(19)
(11) EP 3 180 288 A1

(12)

(43) Date of publication:
21.06.2017 Bulletin 2017/25

(21) Application number: 14755503.1

(22) Date of filing: 11.08.2014
(51) International Patent Classification (IPC): 
B81C 1/00(2006.01)
H01L 23/00(2006.01)
H01L 23/10(2006.01)
(86) International application number:
PCT/US2014/050589
(87) International publication number:
WO 2016/024946 (18.02.2016 Gazette 2016/07)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(71) Applicant: Raytheon Company
Waltham, MA 0245-1449 (US)

(72) Inventors:
  • KENNEDY, Adam, M.
    Santa Barbara, California 93111 (US)
  • DIEP, Buu, Q.
    Murphy, Texas 75094 (US)
  • BLACK, Stephen, H.
    Buellton, California 93427-9749 (US)
  • WONG, Tse, E.
    Los Alamitos, California 90720 (US)
  • KOCIAN, Thomas, Allan
    Dallas, Texas 75240-3623 (US)
  • TRACY, Gregory, D.
    Buellton, California 93427 (US)

(74) Representative: Carpmaels & Ransford LLP 
One Southampton Row
London WC1B 5HA
London WC1B 5HA (GB)

   


(54) HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER