[0001] The present application claims the priority of the Chinese patent application No.
201510055838.5 filed on February 3, 2015 and with the title of "Semiconductor Refrigerator", which is incorporated herein
in its entirety as reference.
TECHNICAL FIELD
[0002] The present invention is related to a refrigerator, and more particularly to a semiconductor
refrigerator.
BACKGROUND
[0003] A semiconductor refrigerator, also called a thermoelectric refrigerator, achieves
refrigeration by using automatic voltage-and-current changing techniques and semiconductor
cooling plates which radiate and transfer heat through highly efficient two-layered
loop heat pipes. A semiconductor refrigerator does not require refrigerating working
media and mechanically movable members, and solves the application problems of a traditional
mechanical refrigerator such as contamination by working media and mechanical vibrations.
[0004] When refrigerating by the cold end of a semiconductor cooling plate, plenty of heat
will be generated at the hot end thereof. To ensure reliable and continuous working
of the semiconductor cooling plate, heat radiation is required for the hot end thereof.
However, in the prior arts, usually heat exchange with an ambient environment is performed
through heat pipes and heat radiating plates when radiating the heat at the hot end
of the semiconductor cooling plate.
[0005] An existing sintered heat pipe extends from its one end to the other along an exclusive
path. When one end of the sintered heat pipe is heated, the liquid in the capillary
core is evaporated and vaporized. The vapors flow to the other end due to a slight
pressure difference, emits heat and condenses into liquid again. Then, the liquid
flows to the evaporating segment again under the capillary force along porous materials.
This process cycles endlessly, transferring the heat from one end to the other end
of the sintered heat pipe. However, existing sintered heat pipes may not achieve desired
effects when radiating heat for heat sources of a high heat flow density such as semiconductor
cooling plates.
SUMMARY
[0006] One object of the present invention is to overcome at least one defect of an existing
semiconductor refrigerator by providing a semiconductor refrigerator with high heat
radiation efficiency.
[0007] To achieve the above object, the present invention provides a semiconductor refrigerator
comprising a semiconductor cooling plate and a hot end heat radiating device, wherein
the hot end heat radiating device comprises multiple sintered heat pipes, each having
a main pipe with both ends closed, wherein the main pipe comprises a first pipe segment
thermally connected with a hot end of the semiconductor cooling plate, and a second
pipe segment, which is located above the first pipe segment, and from whose one or
more portions extend one or more manifolds to radiate heat from the hot end of the
semiconductor cooling plate to an ambient environment.
[0008] Optionally, the first pipe segment of the main pipe is formed by extending from a
lower end of the main pipe vertically upwards by a predetermined length, and the first
pipe segments of multiple main pipes are located in the same plane in parallel and
with gaps therebetween, the plane being parallel with a rear wall of an inner tank
of the semiconductor refrigerator.
[0009] Optionally, the hot end heat radiating device further comprises: a fixed bottom plate
whose front surface is thermally connected with the hot end of the semiconductor cooling
plate and whose rear surface is provided with one or more grooves; and a fixed cover
plate whose front surface is provided with one or more grooves and which is configured
to cooperate with the fixed bottom plate to clamp the first pipe segment of the main
pipe between the grooves of the fixed cover plate and of the fixed bottom plate.
[0010] Optionally, the second pipe segment of the main pipe is formed by extending from
an upper end of the main pipe vertically downwards by a predetermined length, and
the second pipe segments of multiple main pipes are located in the same plane in parallel
and with gaps therebetween, the plane being parallel with the rear wall of the inner
tank of the semiconductor refrigerator; or the second pipe segment of the main pipe
is formed by extending from the upper end of the main pipe longitudinally forwards
by a predetermined length and then vertically downwards by a predetermined length,
the vertical portions of the second pipe segments of the multiple main pipes are located
in the same plane in parallel and with gaps therebetween, the plane being parallel
with the rear wall of the inner tank of the semiconductor refrigerator, and a starting
end of the manifold of the sintered heat pipe is located at the vertical portion of
a corresponding second pipe segment.
[0011] Optionally, the manifold of the sintered heat pipe is perpendicular to the rear wall
of the inner tank.
[0012] Optionally, the manifolds of each sintered heat pipe are located at the same side
of the corresponding main pipe, or the manifolds of each sintered heat pipe are located
at the opposite sides of the corresponding main pipe respectively.
