(19)
(11) EP 3 243 217 A1

(12)

(43) Date of publication:
15.11.2017 Bulletin 2017/46

(21) Application number: 16735133.7

(22) Date of filing: 04.01.2016
(51) International Patent Classification (IPC): 
H01L 23/60(2006.01)
(86) International application number:
PCT/KR2016/000013
(87) International publication number:
WO 2016/111512 (14.07.2016 Gazette 2016/28)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA MD

(30) Priority: 09.01.2015 KR 20150003469
22.06.2015 KR 20150088717

(71) Applicant: Samsung Electronics Co., Ltd.
Gyeonggi-do 16677 (KR)

(72) Inventors:
  • BEAK, O-hyun
    Seoul 06602 (KR)
  • KUK, Keon
    Yongin-si Gyeonggi-do 16822 (KR)
  • KO, Young-chul
    Suwon-si Gyeonggi-do 16709 (KR)
  • KIM, Woon-bae
    Seoul 05065 (KR)

(74) Representative: HGF Limited 
Saviour House 9 St. Saviourgate
York YO1 8NQ
York YO1 8NQ (GB)

   


(54) SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME