A MANUFACTURING PROCESS FOR A LAMINATED PAPER PRODUCT

Abstract

 A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) comprises:
- printing and cutting a first paper (351, 451), planar electronics (352, 452) and second paper (353, 453);
- applying hot melt glue to the first paper (351, 451) before or after the printing and cutting;
- feeding the first paper (351, 451) to first split planes (421, 422), positioned along conical sidewalls (411, 412) at a first height and moving the first paper (351, 451) forward against a vertical finger (401) being sized and positioned to translationally move in between the first split planes (421, 422);
- feeding the planar electronics (352, 452) onto second split planes (431, 432) positioned along the sidewalls (411, 412) at a second height, and moving the first paper (351, 451) and planar electronics (352, 452) forward against the vertical finger (401);
- feeding the second paper (353, 453) onto third split planes (441, 442) positioned along the sidewalls (411, 412) at a third height, and moving the first paper (351, 451), planar electronics (352, 452) and second paper (353, 453) forward against the vertical finger (401) ;
- applying heat and pressure to the first paper (351, 451), planar electronics (352, 452) and second paper (353, 453) to activate the hot melt glue.

Description

Field of the Invention

[0001] The present invention generally relates to the manufacturing of a laminated paper product with integrated electronics. More particularly, the present invention concerns an improved process for integrating electronics like for instance Near Field Communication (NFC) chips, Radio Frequency Identification (RFID) tags, Light Emitting Diodes (LEDs), sensors, displays, etc., in paper products like cards, boxes, etc., while maintaining the traditional properties of such paper products.

Background of the Invention

[0002] When integrating electronics in paper products like cards, there is a general desire to maintain the properties of a traditional paper card: the card with integrated electronics must be planar with a homogeneous thickness below 600 micron, preferably below 500 micron, and the surface must be printable with high quality images.

[0003] Integrated circuits on silicon substrate are integrated in various objects for a long time. For instance, traditional NFC chips made on silicon substrate are integrated in plastic cards, in clothes, etc. Integrated circuits on silicon substrate however have a typical thickness of several hundred micron and form a three-dimensional structure when integrated in cards. Such three-dimensional ICs integrated in cards are for instance known from German patent application DE19623625A1 entitled "Lotterielos" where thicknesses up to 1 mm are mentioned for lottery cards coated with protective plastic, having the size of a credit card. Traditional ICs however are not suitable for integration in paper or cardboard products like cards or folded cardboard boxes that require flatness.

[0004] The desire to produce paper cards with integrated electronics and uniform thickness has been expressed in several prior art documents. United States Patent Application US2010/0113118A1 entitled "RFID-incorporated Game Card and Manufacturing Method Thereof" for instance describes a manufacturing method for a game card with integrated RFID tag and appropriate uniform thickness. The uniform thickness is achieved by one or more intermediate layer(s) with cut-outs to position and integrate the RFID tag. The intermediate layer(s) must have a joint thickness that corresponds with the thickness of the RFID tag to realize the uniform thickness of the card. Similar solutions with intermediate layers and cut-outs to position/integrate electronics are described in Japanese Patent Application JP2005334532A2 entitled "Card, Card Reader, and Card Reading Method", and in United States Patent Application US2006/0219797A1 entitled "Game Card".

[0005] Technologies exist to produce integrated circuits on thin substrate: metal oxide ICs or so called planar ICs. Methods to integrate such metal oxide ICs in cards however have not been described so far. Although German Utility Model DE20017736U1 describes a paper card with typical thickness of 200-600 micron with integrated planar electronics that have a thickness of 10 micron, this utility method fails to explain how such card should be manufactured.

[0006] An apparent straightforward technique to integrate metal oxide ICs in cards seems to lie in a roll-to-roll process. A first roll would contain the planar electronics. A second roll would contain printed paper. Both rolls are brought together on a roll-to-roll machine that sticks the electronics to the printed paper. Tests with such roll-to-roll processes however have demonstrated that their alignment precision and cutting precision are insufficient to produce high quality paper cards.

[0007] Further drawbacks of a traditional roll-to-roll process, i.e. sheet curl and rippled edges, are recognized in United States Patent Application US2005/0257880A1 entitled "Process of Making Laminated Sheet and Product Made by the Process". US2005/0257880A1 describes a production process for laminated cards that solves these problems of traditional roll-to-roll laminating. A roll or film is unrolled through a coating station where the film is coated for instance with hot melt adhesive. Thereafter, the coated film passes around a heated drum in an oven. For alignment purposes, the film is registered and then sync fed with a sheet to a lamination dip to be laminated.

[0008] United States Patent Application US2008/0135158A1 entitled "Method for Bonding Together At Least Two Sheets" describes an alternate manufacturing process for a laminated paper product (puzzle, game board) consisting of plural layers. A first sheet is coated with a hot melt glue in a gluing station. In an aligning station, the first sheet provided with glue is aligned with a second sheet. Thereafter, the first sheet and second sheet are pressed together to reactivate the hot melt glue and form laminated sheets. Individual paper products, i.e. puzzle pieces in US2008/0135158A1, are thereafter stamped out of the laminated sheets in a single step on a stamping machine.

[0009] US2008/0135158A1 describes a third layer but does not teach that the third layer can be planar electronics. Further, if the process known from US2008/0135158A1 would be applied to produce cards with integrated electronics instead of puzzle pieces, the cards would have to be stamped out of a sheet after lamination with risk for damaging the electronics.

Summary of the Invention

[0010] It is an objective of the present invention to disclose a manufacturing process for laminated paper products with integrated electronics that overcomes one or several of the above mentioned shortcomings of existing solutions. More precisely, it is an objective to disclose a manufacturing process for laminated paper products with integrated electronics that maintains the tactile properties of traditional thin paper products like cards, i.e. a homogeneous thickness below 600 micron, preferably below 500 micron, which scores better in terms of alignment and cutting precision of the laminated layers to the benefit of the overall quality of the paper product.

[0011] According to the present invention, the above defined objective is achieved by the manufacturing process for a laminated paper product with integrated electronics defined by claim 1, the manufacturing process comprising the steps of:

• printing and cutting a first paper;
• applying hot melt glue on the first paper before or after the printing and cutting;
• cutting planar electronics;
• printing and cutting a second paper;
• feeding the first paper to first split planes positioned substantially horizontal at a first height in between two conical sidewalls and moving the first paper forward against a vertical finger being sized and positioned to translationally move in between the first split planes;
• feeding the planar electronics onto second split planes positioned substantially horizontal along the sidewalls at a second height, the vertical finger being sized and positioned to move between the second split planes thereby aligning the first paper and planar electronics;
• feeding the second paper onto third split planes positioned substantially horizontal along the sidewalls at a third height , the vertical finger being sized and positioned to move between the third split planes thereby aligning the first paper, planar electronics and second paper;
• applying heat and pressure to the first paper, planar electronics and second paper to thereby activate the hot melt glue and obtain the laminated paper product.

[0012] Thus, the paper card or paper product with integrated electronics produced according to the present invention consists of a laminated structure with three layers: a first pre-printed paper layer, a planar IC layer, e.g. a metal oxide IC on thin plastic substrate, and a second pre-printed paper layer. The three layers are aligned and laminated to form a planar structure with thickness of at most 600 micron, preferably at most 500 micron.

[0013] In initial steps of the manufacturing process to integrate planar ICs in paper cards according to the invention, the first paper and second paper are printed with the desired images and cut first to avoid damaging the expensive middle layer with planar IC. The first paper and possibly also the second paper receive hot melt glue before or after the printing and cutting. This glue will only become active when applying heat and/or pressure at the end of the manufacturing process. The three layers, i.e. first paper, planar IC, and second paper, become accurately aligned as follows. The first paper is held at a first height by two horizontal, split planes that are connected to respective vertical, slightly conical sidewalls, and the first paper is moved forward between the conical sidewalls by a vertical finger translationally moving between the split planes. The vertical finger may for instance be chain driven to make the translational movement. The planar IC is held at a second height by two additional horizontal, split planes that are connected to the respective conical sidewalls and that are spaced apart to enable the vertical finger to pass in between. The second paper is held at a third height by two further horizontal, split planes that are also connected to the respective conical sidewalls and that are also spaced apart to enable the vertical finger to pass in between. The vertical finger shall for instance move the first paper forward, thereafter also move the planar IC forward, and at last also move the second paper forward, although embodiments of the invention could be conceived wherein the order of movement is different. In length direction, the three layers are aligned against the vertical finger. In width direction, the three layers become aligned by the vertical, slightly conical sidewalls. The horizontal planes holding the planar IC and second paper preferably slowly decrease in height towards the horizontal planes holding the first paper such that the three layers are brought together with minimal fall. The three layers are laminated by reactivating the glue through heat and pressure applied by a heated roll system.

[0014] Through the manufacturing process according to the present invention, a planar two-dimensional paper card with homogeneous thickness below 600 micron, preferably below 500 micron is produced with very precise alignment of the two paper layers and thin middle layer with planar electronics. The risk for damaging the electronics is minimized through the print and cut first, assemble later concept. The manufacturing process according to the present invention further brings the ability to check the quality of electronics and remove bad electronics at two points in the process, i.e. before feeding the planar electronics into the alignment system and after laminating the three layers. The expensive lamination process is applied as a last step. No cutting or printing of cards must be done afterwards further reducing the risk for damaging the integrated electronics and consequently improving the overall quality of the produced paper products with integrated electronics.

[0015] Embodiments of the manufacturing process for a laminated paper product with integrated electronics according the present invention, defined by claim 2, further comprise:

• curing the hot melt glue through passive cooling.

[0016] Indeed, the three layers are laminated by reactivating the glue through heat and pressure applied by a heated roll system. The temperature of this heated roll system is preferably kept below 120 °C to avoid damaging the ink printed on the paper and the electronics of the planar IC layer. The glue is cured thereafter through passive cooling.

[0017] Embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 3, further comprise:

• trimming edges of the laminated paper product.

[0018] Indeed, optionally, the edges of paper cards produced through the method according to the invention are trimmed with a cutter after the lamination process when the card edges are too rough.

[0019] Embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 4, further comprise:

• detecting an image printed on the laminated paper product through camera inspection;
• detecting a code stored in the planar electronics through a radio frequency (RF) reading process or capacitive reading process;
• verifying in a database if the code and image match with each other; and
• rejecting the laminated paper product in case the code and image do not match with each other.

[0020] This way, a quality control is executed on the produced paper products. A camera system positioned after the heated roll system or possibly after the edge trimming facility, can be configured with software to detect and recognize an image printed on the paper product. An RF reader or alternatively a capacitive reader may in parallel read-out a code stored in the planar electronics that are integrated in the paper product. In case codes are linked to images, e.g. in a database where images are uniquely linked to respective codes, the output of the camera system and output of the RF/capacitive reader can be compared with the content of such database to verify if the correct code has been stored in the paper product. In case there is no correspondence between code and image, the paper product is considered a bad delivery of the manufacturing process. In such case, the bad paper product is rejected. The paper product may then be repaired, e.g. by storing an appropriate code in the electronics or the paper product may be destroyed. In case of correspondence between the code and image, the paper product is considered to be a good delivery that passes the quality test successfully.

[0021] Embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 5, further comprise:

• detecting an image printed on the paper product through camera inspection;
• selecting from a database a code matching with the image; and
• storing the code in the planar electronics through a radio frequency (RF) writing process or laser writing process or capacitive writing process.

[0022] This way, an appropriate code can be stored in the electronics integrated in a paper product. The paper product, e.g. a specific game card, is identified through a camera system that detects and recognizes an image that is printed on the paper product. In the assumption that the image printed on the paper product is uniquely linked to the code that is stored in the paper product's electronics, the detected image is used to select a code from a database linking images to codes. The selected code is then stored in the electronics integrated in the paper product through wireless storage technology. An advantage of such automated selection and storage of codes in cards is that no electronics preconfigured with a certain code can get integrated erroneously in a paper product with non-corresponding image. The amount of bad deliveries hence is decreased, which further improves the overall production quality.

[0023] In embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 6, the first paper and the second paper each have a maximum thickness of 250 micron, preferably maximum 200 micron, and the planar electronics have a maximum thickness of 100 micron.

[0024] In embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 7, the heat is limited to temperatures below 120 °C.