[0013] Optionally, the hot end heat radiating device further comprises: one or two fin groups,
each fin group comprising multiple corresponding plate fins which are arranged in
parallel and with gaps therebetween, and each fin group being installed at a manifold
on a corresponding side of the main pipe via pipe holes of the respective plate fins.
[0014] Optionally, the hot end heat radiating device further comprises: a blower arranged
at a transverse side of or above the multiple manifolds and configured such that an
air inlet area of the blower sucks air flow and the air flow is blown to a gap between
each two adjacent plate fins, or the air flow is sucked from the gap between each
two adjacent plate fins and is then blown to the air inlet area.
[0015] Optionally, the middle portion of each plate fin is provided with a receiving through
hole so that each fin group defines a receiving space extending along the axes of
the receiving through holes; the hot end heat radiating device further comprises one
or two blowers respectively provided in the receiving spaces of the corresponding
fin groups and configured such that air flow is sucked from an air inlet area of each
blower and is blown to a gap between each two adjacent plate fins of the corresponding
fin group.
[0016] Optionally, the hot end heat radiating device further comprises: multiple spiral
fins each spirally installed on a corresponding manifold, and a blower arranged at
a transverse side of or above the multiple manifolds such that the manifolds of each
sintered heat pipe are located at an air inlet area or an air sucking area of the
blower.
[0017] In the semiconductor refrigerator of the present invention, as multiple manifolds
for radiating heat or transferring cold extend from the second pipe segment of the
main pipe of each sintered heat pipe, the heat radiating or cold transferring efficiency
of the semiconductor refrigerator is considerably improved, enabling the sintered
heat pipe to adapt to heat sources of a high heat flow density, such as semiconductor
cooling plates, for radiating heat, and enabling the semiconductor refrigerator of
the present invention to have higher energy efficiency.
[0018] The above and other objects, advantages and features of the present invention will
be understood by those skilled in the art more clearly with reference to the detailed
description of the embodiments of the present below with reference to the accompanied
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The followings will describe some embodiments of the present in detail in an exemplary
rather than restrictive manner with reference to the accompanying drawings. The same
reference signs in the drawings represent the same or similar parts. Those skilled
in the art shall understand that these drawings are only schematic ones of this invention,
and may not be necessarily drawn according to the scales. In the drawings:
Fig. 1 is a schematic right view of a semiconductor refrigerator according to an embodiment
of the present invention;
Fig. 2 is a schematic view of a sintered heat pipe of a semiconductor refrigerator
according to an embodiment of the present invention;
Fig. 3 is a schematic rear view of a semiconductor refrigerator according to an embodiment
of the present invention;
Fig. 4 is a schematic right view of a semiconductor refrigerator according to another
embodiment of the present invention;
Fig. 5 is a schematic right view of a semiconductor refrigerator according to yet
another embodiment of the present invention; and
Fig. 6 is a schematic left view of a semiconductor refrigerator according to an embodiment
of the present invention.
DETAILED DESCRIPTION
[0020] Fig. 1 is a schematic right view of a semiconductor refrigerator according to an
embodiment of the present invention. As shown in Figs. 1-3, an embodiment of the present
invention provides a semiconductor refrigerator. The semiconductor refrigerator typically
comprises an inner tank 100, a semiconductor cooling plate 150, a cold end cold transferring
device 180, a hot end heat radiating device and a housing. The semiconductor cooling
plate 150 may be installed between the rear walls of the inner tank 100 and of the
housing.
[0021] The cold end cold transferring device 180 is configured to transfer the cold from
the cold end of the semiconductor cooling plate 150 to a storage compartment in the
inner tank 100. For example, the cold end cold transferring device 180 may comprise
a cold transferring block, cold transferring fins and a cold transferring blower.
The rear surface of the cold transferring block is thermally connected to the cold
end of the semiconductor cooling plate 150. The front surface of the cold transferring
block is mounted with multiple cold transferring fins. The cold transferring fins
and the cold transferring blower are mounted in an air passage inside the semiconductor
refrigerator to transfer cold to the storage compartment.
[0022] The hot end heat radiating device is configured to radiate the heat from the hot
end of the semiconductor cooling plate 150 to ambient air. The hot end heat radiating
device may comprise multiple sintered heat pipes 200, each having a main pipe 210
with both ends closed. The main pipe 210 may comprise a first pipe segment 211 and
a second pipe segment 212 located above the first pipe segment 211. The first pipe
segment 211 is thermally connected with a hot end of the semiconductor cooling plate
150. Specifically, one or more manifolds 220 extend from one or more portions of the
second pipe segment 212 to radiate the heat from the hot end of the semiconductor
cooling plate 150 to an ambient environment, which considerably improves the heat
radiating efficiency of the semiconductor refrigerator.
[0023] The working chamber of the manifold 220 may communicate with the working chamber
of the corresponding main pipe 210 to facilitate steam flow in the sintered heat pipe
200. The liquid absorbing core in the manifold 220 may be connected with the liquid
absorbing core in the main pipe 210. The liquid absorbing cores in the manifold 220
and in the main pipe 210 closely contact the inner wall of the corresponding pipes
respectively to facilitate flow of the working liquid. Further, the diameter of the
manifold 220 may equal that of the main pipe 210. In some alternative embodiments
of the present invention, the diameter of the manifold 220 may be smaller than that
of the main pipe 210.
[0024] In some embodiments of the present invention, the first pipe segment 211 of the main
pipe 210 is formed by extending from a lower end of the main pipe 210 vertically upwards
by a predetermined length; and the first pipe segments 211 of multiple main pipes
210 are located in the same plane in parallel and with gaps therebetween, the plane
being parallel with the rear wall of an inner tank 100 of the semiconductor refrigerator.
[0025] To facilitate heat connection between the sintered heat pipe 200 and the semiconductor
cooling plate 150 and the fixing of the sintered heat pipe 200, the hot end heat radiating
device of the semiconductor cooling plate 150 further comprises a fixed bottom plate
310 and a fixed cover plate 320. The rear surface of the fixed bottom plate 310 is
provided with one or more grooves. The front surface of the fixed bottom plate 310
may be attached to the hot end of the semiconductor cooling plate 150 so as to be
thermally connected therewith, or may be thermally connected the hot end of the semiconductor
cooling plate 150 through a heat transferring block. The front surface of the fixed
cover plate 320 is also provided with one or more grooves, and the fixed cover plate
320 is configured to cooperate with the fixed bottom plate 310 to clamp the first
pipe segment 211 of the main pipe 210 between the grooves of the fixed cover plate
320 and of the fixed bottom plate 310. After clamping the sintered heat pipe 200 between
the fixed cover plate 320 and the fixed bottom plate 310, the three members are firmly
fixed together by welding or mechanical squeezing. To effectively transfer heat, usually
heat conducting silicone grease is coated on the contact surfaces between the sintered
heat pipe 200 and the fixed bottom plate 310/the fixed cover plate 320.
[0026] As shown in Fig. 2, the second pipe segment 212 of the main pipe 210 is formed by
extending from an upper end of the main pipe 210 longitudinally forwards by a predetermined
length and then vertically downwards by a predetermined length, and the vertical portions
2121 of the second pipe segments 212 of multiple main pipes 210 are located in the
same plane in parallel and with gaps therebetween, the plane being parallel with the
rear wall of the inner tank 100 of the semiconductor refrigerator. That is, the second
pipe segment 212 of multiple main pipe 210 may comprise the vertical portion 2121
whose lower end communicates with the corresponding first pipe segment 211 and a horizontal
portion 2122 which extends from the upper end of the vertical portion 2121 perpendicularly
to the vertical portion 2121 and whose tail end is closed. A starting end of the manifold
220 of the sintered heat pipe 200 is located at the vertical portion 2121 of a corresponding
second pipe segment 212. Preferably, the projection of the manifold 220 of each sintered
heat pipe 200 in a plane perpendicular to the corresponding vertical portion 2121
overlaps with the projection of the corresponding horizontal portion 2122 in the plane.
Or the manifolds 220 of each sintered heat pipe 200 are located at the same side of
the corresponding main pipe 210.
[0027] As shown in Fig. 3, the main pipe 210 may further include a connecting pipe segment
213 connected between the first and second pipe segments 211, 212 and arranged at
an angle of 100°-170° relative to the first pipe segment 211 and to the vertical portion
2121 of the second pipe segment 212 respectively. The hot end heat radiating device
of the embodiments of the present invention may comprise four sintered heat pipes
200. The main pipes 210 of the four sintered heat pipes 200 are arranged in the same
plane in symmetry with respect to a geometrical symmetry plane. The length of the
connecting pipe segment 213 of one sintered heat pipe 200 at one side of the geometrical
symmetry plane is smaller than that of the connecting pipe segment 213 of the other
sintered heat pipe 200 at the same side of the geometrical symmetry plane, so that
the four sintered heat pipes 200 are reasonably arranged. There may be one manifold
220 for each sintered heat pipes 200.
