(19)
(11) EP 3 213 022 A2

(12)

(88) Date of publication A3:
22.09.2016

(43) Date of publication:
06.09.2017 Bulletin 2017/36

(21) Application number: 15878262.3

(22) Date of filing: 28.10.2015
(51) International Patent Classification (IPC): 
F28D 15/02(2006.01)
B81C 1/00(2006.01)
H01L 23/427(2006.01)
B81B 1/00(2006.01)
(86) International application number:
PCT/US2015/057885
(87) International publication number:
WO 2016/114840 (21.07.2016 Gazette 2016/29)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 28.10.2014 US 201462069564 P

(71) Applicant: Kelvin Thermal Technologies, Inc.
Boulder, CO 80303 (US)

(72) Inventors:
  • LEWIS, Ryan John
    Boulder, CO 80303 (US)
  • LEE, Yung-Cheng
    Boulder, CO 80303 (US)
  • LIEW, Li-Anne
    Westminster, CO 80020 (US)
  • WANG, Yunda
    Denver, CO 80203 (US)

(74) Representative: Howell, Matthew Dafydd 
Withers & Rogers LLP 4 More London Riverside
London SE1 2AU
London SE1 2AU (GB)

   


(54) POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE