniformly, but could be applied over controlled paths to enhance
waste fluid flow along desired paths. In some implementations, the features and treatments
incorporated into the tubes can be preferentially oriented such that waste fluid from
one tube is directed toward the controlled waste path of an adjacent tube, thus allowing
closer spacing between tubes without mixing adjacent tube wash and waste fluids.
[0026] Fig. 5 is a cross-sectional side view of the cleaning tube 300 with a flow restriction
feature 500 in a fluid exit end 505 of the tube 300. Two examples of the flow restriction
feature are shown in Fig. 5. A first illustrative example is one in which the inner
diameter of the tube is restricted by a swage 510 to create sections of higher fluid
velocity at particular points along the length of the tube. The swage 510 is created
by reducing the diameter of the tube 300. The swage 510 is located at a position along
the tube 300 to correspond to the head of the pin to be cleaned. A second illustrative
example is one in which a flow restrictor 515 is installed in the tube 300. The flow
restrictor 515 narrows the tube's diameter at a position along the tube 300 to correspond
to the head of the pin to be cleaned. In other embodiments, the flow restriction feature
500 is located to correspond to a position other than the head of the pin, e.g., in-front
of or behind the head of the pin along the pin's length.
[0027] Although not illustrated, more complex features could be implemented within sections
of the tube 300 to create rotating or agitated flow patterns in the areas of interest.
For example, a swirl pattern could be etched on the inner surface of the tube or the
surface of the flow restrictor 515 near the position that corresponds to the head
of the pin to be cleaned. Similarly, a portion of the tube 300 or flow restrictor
515 could be roughened to cause turbulence in the region in which the head of the
pin lies. The addition of rotation or turbulence in the cleaning fluid can aid in
the cleaning of the pins.
[0028] Fig. 6 is a cross-sectional side view of a multi-chambered wash station 600. Wash
station 600 is similar to the implementation described above in conjunction with Fig.
1 and has a lower chamber 605, and drain basin 610, cleaning tubes 615, and holds
a cleaning fluid 620 in the lower chamber 605. Wash station 600 also has a vent tube
625.
[0029] Transient fluctuations in the level of the cleaning fluid 620 in the lower chamber
605 can occur due to, e.g., variations in the pumped fluid flow rate, bubbles in the
fluid source supply lines entering the lower chamber 605, and/or mechanical vibrations
in the wash station structure. During such disturbances, the level of the cleaning
fluid 620 can momentarily drop below the level of the one of the tubes 615. By exposing
the bottom opening of one of the tubes 615, trapped air 630 escapes through the top
of the tube, thereby depressurizing the lower chamber 605. This causes an interruption
in the fluid flow through most, if not all, of the tubes 615. In addition, if the
level of the fluid 620 varies rapidly around the inlet end of a working tube ("working
tube" as used herein is a tube used to clean pins), then cleaning fluid can become
entrained in the escaping air. This, in turn, can cause cleaning fluid to be sprayed
out of the outlet end of the tube as the tube inlet is alternately covered and uncovered
by the cleaning fluid. The sprayed cleaning fluid can cause contamination of pins
and/or other equipment.
[0030] The inlet of the vent tube 625 is set at a height that is higher than any of the
working tubes 615 (relative to the reference plane described above). In this way,
the level of the cleaning fluid 620 in the lower chamber 605 is maintained above the
inlet ends of the working tubes 615. Using the same principles described above, the
height of the cleaning fluid 620 in the lower chamber 605 rises to the level set by
the highest tube, which is now the vent tube 625. In the presence of fluid level fluctuations,
the inlet ends of the working tubes 615 do not become uncovered, and therefore, the
upward spray of cleaning fluid is avoided. The vent tube 625 can spray upward, but
it is positioned such that it sprays in a non-detrimental direction.
[0031] Fig. 7 is a cross-sectional side view of the multi-chambered wash station 600 of
Fig. 6, in which the vent tube 625 is fitted with an optional curved outlet end 700.