[0025] Indeed, the three layers are laminated by reactivating the glue through heat and pressure applied by a heated roll system. To further improve the quality of the production process, the temperature of this heated roll system is preferably kept below 120 °C to avoid damaging the ink printed on the paper and the electronics of the planar IC layer.

[0026] Embodiments of the manufacturing process for a laminated paper product with integrated electronics according to the present invention, defined by claim 8, further comprise:

• detecting a code stored in the planar electronics through a radio frequency (RF) reading process or capacitive reading process, or storing a code in the planar electronics through a radio frequency (RF) writing process or laser writing process or capacitive writing process before feeding the planar electronics onto the second split planes.

[0027] This way, a quality check is performed prior to the planar electronics being fed to the alignment system. A code preconfigured in the planar electronics is read therefrom through a wireless read process. In case the code cannot be read, for instance because the planar electronics are not working properly - it is known that approximately 2 % of planar electronics does not function well, or they may for example have been damaged through the cut process - such defect electronics can be destroyed at the entrance of the manufacturing process. Consequently, the production efficiency is improved as waste as a result of bad deliveries outputted by the manufacturing process is reduced, and the capacity and time of the production facility is used to produce a higher ratio of paper products with proper working integrated planar electronics.

[0028] In addition to a manufacturing process as defined by claim 1, the present invention also relates to a corresponding arrangement adapted to align a first paper, planar electronics, and a second paper that form layers of a laminated paper product, the arrangement being defined by claim 9, comprising:

• first split planes positioned substantially horizontal at a first height in between two conical sidewalls to receive the first paper;
• second split planes positioned substantially horizontal along the sidewalls at a second height to receive the planar electronics;
• third split planes positioned substantially horizontal along the sidewalls at a third height to receive the second paper; and
• a vertical finger with drive mechanism, the vertical finger being sized and positioned to translationally move in between the first split planes, in between the second split planes, and in between the third split planes to thereby align the first paper, planar electronics and second paper.

[0029] In addition to a manufacturing process as defined by claim 1 and an alignment arrangement as defined by claim 9, the present invention also relates to a corresponding laminated paper product with integrated electronics as defined by claim 10, the laminated paper product consisting of:

• a first paper layer with pre-printed bottom surface having a thickness below 250 micron, preferably below 200 micron;
• a planar electronics layer on top of and aligned with the first paper layer having a thickness below 100 micron; and
• a second paper layer, on top of and aligned with the first paper layer and the planar electronics layer, the second paper layer having a thickness below 250 micron, preferably below 200 micron.

Brief Description of the Drawings

[0030] 

Fig. 1 is a schematic drawing comparing existing three-dimensional electronics 101 with planar, two-dimensional electronics 102;

Fig. 2 illustrates the integration of planar electronics 202 in a laminated paper product according to the present invention;

Fig. 3 illustrates an embodiment 300 of the manufacturing process for a laminated paper product with integrated electronics according to the present invention;

Fig. 4A, 4B, 4C and 4D are three-dimensional views illustrating in more detail subsequent steps in the alignment of the different layers 451, 452 and 453 of a single laminated paper card with integrated electronics, manufactured according to the present invention;

Fig. 5A, 5C and 5E are top views illustrating respectively the steps in the alignment of the layers 451, 452 and 453 also drawn in Fig. 4B, 4C and 4D;

Fig. 5B, 5D and 5F are front views illustrating respectively the steps in the alignment of the layers 451, 452 and 453 also drawn in Fig. 4B, 4C and 4D;

Fig. 6A illustrates the arrangement for alignment of the layers of laminated paper products used in embodiments of the manufacturing process according to the present invention, before operation; and

Fig. 6B illustrates the arrangement for alignment of the layers of laminated paper products used in embodiments of the manufacturing process according to the present invention, in operation.

Detailed Description of Embodiment(s)

[0031] Fig. 1 illustrates the difference between existing electronics 101 on silicon substrate and planar electronics 102 on thin substrate, e.g. metal oxide ICs. Electronics 101 on silicon substrate have a typical thickness of 500 micron or higher and when integrated in cards or objects, result in three-dimensional structures, i.e. structures that have lost the tactile aspects of traditional paper cards, e.g. game cards or collector cards. Planar electronics 102 on thin substrate have a typical thickness below 100 micron. The integration thereof in laminated paper products such as paper cards has posed problems so far, in particular with respect to alignment and cutting precision of the different layers.