[0028] In the embodiments of the present invention, the manifold 220 of the sintered heat
pipe 200 is perpendicular to the rear wall of the inner tank 100. Further, the hot
end heat radiating device further comprises one fin group 400 comprising multiple
corresponding plate fins which are arranged in parallel and with gaps therebetween,
and the fin group 400 being installed at a manifold 220 on a corresponding side of
the main pipe 210 via pipe holes of the respective plate fins. The fin group 400 may
be installed at the horizontal portion 2122 of the second pipe segment 212 of the
main pipe 210 via the pipe holes of the respective plate fins. Preferably, the middle
portion of each plate fin is provided with a receiving through hole so that each fin
group 400 defines a receiving space extending along the axes of the receiving through
holes. The hot end heat radiating device further comprises a blower 500 provided in
the receiving space of the corresponding fin group 400 and configured such that air
flow is sucked from an air inlet area of the blower and is blown to a gap between
each two adjacent plate fins of the fin group 400. The blower 500 may be a centrifugal
blower. The rotary axis of the blades overlaps with the axis of the receiving through
hole, so that air flow is sucked from an axial direction of the centrifugal blower
and is blown to the gap between each two adjacent plate fins using a centrifugal force.
The plate fin may be rectangular.
[0029] Fig. 4 is a schematic right view of a semiconductor refrigerator according to another
embodiment of the present invention. In the embodiments of the present invention,
the second pipe segment 212 of the main pipe 210 is formed by extending from an upper
end of the main pipe 210 vertically downwards by a predetermined length, and the second
pipe segments 212 of multiple main pipes 210 are located in the same plane in parallel
and with gaps therebetween, the plane being parallel with the rear wall of the inner
tank 100 of the semiconductor refrigerator. The manifolds 220 of each sintered heat
pipe 200 are located at the opposite sides of the corresponding main pipe 210 respectively.
The hot end heat radiating device further comprises two fin groups 400 and a blower
500. Each fin group 400 comprises multiple corresponding plate fins which are arranged
in parallel and with gaps therebetween, and is installed at a manifold 220 on a corresponding
side of the main pipe 210 via pipe holes of the respective plate fins. The blower
500 may be arranged at a transverse side of or above the multiple manifolds 220 and
configured such that an air inlet area of the blower sucks air flow and the air flow
is blown to a gap between each two adjacent plate fins, or the air flow is sucked
from the gap between each two adjacent plate fins and is then blown to the air inlet
area. For example, the blower 500 is an axial flow blower fixed on top of the two
fin groups 400.
[0030] Fig. 5 is a schematic right view of a semiconductor refrigerator according to yet
another embodiment of the present invention. As shown in Figs. 5-6, the manifold 220
of the sintered heat pipe 200 is perpendicular to the rear wall of the inner tank
100. The manifolds 220 of each sintered heat pipe 200 are located at the same side
of the corresponding main pipe 210, or are located at the opposite sides of the corresponding
main pipe 210 respectively. The hot end heat radiating device further comprises: multiple
spiral fins 450 and a blower 500. Each of the multiple spiral fins 450 is spirally
installed on a corresponding manifold 220, and the blower 500 is arranged at a transverse
side of or above the multiple manifolds 220 such that the manifolds 220 of each sintered
heat pipe 200 are located at an air inlet area or an air sucking area of the blower
500. For example, the blower 500 may be an axial flow blower and may be located at
one side transverse to the multiple manifolds 220.
[0031] In the embodiments of the present invention, as the manifolds 220 of a sintered heat
pipe 200 are independent from those of the other sintered heat pipe 200, to avoid
deformation of the sintered heat pipes 200 and the spiral fins 450, or specifically
to avoid unnecessary deformation of the sintered heat pipes 200 and the spiral fins
450 due to transportation or installation so as to affect the performance of the hot
end heat radiating device, the hot end heat radiating device further comprises one
and/or two fastening members 600. The fastening member 600 may be fixed at an end
of the second pipe segment 212 of a corresponding main pipe 210 away from the corresponding
first pipe segment 211 along the length direction of the fastening member 600 at different
parts of the fastening member respectively. The other fastening member 600 may be
fixed at an end of the second pipe segment 212 of a corresponding main pipe 210 close
to the corresponding first pipe segment 211 along the length direction of the fastening
member 600 at different parts of the fastening member respectively. For example, the
fastening member 600 may be a fastening steel bar, a fastening steel wire, a fastening
tube or the like.