The curved outlet end 700 directs the potential spray away from the critical surfaces
to be washed. The curved outlet end can be positioned to vent directly into one or
more waste holes 705.
[0032] In addition, other methods can be employed to prevent cleaning fluid from spraying
from the outlet of the vent tube 625. Fig. 8 is a cross-sectional side view of the
multi-chambered wash station 600 of Fig. 6, in which the vent tube 625 includes a
cap 715. The cap 715 directs potential spray sideways into drain basin 710. In addition,
vent tube 625 can include a wire 720 that is disposed within and along the approximate
central axis of vent tube 625. The wire 720 disrupts the surface tension of any fluid
within vent tube 625. The wire 720 reduces the likelihood that fluid will clog the
vent tube 625 after fluid has vented through the vent tube 625.
[0033] Fig. 9 is a top view of a multiple wash fluid cleaning system 800 employing one or
more multi-chambered wash stations. Any of the multi-chambered wash station implementations
described above can be used in cleaning system 800. In one embodiment the cleaning
system 800 uses two multi-chambered wash stations. A first wash station 805 uses a
first wash fluid, and a second wash station 810 uses a second wash fluid. Multiple
fluid wash sequences are executed by alternatively entering working tubes 815 for
the first wash station and then entering working tubes 820 for the second wash station.
This multiplicity of fluids is not limited to two; nor is the sequence limited to
alternating back and forth between the fluids. Cleaning system 800 can be implemented
by motion of the pins as well as the described motion of the wash station.
[0034] In the embodiments and implementations set forth above, one working tube is described
as being dedicated to a corresponding one pin to be cleaned. If, however, there are
more pins in a given printing array to be cleaned than working tubes available, the
wash stations and/or cleaning systems described above can incorporate motion, either
of the tubes or of the pins, by an increment smaller than the spacing between working
tubes.
[0035] Fig. 10, which includes Figs. 10a-10c, is a side view of an arrangement of cleaning
tubes for an interlaced cleaning system 900. Cleaning system 900 has a first row of
working tubes 905 and a second row of working tubes 910. The spacing between the first
and second rows of working tubes is greater than the spacing of rows of pins 915 in
an array to be cleaned. All pins of the array can be cleaned using the interlaced
cleaning sequence illustrated Figs. 10a-10c.
[0036] The interlaced cleaning sequence provides for certain rows of pins to be cleaned
in one wash cycle, while adjacent rows of pins are cleaned in the next cycle by moving
either the pins or the cleaning tubes so as to mate the pins to the cleaning tubes.
Working tubes can be set apart from each other by any integer increment (i.e., integer
multiple) of the pin spacing. Such an embodiment is useful for use with, for example,
printing arrays having a relatively large number of pins, e.g., 192 pins, 384 pins,
1536 pins, and greater.
[0037] As will be realized, the inventions are capable of other and different embodiments
and its several details may be capable of modifications in various respects, all without
departing from the invention as set out in the appended claims. Accordingly, the drawings
and description are to be regarded as illustrative in nature and not in a restrictive
of limiting sense, with the scope of the application being indicated in the claims.
[0038] The following section of the description consists of numbered paragraphs simply providing
statements of the invention already described herein. The numbered paragraphs in this
section are not claims. The claims are set forth below in the later section headed
"claims".
- 1. A pin wash station, comprising: a lower chamber; a drain basin; a plurality of
cleaning tubes, each cleaning tube having an inlet end and an outlet end, each tube
inlet end being in fluid communication with the lower chamber, the terminus of all
tube inlet ends being below a substantially horizontal reference plane, each tube
outlet end being in fluid communication with the drain basin such that fluid that
exits the outlet end of the tube passes into the drain basin, and each tube outlet
end adapted to receive at least a portion of a deposition pin; and a vent tube, the
vent tube having an inlet end and an outlet end, the inlet end being in fluid communication
with the lower chamber, the terminus of the vent tube inlet end being above the level
of the cleaning tube inlet ends relative to the substantially horizontal reference
plane, and the outlet end being in fluid communication with the drain basin.
- 2. The pin wash station of clause 1, wherein the vent tube outlet end includes a portion
directed away from the cleaning tube outlet ends.
- 3. The pin wash station of clause 1, wherein the vent tube includes a surface tension
reduction feature disposed within the vent tube for reducing surface tension of fluid
within the vent tube.
- 4. The pin wash station of clause 3, wherein the surface tension reduction feature
includes a wire disposed within the vent tube.
- 5. The pin wash station of clause 1, wherein the substantially horizontal reference
plane corresponds to a level of a cleaning fluid in the lower chamber.
- 6. The pin wash station of clause 1, wherein at least one of the plurality of cleaning
tube outlet ends has a fluid surface tension reduction feature.
- 7. The pin wash station of clause 6, wherein the surface tension reduction feature
is a notch in a lip of at least one of the tube outlet ends.
- 8. The pin wash station of clause 6, wherein the surface tension reduction feature
includes a surface finish on an outside surface of at least one of the tube outlet
ends.
- 9. The pin wash station of clause 8, wherein the surface finish includes at least
one of a bead blasting treatment, a grit blasting treatment, a hydrophilic treatment,
and a hydrophobic treatment.
- 10. The pin wash station of clause 1, wherein at least one of the plurality of cleaning
tubes has a flow restriction feature positioned to correspond to a predetermined location
on at least a portion of the deposition pin.
- 11. The pin wash station of clause 10, wherein the predetermined location is the terminus
of the deposition pin.
- 12. The pin wash station of clause 10, wherein the flow restriction feature is a swage
in at least a portion of the cleaning tube.
- 13. The pin wash station of clause 10, wherein the flow restriction feature includes
a narrowing insert within at least a portion of the cleaning tube.
- 14. The pin wash station of clause 10, wherein an inner surface of the flow restriction
feature includes a surface treatment that generates at least one of rotation and turbulence
in a cleaning fluid flowing through the flow restriction feature.
- 15. A system, comprising : a plurality of pins adapted to deposit an array of material
dots on a receiving surface; and a pin wash station, including: a lower chamber; a
drain basin; a plurality of cleaning tubes, each cleaning tube having an inlet end
and an outlet end, each tube inlet end being in fluid communication with the lower
chamber, the terminus of all tube inlet ends being below a
substantially horizontal reference plane, each tube outlet end being in fluid communication
with the drain basin, and each tube outlet end adapted to receive one of the plurality
of pins; and a vent tube, the vent tube having an inlet end and an outlet end, the
inlet end being in fluid communication with the lower chamber, the terminus of the
vent tube inlet end being above the level of the cleaning tube inlet ends relative
to the substantially horizontal reference plane, and the outlet end being in fluid
communication with the drain basin.
- 16. The system of clause 15, wherein the substantially horizontal reference plane
corresponds to a level of a cleaning fluid in the lower chamber.
- 17. The system of clause 15, wherein the plurality of pins includes at least one deposition
pin printing array including at least 192 deposition pins.
- 18. The system of clause 15 , wherein at least one of the plurality of cleaning tubes
includes at least one of a fluid surface tension reduction feature, a fluid surface
tension reducing surface treatment, and a flow restriction feature.
- 19. The system of clause 15, wherein the number of cleaning tubes is equal to the
number of pins and the arrangement of the cleaning tubes corresponds to the arrangement
of the pins.
- 20. The system of clause 15, wherein the number of cleaning tubes is less than the
number of pins.
- 21. The system of clause 20, wherein the plurality of pins are arranged in rows having
a first spacing between the rows, the cleaning tubes are arranged in rows having a
second spacing between the rows, and the second spacing is an integer multiple of
the first spacing.