[0032] Fig. 2 schematically shows a laminated paper product according to the present invention. Such laminated product consists of 3 layers: a first, pre-cut and pre-printed paper layer 201 having a thickness of at most 250 micron, preferably at most 200 micron, a pre-cut planar electronics layer 202 having a thickness of at most 100 micron, and a second, pre-cut and pre-printed paper layer 203 having a thickness of at most 250 micron, preferably at most 200 micron. The three layers 201, 202 and 203 are aligned with high precision. Preferably, quality checks are done to guarantee proper operation of the integrated planar electronics 202. The overall laminated paper product has a uniform thickness of at most 600 micron, preferably at most 500 micron, enabling to maintain the tactile properties of existing paper cards that have no electronics integrated.

[0033] Fig. 3 shows an embodiment of a system 300 that enables to manufacture laminated paper cards 356, 357, 358 in accordance with the present invention. The first paper 331 is cut first in the size of the paper card to be produced, its bottom side is pre-printed with an image. The first paper 331 receives hot melt glue that will only become active when applying heat and/or pressure. The hot melt glue may be provided before or after the printing and cutting and is therefore not drawn in Fig. 3. The cut and printed first papers 331 foreseen with hot melt glue are stacked in a first feeder 341. This first feeder 341 feeds the first papers 351 one by one at a regular pace to an alignment arrangement 301 that will be described in more detail further below with reference to Fig. 4A-4D. The planar electronics 342 to be integrated in the paper cards are pre-cut in the size of the paper card to be produced from a roll 332. The planar electronics 342 thereupon may be submitted to quality inspection not drawn in Fig. 3. A wireless read facility, e.g. an RF reader or capacitive reader, may read out a code stored in the planar electronics to verify proper working of these electronics. Planar electronics that are not properly working this way can be rejected early in the manufacturing process, i.e. before being integrated in malfunctioning paper cards. Just like the first papers 351, the planar electronics 352 are supplied one by one at a regular pace to the alignment arrangement 301 where each layer of planar electronics 352 is aligned with a first paper layer 351. A second paper layer 333 is also cut first in the size of the paper card to be produced, and its top side is pre-printed with an image. The second paper 333 optionally may receive hot melt glue before or after the printing and cutting, and becomes stacked in a second feeder 343. This second feeder feeds the second papers 353 one by one at a regular pace to the alignment arrangement 301 where each second paper layer 353 is aligned with a layer of planar electronics 352 and a first paper layer 351 to jointly form a stack of three aligned layers 354. The stack of three aligned layers 354 subsequently is pre-heated through pre-heating elements 302. It is noticed that the pre-heating is an optional step that may or may not be executed in different embodiments of the method according to the invention. A heated roll 303 thereafter applies heat and pressure to the three aligned layers 354 thereby reactivating the hot melt glue. The temperature of this heated roll system 303 is kept below 120 °C to avoid damaging the ink printed on the bottom surface of the first paper 351, the ink printed on the top surface of the second paper 353, and the electronics that form part of the planar in-between layer 352. The glue of so produced laminated paper card 355 is cured through a passive cooling facility 304 before being supplied to a conveyor belt 305. The laminated paper card now passes through an optional trimming facility 306 that trims the edges of the laminated paper cards before submitting the cards to quality checks. To verify the quality of the produced cards 356, 357, 358, a camera system 307 may for instance visually inspect the image printed on each card, and a wireless reader 308, e.g. an RF reader or capacitive reader, may read a code stored in the integrated electronics of each card. A database wherein images and codes are uniquely linked to each other may then be consulted to verify if the image printed on a card 356 and the code stored in the card 356 are linked with each other. If this is not the case, the produced card 356 is considered a bad delivery and will be rejected. In case the printed image and stored code match with each other, the card is considered a good delivery. Alternatively, facility 308 may implement wireless writing, e.g. RF writing, laser wring or capacitive writing. The printed image on a card 356, scanned by camera system 307, may then be used to select from a database the linked code, and this code may be written in the integrated electronics of card 356 by the wireless writing facility 308. Obviously, also a combination of wireless reading and wireless writing may be implemented in facility 308, such that the reader can verify if a code stored in the card's electronics match with the printed image, and the writer may write the proper code in the electronics in case a wrong code is detected or no code is detected at all by the reader. It is further noticed that in case no unique link exists between printed image and stored code, alternative quality checks may be implemented to verify proper integration and functioning of the planar electronics in the cards thereby enabling rejection of bad deliveries.

