ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSK..HRIS..MTNORS..SM..................JBDM Ver 1.7.2 (20 November 2019) - 2999001/03273475CORRECTED EUROPEAN PATENT SPECIFICATIONB8B120210818W173deBibliographieenBibliographyfrBibliographieEP17173260.5201705292018110620200513enenen201662365402 P20160722US20171549854220170427US2021081820213320180124201804202102172021072020090220210517NO20210217LT20210617PT20210217FI20210818202133H01L 23/552 20060101AFI20200817BHEP H01L 23/66 20060101ALI20200817BHEP H01L 23/538 20060101ALI20200817BHEP H01L 23/31 20060101ALN20200817BHEP H01L 21/60 20060101ALN20200817BHEP deAUSFÄCHERUNGSPACKUNGSSTRUKTURenFAN-OUT PACKAGE STRUCTUREfrSTRUCTURE DE BOÎTIER DE SORTANCEEP-A2- 2 930 742US-A1- 2006 049 995US-A1- 2007 164 418US-A1- 2013 241 059US-A1- 2013 343 022LIN, Min-ChenNo. 74-1, Zhuanjing, Madou Dist.,721 Tainan CityTWCHOU, Che-YaNo. 10, Ln. 296, Ruihe St., Qianzhen Dist.806 Kaohsiung CityTWCHEN, Nan-Cheng5F., No.28, Hubin 2nd Rd., East District300 Hsinchu CityTWMediaTek Inc.101903992M12650EPNo. 1. Dusing 1st Rd. Hsinchu Science ParkHsinchu City 30078TWGoddar, Heinz J.100002032Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 2280336 MünchenDEALATBEBGCHCYCZDEDKEEESFIFRGBGRHRHUIEISITLILTLULVMCMKMTNLNOPLPTRORSSESISKSMTR20180516201820