- 22. A method of cleaning a plurality of deposition pins in a system with a lower chamber,
a drain basin, and a plurality of cleaning tubes, each cleaning tube having an inlet
end and an outlet end, each tube inlet end being in fluid communication with the lower
chamber, each tube outlet end being in fluid communication with the drain basin, and
each tube outlet end adapted to receive at least a portion of one of the deposition
pins, the method comprising: providing a cleaning fluid into the lower chamber to
a level above the outlet ends of each cleaning tube so that vapor within the lower
chamber is displaced by the cleaning fluid, and continuing to provide the cleaning
fluid so that vapor remaining in the lower chamber is compressed and the cleaning
fluid flows upward through the cleaning tubes; and disposing at least a portion of
a single one of the deposition pins in the tube outlet end of one of the cleaning
tubes while the cleaning fluid flows through the cleaning tubes so that the pin is
washed within the tube.
- 23. The method of clause 22, wherein at least one of the plurality of cleaning tubes
includes a flow restriction feature and the disposing the deposition pin in the tube
outlet end includes disposing a terminus of the deposition pin within the flow restriction
feature.
- 24. The method of clause 22, wherein the tube outlet ends are arranged in rows and
further comprising: disposing a first row of deposition pins in a row of tube outlet
ends, each tube outlet end of the row receiving no more than one deposition pin of
the first row of deposition pins; removing the first row of deposition pins from the
row of tube outlet ends; and subsequent to removing the first row of deposition pins
from the row of tube outlet ends, disposing a second row of deposition pins in the
row of tube outlet ends, each tube outlet end of the row receiving no more than one
deposition pin of the second row of deposition pins.
- 25. The method of clause 22, wherein a plurality of pins are disposed in a plurality
of tubes on a one-for-one basis, and wherein the tube outlet ends are above a level
of cleaning fluid such that each of the plurality of pins is washed within a respective
cleaning tube, and wherein the cleaning fluid passes each tube and exits at outlet
ends such that the fluid that cleans a first pin is drained and does not come into
fluid contact with a second pin.
1. A pin wash station, comprising:
a lower chamber;
a drain basin;
a plurality of cleaning tubes, each cleaning tube having an inlet end and an outlet
end, each tube inlet end being in fluid communication with the lower chamber, the
terminus of all tube inlet ends being below a substantially horizontal reference plane,
each tube outlet end being in fluid communication with the drain basin such that fluid
that exits the outlet end of the tube passes into the drain basin, and each tube outlet
end adapted to receive at least a portion of a deposition pin; and
a vent tube, the vent tube having an inlet end and an outlet end, the inlet end being
in fluid communication with the lower chamber, the terminus of the vent tube inlet
end being above the level of the cleaning tube inlet ends relative to the substantially
horizontal reference plane, and the outlet end being in fluid communication with the
drain basin, wherein the plurality of cleaning tube outlet ends has a feature that
creates rotating or agitated flow pattern.
2. The pin wash station according to claim 1, wherein the flow pattern is a swirl pattern
on the inner surface of the tube.
3. The pin wash station according to claim 2, wherein the flow pattern is near a head
of a pin to be cleaned.
4. A system, comprising:
a plurality of pins adapted to deposit an array of material dots on a receiving surface;
and
a pin wash station, including:
a lower chamber;
a drain basin;
a plurality of cleaning tubes, each cleaning tube having an inlet end and an outlet
end, each tube inlet end being in fluid communication with the lower chamber, the
terminus of all tube inlet ends being below a substantially horizontal reference plane,
each tube outlet end being in fluid communication with the drain basin such that fluid
that exits the outlet end of the tube passes into the drain basin, and each tube outlet
end adapted to receive at least a portion of a deposition pin; and
a vent tube, the vent tube having an inlet end and an outlet end, the inlet end being
in fluid communication with the lower chamber, the terminus of the vent tube inlet
end being above the level of the cleaning tube inlet ends relative to the substantially
horizontal reference plane, and the outlet end being in fluid communication with the
drain basin, wherein the plurality of cleaning tube outlet ends has a feature that
creates rotating or agitated flow patterns.
5. The system according to claim 4, wherein the flow pattern is a swirl pattern on the
inner surface of the tube.
6. The system according to claim 5, wherein the flow pattern is near a head of the plurality
of pins to be cleaned.