[0034] Fig. 4A-4D (3 dimensional views) and Fig. 5A-5F (top views and front views) illustrate in more detail the alignment of the first paper layer 351 or 451, the planar electronics 352 or 452, and the second paper layer 353 or 453 that jointly form the layers of the laminated paper card produced according to the process illustrated by Fig. 3. The alignment arrangement 400 drawn in Fig. 4A has first, horizontal split planes 421, 422 to receive the first paper 451 from the first paper feeder 341, second horizontal split planes 431, 432 to receive the planar electronics 452, and third horizontal split planes 441, 442 to receive the second paper 453 from the second feeder 343. The first horizontal planes 421, 422 are positioned at a first height between two vertical sidewalls 411, 412. These sidewalls are slightly conically shaped as a result of which the space between these sidewalls becomes narrower from left to right in Fig. 4A. The first horizontal split planes 421, 422 are made out of a material and provided with a surface roughness that enables to keep paper at its position when no force is applied and enables to slide paper smoothly along its surface when force is applied by a vertical finger 401 moving in between the split planes 421, 422. The second horizontal split planes 431, 432 are positioned at a second height between the two vertical sidewalls 411,412, the second height being a distance above the first split planes 421, 422 at least sufficient to enable a paper that is sliding along the first split planes 421, 422 to pass underneath the second split planes 431, 432 without touching them. The front edge 433, 434 of the second split planes 431, 432 is dislocated with respect to the front edge 423, 424 of the first split planes 421, 422 over a distance sufficient to enable the feeder 341 to feed the first paper 451 directly onto the first split planes 421,422. The front edge 433,434 of the second split planes 431,432 preferably are slightly bend upwards to help the first paper 451 to pass underneath the second split planes 431, 432 and avoid that the first paper 451 gets stuck against this front edge 433, 434. The second horizontal split planes 431, 432 are made out of a material and provided with a surface roughness that enables to keep the substrate material of the planar electronics at its position when no force is applied and enables to slide the substrate material of the planar electronics 452 smoothly along its surface when force is applied by a vertical finger 401 moving in between the split planes 431, 432.The third horizontal split planes 441,442 are positioned at a third height between the two vertical sidewalls 411,412, the third height being a distance above the second split planes 431, 432 at least sufficient to enable the planar electronics layer 452 that is sliding along the second split planes 431, 432 to pass underneath the third split planes 441, 442 without touching them. The front edge 443, 444 of the third split planes 441, 442 is dislocated with respect to the front edge 433, 434 of the second split planes 431, 432 over a distance sufficient to enable to feed the planar electronics 452 directly onto the second split planes 431, 432. The front edge 443, 444 of the third split planes 441, 442 preferably is slightly bend upwards to help the planar electronics 452 to pass underneath the third split planes 441, 442 and avoid that the planar electronics 452 get stuck against this front edge 443, 444. The third horizontal split planes 441, 442 are made out of a material and provided with a surface roughness that enables to keep paper at its position when no force is applied and enables to slide paper smoothly along its surface when force is applied by a vertical finger 401 moving in between the split planes 441, 442. The vertical finger 401 is driven to move from left to right in Fig. 4A in between the first split planes 421, 422, in between the second split planes 431, 432 and in between the third split planes 441,442. The vertical finger 401 is sufficiently high to reach out above the third height of the third horizontal planes 441, 442 and thus will move objects fed onto the first split planes 421, 422, the second split planes 431, 432 and the third split planes 441, 442 forward, and align them in length direction against the vertical finger 401. As is illustrated by Fig. 4B (3 dimensional view), Fig. 5A (top view) and Fig. 5B (front view), the vertical finger 401 in a first step moves the first paper 451 forward along the first split planes 421, 422. This way the first paper 451 gets aligned in length direction against the vertical finger 401. As is further illustrated by Fig. 4C (3 dimensional view), Fig. 5C (top view) and Fig. 5D (front view), the vertical finger 401 in a second step moves the first paper 451 forward along the first split planes 421, 422 and moves the planar electronics 452 forward along the second split planes 431, 432. This way the first paper 451 and planar electronics 452 get aligned in length direction against the vertical finger 401. As is further illustrated by Fig. 4D (3 dimensional view), Fig. 5E (top view) and Fig. 5F (front view), the vertical finger 401 in a third step moves the first paper 451 forward along the first split planes 421, 422, moves the planar electronics forward along the second split planes 431, 432 and moves the second paper 453 forward along the third split planes 441, 442. This way the first paper 451, planar electronics 452 and second paper 453 get aligned in length direction against the vertical finger 401. In width direction, the first paper 451, planar electronics 452 and second paper 453 get aligned against the vertical sidewalls 411, 412 as a result of the conical shape of these sidewalls 411, 412. As a consequence, the three layers 451, 452 and 453 are aligned precisely both in length direction and in width direction when they leave the alignment facility 400. Preferably, the second split planes 431,432 and the third split planes 441,442 near the end of the alignment facility 400 slightly bend downward to bring the three layers 451, 452, 453 closer together and avoid or minimize a fall of the planar electronics 452 and second paper 453 on the first paper 451.

