(19)
(11) EP 3 216 822 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
17.01.2018 Bulletin 2018/03

(43) Date of publication:
13.09.2017 Bulletin 2017/37

(21) Application number: 15856401.3

(22) Date of filing: 23.10.2015
(51) International Patent Classification (IPC): 
C08J 3/28(2006.01)
C08L 63/00(2006.01)
C08G 59/40(2006.01)
H01L 23/28(2006.01)
C08J 3/24(2006.01)
C09J 163/00(2006.01)
H01L 21/56(2006.01)
(86) International application number:
PCT/CN2015/092612
(87) International publication number:
WO 2016/070722 (12.05.2016 Gazette 2016/19)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 06.11.2014 CN 201410620894

(71) Applicant: CollTech (Dongguan) Bonding Technology Co., Ltd.
Dongguan 523330 (CN)

(72) Inventor:
  • HUANG, Chengsheng
    Shenzhen Guangdong 518126 (CN)

(74) Representative: Nobbe, Matthias 
Demski & Nobbe Patentanwälte Mülheimer Strasse 210
47057 Duisburg
47057 Duisburg (DE)

   


(54) UV EPOXY RESIN INSTILLATION FORMING METHOD AND APPLICATION THEREOF


(57) Disclosed is a UV epoxy resin instillation forming method, which comprises the following steps: UV epoxy resin preparation: adding at least two photosensitizers into a single-component epoxy resin and uniformly mixing to obtain a UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent that is used for curing the UV epoxy resin, and the rest of the photosensitizer is a photosensitive viscosity regulator that is used for regulating the UV epoxy resin to the viscosity required by instillation forming; instillation: dividing the instillation of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulators are correspondingly initiated in each procedure and used for regulating the UV epoxy resin to the viscosity required by the procedure and performing instillation; and curing: initiating the photosensitive curing agent to finally cure the UV epoxy resin. The method can be used in the fields of micro-electronic chip packaging, 3D printing and the like.