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(11) | EP 3 216 822 A8 |
(12) | CORRECTED EUROPEAN PATENT APPLICATION |
published in accordance with Art. 153(4) EPC |
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(54) | UV EPOXY RESIN INSTILLATION FORMING METHOD AND APPLICATION THEREOF |
(57) Disclosed is a UV epoxy resin instillation forming method, which comprises the following
steps: UV epoxy resin preparation: adding at least two photosensitizers into a single-component
epoxy resin and uniformly mixing to obtain a UV epoxy resin, wherein the photosensitizer
with the highest content in the UV epoxy resin is a photosensitive curing agent that
is used for curing the UV epoxy resin, and the rest of the photosensitizer is a photosensitive
viscosity regulator that is used for regulating the UV epoxy resin to the viscosity
required by instillation forming; instillation: dividing the instillation of the UV
epoxy resin into N procedures performed in one work station, wherein zero, one or
more photosensitive viscosity regulators are correspondingly initiated in each procedure
and used for regulating the UV epoxy resin to the viscosity required by the procedure
and performing instillation; and curing: initiating the photosensitive curing agent
to finally cure the UV epoxy resin. The method can be used in the fields of micro-electronic
chip packaging, 3D printing and the like.
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