[0035] Whereas Fig. 4A-4D and Fig. 5A-5F illustrate the operation of the alignment facility 400 for the production of a single laminated paper card, Fig. 6A and Fig. 6B illustrate the operation of a similar alignment facility during mass production of laminated paper cards. Fig. 6A shows a top view of the alignment facility 600 and three intersectional views at three intersection points. The alignment facility 600 comprises first horizontal split planes 621, 622 at a first height, second horizontal split planes 631, 632 at a second height, and third horizontal split planes 641, 642 at a third height. The horizontal split planes 621, 622, 631, 632, 641, 642 are mounted against vertical walls 411, 412 that are conically shaped, such that planes 621, 631 and 641 are mounted at respective first, second and third heights against sidewall 611 and planes 622, 632 and 642 are mounted at the respective same first, second and third heights against sidewall 612. Fig. 6A further shows vertical fingers 601, 602, 603 and 604 positioned at regular distance from each other on a mechanism that drives these vertical fingers to move forward, e.g. a chain drive mechanism that is located underneath the first split planes 621, 622 and not drawn in any of the figures. Fig. 6B shows the same alignment facility 600 during mass production. Fig. 6B therefore shows a second paper 651 that is aligned with planar electronics and a first paper against a first vertical finger 601, another second paper 652 that is lying still on the third split planes 641, 642 waiting to become aligned with planar electronics 655 and first paper 656 against a second vertical finger 602, planar electronics 653 lying still on the second split planes 631, 632 waiting to become aligned with first paper 657 against a third vertical finger 603, and a first paper 654 aligned and moving forward against a fourth vertical finger 604. The alignment facility 600 hence is synchronously handling the layers of multiple laminated paper cards and is therefore very suitable for mass production of such laminated paper cards.

[0036] Although the present invention has been illustrated by reference to specific embodiments, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied with various changes and modifications without departing from the scope thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. In other words, it is contemplated to cover any and all modifications, variations or equivalents that fall within the scope of the basic underlying principles and whose essential attributes are claimed in this patent application. It will furthermore be understood by the reader of this patent application that the words "comprising" or "comprise" do not exclude other elements or steps, that the words "a" or "an" do not exclude a plurality, and that a single element, such as a computer system, a processor, or another integrated unit may fulfil the functions of several means recited in the claims. Any reference signs in the claims shall not be construed as limiting the respective claims concerned. The terms "first", "second", third", "a", "b", "c", and the like, when used in the description or in the claims are introduced to distinguish between similar elements or steps and are not necessarily describing a sequential or chronological order. Similarly, the terms "top", "bottom", "over", "under", and the like are introduced for descriptive purposes and not necessarily to denote relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances and embodiments of the invention are capable of operating according to the present invention in other sequences, or in orientations different from the one(s) described or illustrated above.