[0032] Although multiple embodiments of this invention have been illustrated and described
in detail, those skilled in the art may make various modifications and variations
to the present invention based on the content disclosed by the present invention or
the content derived therefrom without departing from the spirit and scope of the present
invention. Thus, the scope of the present invention should be understood and deemed
to include these and other modifications and variations.
1. A semiconductor refrigerator, comprising a semiconductor cooling plate and a hot end
heat radiating device,
wherein the hot end heat radiating device comprises multiple sintered heat pipes,
each having a main pipe with both ends closed,
wherein the main pipe comprises a first pipe segment thermally connected with a hot
end of the semiconductor cooling plate, and a second pipe segment, which is located
above the first pipe segment, and from whose one or more portions extend one or more
manifolds to radiate heat from the hot end of the semiconductor cooling plate to an
ambient environment.
2. The semiconductor refrigerator of claim 1, wherein the first pipe segment of the main
pipe is formed by extending from a lower end of the main pipe vertically upwards by
a predetermined length, and
the first pipe segments of multiple main pipes are located in the same plane in parallel
and with gaps therebetween, the plane being parallel with a rear wall of an inner
tank of the semiconductor refrigerator.
3. The semiconductor refrigerator of claim 1, wherein the hot end heat radiating device
further comprises:
a fixed bottom plate whose front surface is thermally connected with the hot end of
the semiconductor cooling plate and whose rear surface is provided with one or more
grooves; and
a fixed cover plate whose front surface is provided with one or more grooves and which
is configured to cooperate with the fixed bottom plate to clamp the first pipe segment
of the main pipe between the grooves of the fixed cover plate and of the fixed bottom
plate.
4. The semiconductor refrigerator of claim 1, wherein the second pipe segment of the
main pipe is formed by extending from an upper end of the main pipe vertically downwards
by a predetermined length, and the second pipe segments of multiple main pipes are
located in the same plane in parallel and with gaps therebetween, the plane being
parallel with the rear wall of the inner tank of the semiconductor refrigerator; or
the second pipe segment of the main pipe is formed by extending from the upper end
of the main pipe longitudinally forwards by a predetermined length and then vertically
downwards by a predetermined length, the vertical portions of the second pipe segments
of the multiple main pipes are located in the same plane in parallel and with gaps
therebetween, the plane being parallel with the rear wall of the inner tank of the
semiconductor refrigerator, and a starting end of the manifold of the sintered heat
pipe is located at the vertical portion of a corresponding second pipe segment.
5. The semiconductor refrigerator of claim 1, wherein the manifold of the sintered heat
pipe is perpendicular to the rear wall of the inner tank.
6. The semiconductor refrigerator of claim 1, wherein the manifolds of each sintered
heat pipe are located at the same side of the corresponding main pipe, or are located
at the opposite sides of the corresponding main pipe respectively.
7. The semiconductor refrigerator of claim 6, wherein the hot end heat radiating device
further comprises: one or two fin groups, each fin group comprising multiple corresponding
plate fins which are arranged in parallel and with gaps therebetween, and each fin
group being installed at a manifold on a corresponding side of the main pipe via pipe
holes of the respective plate fins.
8. The semiconductor refrigerator of claim 7, wherein the hot end heat radiating device
further comprises: a blower arranged at a transverse side of or above the multiple
manifolds and configured such that an air inlet area of the blower sucks air flow
and the air flow is blown to a gap between each two adjacent plate fins, or the air
flow is sucked from the gap between each two adjacent plate fins and is then blown
to the air inlet area.
9. The semiconductor refrigerator of claim 7, wherein the middle portion of each plate
fin is provided with a receiving through hole so that each fin group defines a receiving
space extending along the axes of the receiving through holes; and
the hot end heat radiating device further comprises one or two blowers respectively
provided in the receiving spaces of the corresponding fin groups and configured such
that air flow is sucked from an air inlet area of each blower and is blown to a gap
between each two adjacent plate fins of the corresponding fin group.
10. The semiconductor refrigerator of claim 5, wherein the hot end heat radiating device
further comprises: multiple spiral fins each spirally installed on a corresponding
manifold, and a blower arranged at a transverse side of or above the multiple manifolds
such that the manifolds of each sintered heat pipe are located at an air inlet area
or an air sucking area of the blower.