Claims

1. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) comprising the steps of:

- printing and cutting a first paper (351, 451);

- applying hot melt glue on said first paper (351, 451) before or after said printing and cutting;

- cutting planar electronics (352, 452);

- printing and cutting a second paper (353, 453);

- feeding said first paper (351, 451) to first split planes (421, 422) positioned substantially horizontal at a first height in between two conical sidewalls (411,412) and moving said first paper (351, 451) forward against a vertical finger (401) being sized and positioned to translationally move in between said first split planes (421, 422);

- feeding said planar electronics (352, 452) onto second split planes (431, 432) positioned substantially horizontal along said sidewalls (411, 412) at a second height, said vertical finger (401) being sized and positioned to move between said second split planes (431, 432) thereby aligning said first paper (351, 451) and planar electronics (352, 452);

- feeding said second paper (353, 453) onto third split planes (441, 442) positioned substantially horizontal along said sidewalls (411,412) at a third height, said vertical finger (401) being sized and positioned to move between said third split planes (441, 442) thereby aligning said first paper (351, 451), planar electronics (352, 452) and second paper (353, 453);

- applying heat and pressure to said first paper (351, 451), planar electronics (352, 452) and second paper (353, 453) to thereby activate said hot melt glue and obtain said laminated paper product (356, 357, 358).

2. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to claim 1, further comprising:

- curing said hot melt glue through passive cooling (304).

3. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, further comprising:

- trimming (306) edges of said laminated paper product.

4. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, further comprising:

- detecting an image printed on said laminated paper product through camera inspection (307);

- detecting a code stored in said planar electronics (352, 452) through a radio frequency (RF) reading process (308) or capacitive reading process;

- verifying in a database if said code and image match with each other; and

- rejecting said laminated paper product in case said code and said image do not match with each other.

5. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, further comprising:

- detecting an image printed on said paper product through camera inspection (307);

- selecting from a database a code matching with said image; and

- storing said code in said planar electronics (352) through a radio frequency (RF) writing process (308) or laser writing process or capacitive writing process.

6. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, wherein said first paper (351, 451) and said second paper (353, 453) each have a maximum thickness of 250 micron, preferably maximum 200 micron, and said planar electronics (352, 452) have a maximum thickness of 100 micron.

7. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, wherein said heat is limited to temperatures below 120 °C.

8. A manufacturing process for a laminated paper product (356, 357, 358) with integrated electronics (352, 452) according to one of the preceding claims, further comprising:

- detecting a code stored in said planar electronics through a radio frequency (RF) reading process or capacitive reading process, or storing a code in said planar electronics through a radio frequency (RF) writing process or laser writing process or capacitive writing process, before feeding said planar electronics (352, 452) onto said second split planes (431, 432).

9. An arrangement (400) adapted to align a first paper (351, 451), planar electronics (352, 452), and a second paper (353, 453) that form layers of a laminated paper product (356, 357, 358), said arrangement (400) comprising:

- first split planes (421, 422) positioned substantially horizontal at a first height in between two conical sidewalls (411, 412) to receive said first paper (351, 451);

- second split planes (431, 432) positioned substantially horizontal along said sidewalls (411, 412) at a second height to receive said planar electronics (352, 452);

- third split planes (441, 442) positioned substantially horizontal along said sidewalls (411, 412) at a third height to receive said second paper (353, 453); and

- a vertical finger (401) with drive mechanism, said vertical finger (401) being sized and positioned to translationally move in between said first split planes (421, 422), in between said second split planes (431, 432), and in between said third split planes (441, 442) to thereby align said first paper (351, 451), planar electronics (352, 452) and second paper (353, 453).

10. A laminated paper product (356, 357, 358) with integrated electronics (352, 452) consisting of:

- a first paper layer (201, 351, 451) with pre-printed bottom surface having a thickness below 250 micron, preferably below 200 micron;

- a planar electronics layer (202, 352, 452) on top of and aligned with said first paper layer (201, 351, 451) having a thickness below 100 micron; and

- a second paper layer (203, 353, 453), on top of and aligned with said first paper layer (201, 351, 451) and said planar electronics layer (202, 352, 452), said second paper layer (203, 353, 453) having a thickness below 250 micron, preferably below 200 micron.

Drawing